Technical Note Rev. 1.00 / September 2015 ZSSC4151 QFN24 Package Dimensions Multi-Market Sensing Platforms Precise and Deliberate ZSSC4151 QFN24 Package Dimensions Contents 1. Introduction .......................................................................................................................................................... 3 2. QFN24 (4x4mm) Package Marking ..................................................................................................................... 3 3. ZSSC4151 Pin Assignments and Layout ............................................................................................................ 3 4. QFN24 (4x4mm) Thermal Resistance Value ...................................................................................................... 5 5. QFN24 (4x4mm) Package Dimensions ............................................................................................................... 6 6. QFN24 (4x4mm) Footprint and Wettable Flank Description ............................................................................... 7 7. Related Documents ............................................................................................................................................. 8 8. Glossary .............................................................................................................................................................. 8 9. Document Revision History ................................................................................................................................. 8 List of Figures Figure 3.1 Pin Layout for the ZSSC4151 ................................................................................................................ 3 Figure 5.1 Dimensions QFN24 (4x4mm) ................................................................................................................ 6 Figure 6.1 Wettable Flank General Concept........................................................................................................... 7 Figure 6.2 Footprint Dimensions for QFN24 with Wettable Flanks ........................................................................ 7 List of Tables Table 2.1 QFN24 Package Marking ...................................................................................................................... 3 Table 3.1 Pin Assignments – QFN24 (4x4mm) ..................................................................................................... 4 Table 5.1 QFN24 Dimensions (4x4mm) ................................................................................................................ 6 Application Note September 9, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is and subject to changes without notice. 2 of 8 ZSSC4151 QFN24 Package Dimensions 1. Introduction The ZSSC4151 Sensor Signal Conditioner IC is available in a RoHS-compliant QFN24 package (4mm x 4mm; wettable flanks). See the ZSSC4151 Feature Sheet for additional options. This document provides details for package dimensions, pin assignments and layout, footprint, board connections, package marking, and thermal resistance. 2. QFN24 (4x4mm) Package Marking Table 2.1 QFN24 Package Marking Top Side st 1 Line Comments 4151 4151E = Product name Line YYWW YY = Year (e.g., 14 for 2014, 15 for 2015, ...); WW = Workweek (e.g., 15) 3 Line XXXXX Last five digits of ZMDI lot number 2 nd rd 3. ZSSC4151 Pin Assignments and Layout Figure 3.1 shows the ZSSC4151 pin assignments and layout. This pin layout enables implementation of the recommended printed circuit board (PCB) design in which the external signals (VDDE, VSSE, and AOUT) are not routed close to or crossing sensitive input signals from the sensor(s). Table 3.1 shows the pin assignments of the QFN24 (4x4mm) package. 17 16 15 14 13 TOP TS1 BRN BOT 18 TS2 Figure 3.1 Pin Layout for the ZSSC4151 19 BRP 12 Package QFN24 (4x4mm) 20 11 The underside of the package (the “exposed pad”) is electrically connected to the potential VSSA. 21 Application Note September 9, 2015 10 ZSSC4151 VSSE AOUT 7 VDDE 24 SCL 8 SDA 23 VSSA 9 VDDA 22 1 2 3 4 5 6 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is and subject to changes without notice. 3 of 8 ZSSC4151 QFN24 Package Dimensions Table 3.1 Pin Assignments – QFN24 (4x4mm) Pin No QFN24 Pin Name 1 VDDA Positive analog supply voltage Internal analog power supply 2 VSSA Negative analog supply voltage Internal analog ground 3 SDA I²C™* data I/O Analog I/O, internal pull-up 4 SCL I²C™ clock Analog input, internal pull-up 5 VDDE Positive external supply voltage Power supply, protected up to ±40V 6 VSSE External ground Ground, protected up to ±40V 7 AOUT Ratiometric analog output and OWI Analog I/O, protected up to ±40V 8 n.c. No connection – unused 9 n.c. No connection – unused 10 n.c. No connection – unused 11 n.c. No connection – unused 12 BRP Positive sensor input Analog input 13 BOT Negative bridge supply voltage Analog I/O 14 BRN Negative sensor input Analog input 15 TS1 External temperature sensor 1 Analog input 16 TOP Positive bridge supply voltage Analog I/O 17 TS2 External temperature sensor 2 Analog input 18 n.c. No connection – unused 19 n.c. No connection – unused 20 n.c. No connection – unused 21 n.c. No connection – unused 22 n.c. No connection – unused 23 n.c. No connection – unused 24 n.c. No connection – unused 25 EPad Description Exposed pad – internally connected to VSSA Notes Ground – should be shorted externally to VSSA (pin 2) * 2 I C™ is a trademark of NXP. Application Note September 9, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is and subject to changes without notice. 4 of 8 ZSSC4151 QFN24 Package Dimensions 4. QFN24 (4x4mm) Thermal Resistance Value The QFN24 (4x4mm) package has a junction-to-ambient JA of 31.8 °C/W. θJA has been simulated in accordance to following JEDEC-standards: Test Board Design as per JESD51-7. Natural Convection Test Conditions as per JESD51-2. Parameter Thermal Resistance – junction to ambient Application Note September 9, 2015 Symbol Value Unit JA 31.8 °C/W © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is and subject to changes without notice. 5 of 8 ZSSC4151 QFN24 Package Dimensions 5. QFN24 (4x4mm) Package Dimensions Figure 5.1 and Table 5.1 show the package drawing and parameters for the ZSSC4151 QFN24 (4x4mm) package based on JEDEC MO-220. Dimensions are in millimeters. Figure 5.1 Dimensions QFN24 (4x4mm) Table 5.1 QFN24 Dimensions (4x4mm) Dimension Limit MIN A 0.80 0.90 A1 0.00 0.05 b 0.20 0.30 e NOM MAX 0.50 HD 3.90 4.10 HE 3.90 4.10 L 0.30 0.50 Application Note September 9, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is and subject to changes without notice. 6 of 8 ZSSC4151 QFN24 Package Dimensions 6. QFN24 (4x4mm) Footprint and Wettable Flank Description Figure 6.1 illustrates the general concept of the wettable flank (side plating) allows automatic optical inspection. Figure 6.1 Wettable Flank General Concept (© 2014 UTAC – Illustration used with permission from UTAC.) Figure 6.2 illustrates a suggested footprint for PCB designs using the ZSSC4151 QFN24 (4x4mm) package. The exposed area of the landing pattern is 0.25mm from the unit edge. The stencil opening excess is approximately 0.2mm from the landing pattern. ZMDI will also provide electronic data on its website (www.zmdi.com/ssc-tools). Figure 6.2 Footprint Dimensions for QFN24 with Wettable Flanks (© 2014 UTAC – Illustration used with permission from UTAC.) Application Note September 9, 2015 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is and subject to changes without notice. 7 of 8 ZSSC4151 QFN24 Package Dimensions 7. Related Documents Note: X_xy refers to the current revision of the document. Document File Name ZSSC4151 Data Sheet ZSSC4151_Data_Sheet_Rev_X_xy.pdf ZSSC4151 Feature Sheet ZSSC4151_Feature_Sheet_Rev_X_xy.pdf ZSSC4151 Functional Description ZSSC4151_Functional_Description_Rev_X_xy.pdf ZSSC4151 Application Note—Power Management ZSSC4151_Power_Management_Rev_X_xy.pdf Visit the ZSSC415x product page www.zmdi.com/zssc415x on ZMDI’s website at www.zmdi.com or contact your nearest sales office for the latest version of these documents. 8. Glossary Term Description PCB Printed Circuit Board QFN Quad Flat No Leads Package SSC Sensor Signal Conditioner 9. Document Revision History Revision Date Description 1.00 September 9, 2015 First release. Sales and Further Information www.zmdi.com [email protected] Zentrum Mikroelektronik Dresden AG Global Headquarters Grenzstrasse 28 01109 Dresden, Germany ZMD America, Inc. 1525 McCarthy Blvd., #212 Milpitas, CA 95035-7453 USA Central Office: Phone +49.351.8822.306 Fax +49.351.8822.337 USA Phone 1.855.275.9634 Phone +1.408.883.6310 Fax +1.408.883.6358 European Technical Support Phone +49.351.8822.7.772 Fax +49.351.8822.87.772 DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are subject to change without notice. Zentrum Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise. European Sales (Stuttgart) Phone +49.711.674517.55 Fax +49.711.674517.87955 Application Note September 9, 2015 Zentrum Mikroelektronik Dresden AG, Japan Office 2nd Floor, Shinbashi Tokyu Bldg. 4-21-3, Shinbashi, Minato-ku Tokyo, 105-0004 Japan ZMD FAR EAST, Ltd. 3F, No. 51, Sec. 2, Keelung Road 11052 Taipei Taiwan Phone +81.3.6895.7410 Fax +81.3.6895.7301 Phone +886.2.2377.8189 Fax +886.2.2377.8199 Zentrum Mikroelektronik Dresden AG, Korea Office U-space 1 Building Unit B, 906-1 660, Daewangpangyo-ro Bundang-gu, Seongnam-si Gyeonggi-do, 463-400 Korea Phone +82.31.950.7679 Fax +82.504.841.3026 © 2015 Zentrum Mikroelektronik Dresden AG — Rev. 1.00 All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner. The information furnished in this publication is and subject to changes without notice. 8 of 8