LED1050-series TECHNICAL DATA Infrared LED InGaAsP LED1050-series are InGaAsP LEDs mounted on a lead frame and encapsulated in various types of epoxy lens, which offers different design settings. On forward bias, it emits a high power radiation of typical 2 mW at a peak wavelength at 1050 nm. Specifications • • • • • Structure: InGaAsP Peak Wavelength: typ. 1050 nm Optical Ouput Power: typ. 2 mW Resin Material: Epoxy resin Solder: Lead free Absolute Maximum Ratings (Ta=25°C) Type Power Dissipation Forward Current Pulse Forward Current Reverse Voltage Operating Temperature Storage Temperature Soldering Temperature (for 5 sec.) Symbol PD IF IFP VR TOP TSTG TSOL Value 140 100 1000 5 -40 … +85 -40 … +100 265 Unit mW mA mA V °C °C °C Electro-Optical Characteristics (Ta=25°C) Item Forward Voltage Reverse Current Radiated Power Peak Wavelength Half Width Rise Time Fall Time 21.11.2011 Symbol VF IR PO λP Δλ tr tf Condition IF = 50 mA VR = 5 V IF = 50 mA IF = 50 mA IF = 50 mA IF = 50 mA IF = 50 mA Min. 1 1000 - LED1050-series Typ. 1.2 2 1050 50 10 10 Max. 1.5 10 1100 - Unit V µA mW nm nm ns ns 1 of 8 Characteristics of Radiant Intensity (Ta=25°C) Type LED1050-01 LED1050-02 LED1050-03 LED1050-04 LED1050-05 LED1050-06 Viewing Half Angle Radiation Intensity (IF = 50 mA) [Unit: mW/sr] Min. Typ. Max. ±10° 14 ±7° 30 LED1050-09 LED1050-46 LED1050-41 LED1050-42 LED1050-31 LED1050-33 LED1050-34 LED1050-36 ±18° 10 ±33° 4 Outer Dimension Dimension Figure Ø5 Ø5 Ø5 Ø5 Ø5 Ø5 Ø5 Oval Ø5 Ø4 Ø4 Ø3 Ø3 Ø3 Ø3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 * Radiant Power is measured by G8370-85 * Brightness is measured by TekTronix J-16 Notes • Do not view directly into the emitting area of the LED during operation! • The above specifications are for reference purpose only and subjected to change without prior notice. 21.11.2011 LED1050-series 2 of 8 Outer Dimensions 21.11.2011 Figure-1 Ø 5Mold (Type 01) Figure-2 Ø 5Mold (Type 02) Figure-3 Ø 5Mold (Type 03) Figure-4 Ø 5Mold (Type 04) Figure-5 Ø 5Mold (Type 05) Figure-6 Ø 5Mold (Type 06) Figure-7 Ø 5Mold (Type 09) Figure-8 Ø 5Mold (Type 46) Figure-9 Ø 4Mold (Type 41) Figure-10 Ø 4Mold (Type 42) LED1050-series 3 of 8 Figure-11 Ø 3Mold (Type 31) Figure-12 Ø 3Mold (Type 33) Figure-13 Ø 3Mold (Type 34) Figure-14 Ø 3Mold (Type 36) Viewing half angle 21.11.2011 Figure-1 Ø 5Mold (Type 01) Figure-2 Ø 5Mold (Type 02) Figure-3 Ø 5Mold (Type 03) Figure-4 Ø 5Mold (Type 04) Figure-5 Ø 5Mold (Type 05) Figure-6 Ø 5Mold (Type 06) LED1050-series 4 of 8 Figure-7 Ø 5Mold (Type 09) Figure-8 Ø 5Mold (Type 46) Figure-9 Ø 4Mold (Type 41) Figure-10 Ø 4Mold (Type 42) Figure-11 Ø 3Mold (Type 31) Figure-12 Ø 3Mold (Type 33) Figure-13 Ø 3Mold (Type 34) Figure-14 Ø 3Mold (Type 36) Typical Performance Curves Forward Current – Forward Voltage 21.11.2011 Relative Radiant Intensity – Pulsed Forward Current LED1050-series 5 of 8 Forward Current – Pulse Duration Forward Voltage – Ambient Temperature Relative Radiant Intensity – Ambient Temperature Allowable Forward Current – Ambient Temperature 21.11.2011 LED1050-series 6 of 8 Peak Wavelength Peak Wavelength – Ambient Temperature Precaution for Use 1. Cautions • DO NOT look directly into the emitted light or look through the optical system. To prevent in adequate exposure of the radiation, wear protective glasses. • The LEDs are emitting invisible light. 2. Lead Forming • When forming leads, the leads should be bent at a point at least 3 mm from the base of the lead. DO NOT use the base of the leadframe as a fulcrum during lead forming. • Lead forming should be done before soldering. • DO NOT apply any bending stress to the base of the lead. The stress to the base may damage the LED’s characteristics or it may break the LEDs. • When mounted the LEDs onto the printed circuit board, the holes on the circuit board should be exactly aligned with the leads of LEDs. If the LEDs are mounted with stress at the leads, it causes deterioration of the lead and it will degrade the LEDs. 21.11.2011 LED1050-series 7 of 8 Recommended Land Layout (Unit: mm) 3. Soldering Conditions • Solder the LEDs no closer than 3 mm from the base of the lead. • DO NOT apply any stress to the lead particularly when heat. • The LEDs must not be reposition after soldering. • After soldering the LEDs, the lead should be protected from mechanical shock or vibration until the LEDs return to room temperature. • When it is necessary to clamp the LEDs to prevent soldering failure, it is important to minimize the mechanical stress on the LEDs. • Cut the LED leads at room temperature. Cutting the leads at high temperature may cause the failure of the LEDs. Soldering Conditions 4. Static Electricity • The LEDs are very sensitive to Static Electricity and surge voltage. So it is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. • All devices, equipment and machinery must be grounded properly. It is recommended that precautions should be taken against surge voltage to the equipment that mounts the LEDs. 21.11.2011 LED1050-series 8 of 8