CYStech Electronics Corp. Spec. No. : C208SH Issued Date : 2013.08.26 Revised Date : 2015.06.18 Page No. : 1/7 1A /200V Snubber Damping Rectifier QE Features High current capability Smoothly soft reverse recovery time (trr) Low profile surface mounted package in order to minimize board space Pb-free lead plating and halogen-free package Mechanical data Case : Molded plastic, JEDEC SOD-123. Epoxy : UL94-V0 rated flame retardant Terminals : Plated terminals, solderable per MIL-STD-202 method 208 Polarity : Indicated by cathode band Mounting position : Any Weight : approx. 0.009 gram Symbol Outline QE 2 (Anode) SOD-123 Ordering Information Device QE-0-T1-G Package SOD-123 (Pb-free lead plating and halogen-free package) Shipping 3000 pcs / tape & reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name QE CYStek Product Specification Spec. No. : C208SH Issued Date : 2013.08.26 Revised Date : 2015.06.18 Page No. : 2/7 CYStech Electronics Corp. Absolute Maximum Ratings (TA=25℃, unless otherwise noted) Parameters Repetitive peak reverse voltage RMS voltage Continuous reverse voltage Conditions Single phase half wave, 60Hz @TJ=25°C Single phase half wave, 60Hz @TJ=25°C 8.3ms single half sine-wave superimposed on rated load (JEDEC method) tp≤ 1μs IF=0.5A, IR=1.0A, IRR=0.25A Forward rectified current Repetitive Peak Forward Current Forward surge current Maximum reverse recovery time Storage temperature range Operating junction temperature range Symbol Value Units VRRM 200 V VRMS 140 V VR 200 V IF(AV) 1 A IFRM 1.57 A 6 IFSM A 20 trr 500 Tstg -55~+150 C Tj -55~+150 C ns Thermal Data Parameter Thermal Resistance, Junction-to-case, max Thermal Resistance, Junction-to-ambient, max Symbol Rth,j-c Rth,j-a (Note ) Value 50 250 Unit C/W Note: When mounted on FR-4 PCB with area measuring 10×10 mm Characteristics (TA=25C, unless otherwise noted) Characteristic Reverse Voltage Forward Voltage Reverse Leakage Current Junction Capacitance QE Symbol VR VF 1 VF 2 IR IR CJ Condition IR=100μA IF=100mA IF=500mA VR=200V VR=200V, TA=125C VR=1V, f=1MHz Min. Typ Max. Unit 200 - - V - 2.9 0.95 1.2 100 1 - V nA μA pF CYStek Product Specification Spec. No. : C208SH Issued Date : 2013.08.26 Revised Date : 2015.06.18 Page No. : 3/7 CYStech Electronics Corp. Typical Characteristics Power Derating Curve Forward Current vs Forward Voltage 0.6 Instantaneous Forward Current---IF(mA) 10000 0.5 Power Dissipation(W) 1000 0.4 0.3 0.2 0.1 Pulse width=300μs, 1% Duty cycle 100 125°C, 75°C, 25°C, 0°C, 40°C 10 1 0 0 25 50 75 100 125 150 175 0 200 0.5 1 1.5 2 2.5 3 3.5 4 4.5 Ambient Temperature---TA(℃) Forward Voltage---VF(V) Reverse Leakage Current vs Reverse Voltage Junction Capacitance vs Reverse Voltage 5 10 100 Junction Capacitance---C J(pF) Reverse Leakage Current---IR(nA) Tj=125℃ 10 Tj=75℃ 1 Tj=25℃ 0.1 1 Tj=25℃, f=1.0MHz 0.1 0.01 0 20 40 60 80 100 120 140 160 180 200 Reverse Voltage---VR (V) 0.1 1 10 100 Reverse Voltage---VR(V) Maximum Safe Operating Area IF, Forward Current (A) 100 10 1μs 1 0.1 1ms TA=25°C, Tj=150°C RθJA=250°C/W Single Pulse 0.01 0.001 0.1 QE 1 10 100 VD, Forward Voltage(V) 10ms 100ms DC 1000 CYStek Product Specification CYStech Electronics Corp. Spec. No. : C208SH Issued Date : 2013.08.26 Revised Date : 2015.06.18 Page No. : 4/7 Recommended Soldering Footprint QE CYStek Product Specification CYStech Electronics Corp. Spec. No. : C208SH Issued Date : 2013.08.26 Revised Date : 2015.06.18 Page No. : 5/7 Reel Dimension Carrier Tape Dimension QE CYStek Product Specification CYStech Electronics Corp. Spec. No. : C208SH Issued Date : 2013.08.26 Revised Date : 2015.06.18 Page No. : 6/7 Recommended wave soldering condition Product Pb-free devices Peak Temperature 260 +0/-5 C Soldering Time 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Average ramp-up rate (Tsmax to Tp) Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) Time maintained above: −Temperature (TL) − Time (tL) Peak Temperature(TP) Time within 5C of actual peak temperature(tp) Ramp down rate Time 25 C to peak temperature Sn-Pb eutectic Assembly Pb-free Assembly 3C/second max. 3C/second max. 100C 150C 60-120 seconds 150C 200C 60-180 seconds 183C 60-150 seconds 240 +0/-5 C 217C 60-150 seconds 260 +0/-5 C 10-30 seconds 20-40 seconds 6C/second max. 6 minutes max. 6C/second max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface. QE CYStek Product Specification CYStech Electronics Corp. Spec. No. : C208SH Issued Date : 2013.08.26 Revised Date : 2015.06.18 Page No. : 7/7 SOD-123 Dimension Marking: QE 2-Lead SOD-123 Plastic Surface Mounted Package CYStek Package Code: SH Inches Min. Max. 0.102 0.110 0.059 0.067 0.041 0.049 DIM A B C Millimeters Min. Max. 2.600 2.800 1.500 1.700 1.050 1.250 Style: Pin 1.Cathode 2.Anode DIM D E Inches Min. Max. 0.018 0.026 0.140 0.152 Millimeters Min. Max. 0.450 0.650 3.550 3.850 Notes: 1.Controlling dimension : millimeters. 2.Lead thickness specified per L/F drawing with solder plating. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: Lead: Pure tin plated. Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0. Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. QE CYStek Product Specification