Application Note

Application Note
Rev. 1.01 / May 2012
ZSSC3026
Application Circuits
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
Table of Contents
1
2
Application Circuits........................................................................................................................................ 3
1.1.
Application Circuit for Custom-Sensor-Module’s Typical Operation ...................................................... 3
1.2.
Application Circuit for Custom-Sensor-Module’s MTP / Memory Programming .................................... 4
1.3.
Application Circuit for ZSSC3026 in PQFN24 (I C) ............................................................................... 5
1.4.
Application Circuit for ZSSC3026 in PQFN24 (SPI)............................................................................... 6
2
Die Dimensions and Pin Assignments .......................................................................................................... 7
2.1.
Die Properties......................................................................................................................................... 7
2.2.
Package (PQFN24) Properties............................................................................................................... 9
3
Related Documents..................................................................................................................................... 11
4
Document Revision History......................................................................................................................... 11
Table of Figures
Figure 1.1
ZSSC3026-Module: Typical Sensor Application. ............................................................................ 3
Figure 1.2
ZSSC3026-Module: Increased Requirements for Programming..................................................... 4
Figure 1.3
ZSSC3026-PQFN24: Typical Operation and/or Programming in I²C-Setup. .................................. 5
Figure 1.4
ZSSC3026-PQFN24: Typical Operation and/or Programming in SPI-Setup. ................................. 6
Figure 2.1
ZSSC3026 Pad Placement for Die-Bond. ....................................................................................... 7
Figure 2.3
General PQFN24 Package Dimensions. ......................................................................................... 9
List of Tables
Table 2.1
Die Size & Geometry. ...................................................................................................................... 8
Table 2.2
Pad Assignments............................................................................................................................. 8
Table 2.4
Physical Package Dimensions’ Extrema. ........................................................................................ 9
Table 2.5
Pin Assignments PQFN24............................................................................................................. 10
Preliminary
May 18, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
2 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
1
Application Circuits
This document shall support the application of the ZSSC3026 in standard or custom sensor configuration.
General application circuits for typical operation and programming are provided.
1.1.
Application Circuit for Custom-Sensor-Module’s Typical Operation
In the following, the typical operating configuration for ZSSC3026 die together with an arbitrary resistive bridgetyped sensor is shown being interfaced via I²C/SPI. A DC-supply (VDD = 1.8V … 3.6V with capabilities for
IDD > 1.1mA) is required and the respective pull-up functionality on the I²C interface line, SDA (not required if
SPI interface communication is intended). The connection to EOC is optional. IC supply voltage and the high
level of the communication lines need to be the same (VDD).
Figure 1.1 ZSSC3026-Module: Typical Sensor Application.
Preliminary
May 18, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
3 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
1.2.
Application Circuit for Custom-Sensor-Module’s MTP / Memory Programming
For programming the MTP, the internal charge pump of the ZSSC3026 will be used. During switch-on of the
charge pump, a short peak current up to 20mA at VDD is possible. Therefore a buffer capacitor C1 > 1nF or a
fast regulator or just a battery needs to supply the IC at a voltage of VDD > 2.9V. The mean current draw during
programming will be IDD = 5mA…6mA typically. However, this is exactly only needed during programming the
memory.
Figure 1.2 ZSSC3026-Module: Increased Requirements for Programming.
Preliminary
May 18, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
4 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
1.3.
Application Circuit for ZSSC3026 in PQFN24 (I2C)
The configuration for ZSSC3026 in PQFN24 interfaced via I²C is also simple. For typical operations just a poor
DC-supply (VDD = 1.8V … 3.6V) is required and the respective pull-up functionality on the I²C interface line,
SDA. The connection to EOC is optional. IC supply voltage and the high level of the communication lines need
to be the same (VDD).
For programming the MTP, the internal charge pump of the ZSSC3026 will be used. During switch-on of the
charge pump, a short peak current up to 20mA at VDD is possible. Therefore a buffer capacitor C1 > 1nF or a
fast regulator or just a battery needs to supply the IC at a voltage of VDD > 2.9V. The mean current draw during
programming will be IDD = 5mA…6mA typically. However, this is exactly only needed during programming the
memory.
Figure 1.3 ZSSC3026-PQFN24: Typical Operation and/or Programming in I²C-Setup.
Preliminary
May 18, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
5 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
1.4.
Application Circuit for ZSSC3026 in PQFN24 (SPI)
Here, the configuration for ZSSC3026 in PQFN24 interfaced via SPI is shown. For typical operations just a poor
DC-supply (VDD = 1.8V … 3.6V) is required. The connection to EOC is optional. IC supply voltage and the high
level of the communication lines need to be the same (VDD).
For programming the MTP, the internal charge pump of the ZSSC3026 will be used. During switch-on of the
charge pump, a short peak current up to 20mA at VDD is possible. Therefore a buffer capacitor C1 > 1nF or a
fast regulator or just a battery needs to supply the IC at a voltage of VDD > 2.9V. The mean current draw during
programming will be IDD = 5mA…6mA typically. However, this is exactly only needed during programming the
memory.
Figure 1.4 ZSSC3026-PQFN24: Typical Operation and/or Programming in SPI-Setup.
Preliminary
May 18, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
6 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
2 Die Dimensions and Pin Assignments
The ZSSC3026 is available in the forms:
2
• die (chip size with scribe line: 1.5mm ),
• bumped, sawn die on foil and
• PQFN24 package.
See the following figures for additional dimensions and geometry details. The shown outer silicon dimensions are
estimations for a die after sawing with remaining scribe-line silicon of ca. 20um around the core die. Thus, the
effective outer dimensions may differ slightly. ZMDI-test pads must not be bonded or contacted to ensure correct
IC-operation.
2.1.
Die Properties
Figure 2.1 ZSSC3026 Pad Placement for Die-Bond.
Preliminary
May 18, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
7 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
Table 2.1
Die Size & Geometry.
Parameter
MIN [um]
TYP [um]
Description / Remarks
X-dimension
900
925
Y-dimension
1560
1585
79.5
80
including seal ring and remaining “empty” silicon after
sawing; maximum dimensions may be larger for
engineering samples due to wider scribe lines
passivation window’s opening … effective area for bond
connection
200
-
BondPad Size
(X & Y)
Minimum pitch for
application
relevant pads
Table 2.2
Pad Assignments.
Name
Direction
Type
VDD1
VDD2
VSS
VSSB
VDDB
INP
INN
EOC1
EOC2
SEL
SCLK/SCL
MOSI/SDA
MISO
SS
ZMDI-test
Preliminary
May 18, 2012
Center-to-center distance; there are further pads, which
are only for ZMDI’s test purposes
IN
Supply
IN
OUT
OUT
IN
IN
Supply
Analog
Analog
Analog
Analog
OUT
Digital
IN
IN
IN/Out
OUT
IN
-
Digital
Digital
Digital
Digital
Digital
-
Description
IC positive supply voltage for the IC, regular bond pad
IC positive supply voltage for the IC, bump pad (electrically
connected to VDD1, also bondable)
Ground reference voltage signal
Negative bridge supply
Positive bridge supply
Positive bridge signal
Negative bridge signal
End of conversion, regular bond pad
End of conversion, bump pad (electrically connected to EOC1,
also bondable)
I²C or SPI interface select
Clock input for I²C/SPI
Data input for SPI; data in/out for I²C
Data output for SPI
Slave select for SPI
do not connect to these pads
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
8 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
2.2.
Package (PQFN24) Properties
Figure 2.2 General PQFN24 Package Dimensions.
Table 2.3
Physical Package Dimensions’ Extrema.
Parameter / Dimension
Min [mm]
Max [mm]
A
0.80
0.90
A1
0.00
0.05
B
0.18
0.30
e
Preliminary
May 18, 2012
0.5nom
HD
3.90
4.10
HE
3.90
4.10
L
0.35
0.45
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
9 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
Table 2.4
Pin No.
Pin Assignments PQFN24.
Name
*)
Direction
Type
1
2
3
4
5
6
VSS
VSSB
ZMDI-test
INN
ZMDI-test
IN
OUT
IN
-
Supply
Supply
Analog
-
VDDB
OUT
Supply
7
8
9
10
11
12
13
14
15
16
17
18
INP
ZMDI-test
n.c.
n.c.
SCLK/SCL
MOSI/SDA
ZMDI-test
MISO
ZMDI-test
SS
ZMDI-test
IN
IN
IN / OUT
IN
IN
-
Analog
Digital
Digital
Digital
Digital
-
SEL
IN
Digital
EOC
OUT
Digital
n.c.
n.c.
n.c.
n.c.
IN
Supply
19
20
21
22
23
24
VDD
Description
ground reference voltage signal
sensor bridge's ground
do not connect
negative bridge signal
do not connect
sensor bridge’s supply (driven from the IC),
Remark: Do not short with VDD!
positive bridge signal
do not connect
clock input for I²C / SPI
data input for SPI, data in/out-line for I²C
do not connect
data output for SPI
do not connect
slave select for SPI
do not connect
I²C or SPI Interface select
(internal pull up, 0…SPI, 1…I2C)
end of conversion … can be used as
“measurement completed” trigger
IC’s supply voltage
*) n.c. stands for not connected / no connection required / not bonded
Preliminary
May 18, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
10 of 11
ZSSC3026 – Application Circuits
Low Power 16 Bit Sensor Signal Conditioner IC
3
Related Documents
Document
File Name
ZSSC3026 Feature Sheet
ZSSC3026_Feature_Sheet_v*.pdf
ZSSC3026 Data Sheet
ZSSC3026_DataSheet_v*.pdf
ZSSC3026 Application Note: Assembly
ZSSC3026_AssemblyInformation_v*.pdf
ZSSC30x6 Evaluation Kit Documentation
ZSSC30x6_EvaluationKit_v*.pdf
ZSSC30x6 Application Note: Calibration
ZSSC30x6_Calibration_v*.pdf
Visit ZMDI’s website www.zmdi.com or contact your nearest sales office for ordering information or the latest
version of these documents.
4
Document Revision History
Revision
Date
Description
th
1.00
March 28 , 2012
1.01
th
May 18 , 2012
First release of Application Circuits’ Notes, ZSSC3026
Minor Corrections
Sales and Further Information
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DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are PRELIMINARY and subject to change without notice. Zentrum
Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true
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Preliminary
May 18, 2012
© 2012 Zentrum Mikroelektronik Dresden AG — Rev. 1.01
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without
the prior written consent of the copyright owner. The information furnished in this publication is subject to changes without notice.
11 of 11