ROHM BA6908F

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STRUCTURE
Silicon Monolithic Integrated Circuit
PRODUCT SERIES
Single-Phase Full-Wave Motor Driver for Fan Motor
TYPE
BA6908F
FEATURES
Soft switched drive
〇ABSOLUTE MAXIMUM RATINGS
Parameter
Symbol
Limit
Unit
Supply voltage
Vcc
15
V
Power dissipation
Pd
780*
mW
Operating temperature
Topr
-40~+100
℃
Storage temperature
Output current
Tstg
-55~+150
℃
Iomax
0.7**
A
Output voltage
VOUT
15
V
FG signal output current
IFG
15
mA
FG signal output voltage
VFG
15
V
150
℃
Unit
V
V
Tjmax
Junction temperature
*
Reduce by 6.24mW/℃ over 25℃.
(On 70.0mm×70.0mm×1.6mm glass epoxy board)
** This value is not to exceed Pd.
〇OPERATING CONDITIONS
Parameter
Symbol
Operating supply voltage range
Vcc
Limit
2.6~14.0
Hall input voltage range
VH
0~Vcc-2.0
*This product is not designed for production against radioactive rays.
*This document may be strategic data subject to COCOM regulations.
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〇ELECTRICAL CHARACTERISTICS (Unless otherwise specified Ta=25℃,Vcc=5V)
Limit
Parameter
Symbol
Unit
Conditions
Min.
Typ.
Max.
Circuit current
Icc
1.5
3.4
8.7
mA At output OFF
Charge current of capacitor
μA VLD=1.1V
ILDC
1.50
2.75
4.50
for lock detection
Discharge current of
μA VLD=1.1V
ILDD
0.24
0.48
0.90
capacitor for lock detection
Charge-discharge current
ratio of capacitor for lock
rCD
4.2
5.7
9.5
rCD=ILDC/ILDD
detection
Clamp voltage of capacitor
VLDCL
1.14
1.80
2.47
V
for lock detection
Comparison voltage of
VLDCP
0.47
0.76
1.06
V
capacitor for lock detection
Output voltage L
VOL
0.2
0.3
V
Io=200mA
Output voltage H
VOH
3.9
4.1
V
Io=-200mA
FG terminal voltage L
VFGL
0.3
0.5
V
IFG=5mA
FG terminal leak current
μA VFG=15V
IFGL
0
50
Hall input offset voltage
Hofs
-10
10
mV
Hall input-output gain
GHO
320
500
680
〇PACKAGE OUTLINES
5.0±0.2
6908
1
1.5±0.1
0.11
5
0.3Min.
6.2±0.3
4.4±0.2
8
4
Lot No.
0.15±0.1
0.1
1.27
0.4±0.1
SOP 8(UNIT:mm)
〇BLOCK DIAGRAM
〇Terminal name
OUT2
GND
Pin No.
8
1
REG
FG
2
LOCK
DETECTION
AND
AUTO
RESTART
1
2
3
4
5
6
7
8
OUT1
7
LD
H-
3
6
Control
+
-
Vcc
4
+
-
TSD
HALL
AMP
-
+
H+
5
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Terminal
name
OUT2
FG
LD
Vcc
H+
HOUT1
GND
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〇Cautions on use
1) Absolute maximum ratings
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc.,
can break down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open
circuit. If any over rated values will expect to exceed the absolute maximum ratings, consider adding circuit
protection devices, such as fuses.
2) Connecting the power supply connector backward
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power
supply lines. An external direction diode can be added.
3) Power supply line
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing
a capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor
characteristics have no problem before determine a capacitor value. (when applying electrolytic capacitors,
capacitance characteristic values are reduced at low temperatures)
4) GND potential
The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except
GND terminal do not fall below GND voltage including transient characteristics. However, it is possible that the motor
output terminal may deflect below GND because of influence by back electromotive force of motor. Malfunction may
possibly occur depending on use condition, environment, and property of individual motor. Please make fully
confirmation that no problem is found on operation of IC.
5) Thermal design
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating
conditions.
6) Inter-pin shorts and mounting errors
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
7) Actions in strong electromagnetic field
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
8) ASO
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
9) Thermal shut down circuit
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175℃(typ.) and has a
hysteresis width of 25℃(typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes
an open state. TSD circuit is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect
the IC or guarantee its operation. Do not continue to use the IC after operation this circuit or use the IC in an
environment where the operation of this circuit is assumed.
10) Testing on application boards
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to
stress. Always discharge capacitors after each process or step. Always turn the IC’s power supply off before
connecting it to or removing it from a jig or fixture during the inspection process. Ground the IC during assembly
steps as an antistatic measure. Use similar precaution when transporting or storing the IC.
11) GND wiring pattern
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns,
placing a single ground point at the ground potential of application so that the pattern wiring resistance and voltage
variations caused by large currents do not cause variations in the small signal ground voltage. Be careful not to
change the GND wiring pattern of any external components, either.
12) Capacitor between output and GND
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it
is possible that the current charged in the capacitor may flow into the output resulting in destruction. Keep the
capacitor between output and GND below 100uF.
13) IC terminal input
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below
GND is applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic
element causes mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do
not use in a manner where parasitic element is actuated.
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Appendix
Notes
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The content specified herein is subject to change for improvement without notice.
The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you
wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM
upon request.
Examples of application circuits, circuit constants and any other information contained herein illustrate the
standard usage and operations of the Products. The peripheral conditions must be taken into account
when designing circuits for mass production.
Great care was taken in ensuring the accuracy of the information specified in this document. However, should
you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage.
The technical information specified herein is intended only to show the typical functions of and examples
of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to
use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information.
The Products specified in this document are intended to be used with general-use electronic equipment
or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices).
The Products are not designed to be radiation tolerant.
While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or
malfunction for a variety of reasons.
Please be sure to implement in your equipment using the Products safety measures to guard against the
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Appendix-Rev4.0