Data Sheets - Skyworks Solutions, Inc.

DATA SHEET
PIN Diode Chips Supplied on Film Frame
Applications
 Switches
 Attenuators
Features
 Preferred device for module applications
 PIN diodes supplied are 100% tested, saw cut, and mounted on
film frame
 Low cost
Skyworks GreenTM products are compliant with
all applicable legislation and are halogen-free.
For additional information, refer to Skyworks
Definition of GreenTM, document number
SQ04–0074.
Description
The PIN diodes that comprise this family of diodes supplied on
film frames are designed for high-volume applications from
10 MHz to over 3 GHz. This family contains two groups of PIN
diodes:
1. Low-capacitance, low-resistance PIN diodes designed primarily
for RF switching applications:
SMP1320-099
SMP1321-099
SMP1322-099
SMP1331-099
SMP1340-099
2. PIN diodes with thick I-layers designed for low-distortion RF
variable attenuator applications:
SMP1302-099
SMP1304-099
SMP1307-099
These PIN diodes are provided as 100 percent tested, diced
wafers mounted on film frames for optimal compatibility with
high-volume pick-and-place assembly techniques.
Absolute maximum ratings are provided in Table 1. Electrical
specifications are provided in Table 2. Chip dimensions are shown
in Table 3. Typical performance characteristics are illustrated in
Figures 1 through 6. Figure 7 describes the wafer film frame.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200140K • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 20, 2015
1
DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Table 1. PIN Diode Chips Absolute Maximum Ratings (Note 1)
Parameter
Symbol
Minimum
Maximum
Units
Voltage rating
V
Reverse voltage
VR
Power dissipation @ 25 °C at the base of the chip
PD
250
mW
Operating temperature
TOP
–65
+150
°C
Storage temperature
TSTG
–65
+150
°C
Electrostatic discharge:
ESD
1000
V
Human Body Model (HBM), Class 1C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other
parameters set at or below their nominal value.
CAUTION: Although these devices are designed to be as robust as possible, electrostatic discharge (ESD) can damage them. These
devices must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the
human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all
times.
Table 2. PIN Diode Chips Electrical Specifications (Note 1)
(TOP = 25 °C)
I Region
(μm)
Nominal
Part Number
Voltage Rating
(V)
Max CJ
(pF)
VR = 30 V,
f = 1 MHz
Typ VF
(mV)
@ IF = 10 mA
Max RS
(Ω)
IF = 1 mA,
f = 100 MHz
Max RS
(Ω)
IF = 10 mA,
f = 100 MHz
Typ TL
(ns)
IF = 10 mA
Switching Applications
SMP1320-099
7
50
0.175
850
2 typ
0.9
400
SMP1321-099
12
100
0.150
860
3 typ
2.0
400
SMP1322-099
7
50
0.850
825
1.5
0.45 typ
400
SMP1331-099
30
200
0.16
800
14.5
1.7 typ
600
SMP1340-099
5
50
0.15 @ 10 V
880
1.7 typ
1.2
100
Attenuator Applications
SMP1302-099
50
200
0.15
800
17 typ
3
700
SMP1304-099
100
200
0.15
800
50
7
1000
SMP1307-099
175
200
0.20
850
75 typ
15
1500
Note 1: Performance is guaranteed only under the conditions listed in this table.
Reverse current is specified @ 10 μA maximum at the voltage rating. This voltage should not be exceeded.
The PIN diodes listed here are processed on 100 mm silicon wafers, 100% DC tested, saw cut, and shipped on 6-inch film frame hoops.
Electrical rejects are identified with black ink on the film frame.
Attenuators are 100% series resistance tested @ 1 mA/100 MHz.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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August 20, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200140K
DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Table 3. PIN Diode Chip Dimensions
Quantity of Good Diodes Per Wafer
Minimum
Nominal
Chip Size
(In)
Chip Height
(In)
Anode Contact
(In)
SMP1320-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0030 ± 0.0003
SMP1321-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0030 ± 0.0003
SMP1322-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0075 ± 0.0005
SMP1331-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0075 ± 0.0005
SMP1340-099
65000
72000
0.0105 ± 0.001
0.005 ± 0.001
0.0029 ± 0.0003
SMP1302-099
40000
46000
0.0135 ± 0.001
0.005 ± 0.001
0.0085 ± 0.0005
SMP1304-099
40000
46000
0.0135 ± 0.001
0.009 ± 0.001
0.0085 ± 0.0005
SMP1307-099
20000
25000
0.0185 ± 0.001
0.009 ± 0.001
0.0110 ± 0.0005
Part Number
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200140K • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 20, 2015
3
DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Typical Performance Characteristics
(TOP = 25 °C)
1.2
SMP1340
SMP1320
SMP1322
SMP1321
SMP1331
SMP1320
SMP1321
SMP1322
SMP1331
SMP1340
1.0
Capacitance (pF)
100
10
0.8
0.6
0.4
1
0.1
0.1
0.01
1.0
10
0
100
Y2271
0.2
Y2270
Series Resistance (Ω)
1000
0
5
10
20
25
30
Figure 2. Capacitance vs Reverse Voltage
Figure 1. Series Resistance vs Forward Current @ 100 MHz
0.25
10000
SMP1304
0.20
Capacitance (pF)
1000
Series Resistance ()
15
Reverse Voltage (V)
Forward Current (mA)
SMP1302
100
10
1302
0.15
1304
0.10
0.05
1
0
0.1
0.01
0.1
1
10
0
100
5
10
15
20
25
30
Reverse Voltage (V)
Forward Current (mA)
Figure 4. Capacitance vs Reverse Voltage
Figure 3. Series Resistance vs Forward Current @ 100 MHz
10000
Series Resistance ()
Junction Capacitance (pF)
0.6
0.5
0.4
0.3
0.2
1000
100
10
0.1
0
0
5
10
15
20
25
Reverse Voltage (V)
Figure 5. Capacitance vs Reverse Voltage
(SMP1307-099)
30
1
0.01
0.1
1
10
Forward Current (mA)
Figure 6. Series Resistance vs Forward Current
(SMP1307-099)
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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100
DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
0.003 (0.076 mm) Nom.
Separation
Between Die
0.003 (0.076 mm)
Separation
Between Die
5.981 (151.92 mm)
Outer Ring O.D.
5.520 (140.2 mm)
Inner Ring I.D.
3.940 (100 mm)
Wafer Dia.
Grip Ring
0.236 (5.99 mm)
Ring Thickness
 Wafer on nitto tape
 Color: light blue
 Thickness: 2.2 to 3.0 mils
 Tensile strength: 6.6 lbs (in width)
 Ring material: plastic
Figure 7. Wafer Film Frame Description
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
200140K • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • August 20, 2015
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DATA SHEET • PIN DIODE CHIPS SUPPLIED ON FILM FRAME
Copyright © 2002-2008, 2011-2013, 2015 Skyworks Solutions, Inc. All Rights Reserved.
Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by
Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the
information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to
update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.
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Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury,
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damages resulting from such improper use or sale.
Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of
products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for
applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters.
Skyworks and the Skyworks symbol are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for
identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at www.skyworksinc.com, are incorporated by
reference.
Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com
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August 20, 2015 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 200140K