ÿþ7 5 N F 7 5 ( T O 2 2 0

IC
IC
MOSFET
SMDType
Type
DIP
Product specification
40P03
TO-220
(8.70)
2.80 ±0.10
(1.70)
● V DS (V) =-30V,ID =-30 A
4.50 ±0.20
9.90 ±0.20
1.30 ±0.10
■ Features
ø3.60 ±0.10
+0.10
1.30 –0.05
18.95MAX.
(3.70)
(3.00)
9.20 ±0.20
(1.46)
● RDS(ON) < 50mΩ (V G S =-4.5V)
15.90 ±0.20
● RDS(ON) < 28mΩ (V G S =-10V)
1.27 ±0.10
1.52 ±0.10
1 2 3
0.80 ±0.10
2.54TYP
[2.54 ±0.20]
10.08 ±0.30
(1.00)
13.08 ±0.20
(45°)
D
G
S
+0.10
0.50 –0.05
2.40 ±0.20
2.54TYP
[2.54 ±0.20]
10.00 ±0.20
1 GATE
2 DRAIN
3 SOURCE
■ Absolute Maximum Ratings Ta = 25℃
Parameter
Symbol
Rating
Drain-Source Voltage
VD S
-30
Gate-Source Voltage
VGS
±20
Continuous Drain Current
TC=25 ℃
TC=100℃
ID
I DM
-120
Power Dissipation
PD
31.3
Thermal Resistance.Junction- to-Ambient
RthJA
110
Thermal Resistance.Junction- to-Case
Rthc
4
TJ , TSTG
-55 to 150
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V
-30
-18
Pulsed Drain Current
Junction and Storage Temperature Range
Unit
A
W
℃/W
℃
4008-318-123
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IC
IC
IC
MOSFET
MOSFET
SMDType
Type
SMD
Type
DIP
Product specification
40P03
■ Electrical Characteristics Ta = 25℃
Parameter
Symbol
Drain-Source Breakdown Voltage
VDSS
Zero Gate Voltage Drain Current
IDSS
Testconditons
ID=-250μA, V GS=0V
Typ
VGS =0V,
-1
VDS =0V, VGS =±20V
Gate Threshold Voltage
VGS(th)
VDS =VGS ID=-250μA
Static Drain-Source On-Resistance
RDS(On)
-25
-1
Ciss
Output Capacitance
Cos s
Reverse Transfer Capacitance
C rs s
Total Gate Charge
Qg
Gate Source Charge
Q gs
Gate Drain Charge
Q gd
9
12
tr
Turn-Off DelayTime
td(off)
VDS =-10V, ID=-18A
20
915
mΩ
S
1465
pF
280
195
14
VGS=-4.5V, V DS =-24V, ID=-18A
22
nC
3
VGS=-10V, V DS =-15V, RD =0.8Ω,
RG=3.3 Ω, ID=-18A
30
56
Turn-Off Fall Time
tf
Body Diode Reverse Recovery Time
trr
IS=-18A, d I/dt =-100A/ μs
30
Body Diode Reverse Recovery Charge
Q rr
IS=-18A, d I/dt =-100A/ μs
21
Diode Forward Voltage
VSD
IS=-18A,V GS =0V
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V
50
Input Capacitance
td(on)
-3
28
gFS
Turn-On DelayTime
nA
VGS=-4.5V, I D=-10A
Forward Transconductance
μA
±100
VGS=-10V, ID =-18A
VGS=0V, V DS =-25V, f=1MHz
Unit
V
TJ =150℃
IGSS
Turn-On Rise Time
Max
-30
VDS =-30V, VGS =0V
VDS =-24V,
Gate-Body leakage current
Min
ns
57
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nC
-1.2
4008-318-123
V
2 of 4
SMDType
Type
DIP
IC
IC
MOSFET
Product specification
40P03
■ Typical Characteristics
100
120
-10V
-10V
T A = 25 o C
TA=150oC
-7.0V
80
60
-5.0V
-4.5V
40
-7.0V
80
-ID , Drain Current (A)
-ID , Drain Current (A)
100
60
-5.0V
40
-4.5V
20
20
V G = -3.0 V
V G = -3.0 V
0
0
0
2
4
6
8
0
-V DS , Drain-to-Source Voltage (V)
4
6
8
1.6
50
I D = -10 A
T C =25 ℃
I D =-1 8 A
V G =-10V
1.4
40
Normalized RDS(ON)
RDS(ON) (mΩ )
2
-V DS , Drain-to-Source Voltage (V)
30
1.2
1.0
0.8
0.6
20
2
4
6
8
-50
10
0
50
100
150
T j , Junction Temperature ( o C)
-V GS , Gate-to-Source Voltage (V)
v.s. Junction Temperature
2.5
18
15
Normalized -VGS(th) (V)
2.0
-IS(A)
12
o
o
T j =150 C
9
T j =25 C
6
1.5
1.0
0.5
3
0.0
0
0
0.2
0.4
0.6
0.8
1
1.2
1.4
-V SD , Source-to-Drain Voltage (V)
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-50
0
50
100
150
T j , Junction Temperature ( o C)
4008-318-123
3 of 4
IC
IC
MOSFET
SMDType
Type
DIP
Product specification
40P03
■ Typical Characteristics
f=1.0MHz
10000
V DS =- 24 V
I D =-1 8 A
10
8
C (pF)
-VGS , Gate to Source Voltage (V)
12
6
1000
C iss
4
C oss
C rss
2
100
0
0
5
10
15
20
25
1
30
5
9
Q G , Total Gate Charge (nC)
17
21
25
29
1
Normalized Thermal Response (Rthjc)
1000.0
100.0
100us
-ID (A)
13
-V DS , Drain-to-Source Voltage (V)
1ms
10.0
10ms
100ms
1s
DC
T c =25 o C
Single Pulse
1.0
0.1
Duty factor=0.5
0.2
0.1
0.1
0.05
PDM
t
0.02
T
0.01
Duty factor = t/T
Peak Tj = PDM x Rthjc + T C
Single Pulse
0.01
0.1
1
10
100
-V DS , Drain-to-Source Voltage (V)
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0.00001
0.0001
0.001
0.01
0.1
1
t , Pulse Width (s)
4008-318-123
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