uPG2318T5N DS

DATA SHEET
GaAs HBT INTEGRATED CIRCUIT
μPG2318T5N
ED
2.4 GHz SINGLE BAND POWER AMPLIFIER FOR W-LAN
DESCRIPTION
The μPG2318T5N is a GaAs HBT MMIC power amplifier for 2.4 GHz band wireless LAN.
This device realizes high efficiency, high gain and high output power by using InGaP HBT.
IN
U
This device is housed in a 6-pin plastic TSON (Thin Small Out-line Non-leaded) package, and is suitable
for high-density surface mounting.
FEATURES
• Operating frequency
: fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.)
• Control voltage
: Venable = 0 to 3.0 V (2.8 V TYP.)
• Supply voltage
: VCC1, 2 = 3.0 to 4.6 V (3.3 V TYP.)
• Circuit current
: ICC = 120 mA TYP. @ VCC1, 2 = 3.3 V, Venable = 2.8 V,
Pout = +18 dBm (at OFDM modulation : 64QAM/54 Mbps)
: GP = 28 dB TYP. @ VCC1, 2 = 3.3 V, Venable = 2.8 V,
NT
• Power gain
Pout = +18 dBm (at OFDM modulation : 64QAM/54 Mbps)
• Gain flatness
: ΔGP = 0.8 dB TYP. @ f = 2.4 to 2.5 GHz, VCC1, 2 = 3.3 V, Venable = 2.8 V,
• Error vector magnitude
• Harmonics
Pout = +18 dBm (at OFDM modulation : 64QAM/54 Mbps)
: EVM = 2.5% TYP. @ VCC1, 2 = 3.3 V, Venable = 2.8 V,
Pout = +18 dBm (at OFDM modulation : 64QAM/54 Mbps)
: 2f0 = 30 dBc TYP. @ VCC1, 2 = 3.3 V, Venable = 2.8 V,
SC
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Pout = +18 dBm (at OFDM modulation : 64QAM/54 Mbps)
• High-density surface mounting : 6-pin plastic TSON package (1.5 × 1.5 × 0.37 mm)
APPLICATIONS
• Power Amplifier for 802.11b/g
• 2.4 GHz ISM Band Transceivers
ORDERING INFORMATION
Order Number
μPG2318T5N-E2
μPG2318T5N-E2-A
DI
Part Number
Package
6-pin plastic TSON
(Pb-Free)
Marking
G5G
Supplying Form
• Embossed tape 8 mm wide
• Pin 1, 6 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: μPG2318T5N-A
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all products and/or types are available in every country. Please check with an NEC Electronics
sales representative for availability and additional information.
Document No. PG10668EJ02V0DS (2nd edition)
Date Published July 2007 NS
The mark <R> shows major revised points.
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.
2007
μPG2318T5N
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
2
3
G5G
1
(Bottom View)
(Top View)
Bias Circuit
6
6
2
5
5
3
4
4
6
1
5
4
1
Pin No.
Pin Name
1
Venable
2
INPUT
3
VCC1
4
OUTPUT
5
VCC2
6
Vdet
ED
(Top View)
2
3
Remark Exposed pad : GND
Parameter
IN
U
ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
Symbol
Supply Voltage
VCC1, 2
Control Voltage
Venable
Pin
Power Dissipation
PD
Operating Ambient Temperature
TA
Storage Temperature
Tstg
Unit
5.0
V
4.0
V
+10
dBm
500
mW
Note
−45 to +85
°C
−55 to +150
°C
NT
Input Power
Ratings
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
fopt
2 400
2 450
2 500
MHz
Supply Voltage
VCC1, 2
3.0
3.3
4.6
V
Control Voltage
Venable
0
2.8
3.0
V
DI
SC
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Operating Frequency
2
Data Sheet PG10668EJ02V0DS
μPG2318T5N
ELECTRICAL CHARACTERISTICS
(TA = +25°C, f = 2 400 to 2 500 MHz, OFDM modulation : 64QAM/54 Mbps, VCC1, 2 = 3.3 V,
Venable = 2.8 V, external input and output matching, unless otherwise specified)
Symbol
Test Conditions
ICC
Pout = +18 dBm
Power Gain
GP
Pout = +18 dBm
Gain Flatness
ΔGP
Pout = +18 dBm
Control Current
Ienable
Pout = +18 dBm
Error Vector Magnitude
EVM
Pout = +18 dBm
Input Return Loss
RLin
Pout = −30 dBm (no-modulation)
Output Return Loss
RLout
Pout = −30 dBm (no-modulation)
TYP.
MAX.
Unit
−
120
140
mA
25.5
28
−
dB
−
0.8
1.3
dB
−
3.2
−
mA
−
2.5
−
%
−
15
−
dB
−
5
−
dB
IN
U
Circuit Current
MIN.
ED
Parameter
2f0
Pout = +18 dBm
−
30
−
dBc
3rd Harmonics
3f0
Pout = +18 dBm
−
48
−
dBc
Power Detector Voltage
Vdet
Pout = +18 dBm
−
0.7
−
V
DI
SC
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NT
2nd Harmonics
Data Sheet PG10668EJ02V0DS
3
μPG2318T5N
EVALUATION CIRCUIT
1
100 pF
INPUT
Bias Circuit
6
1 000 pF
2
5
3
4
VCC2
OUTPUT
2.2 nH
IN
U
0.1 μF
2 kΩ
0.1 μF
2.7 nH
VCC1
Vdet
ED
Venable
SC
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NT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
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<R>
4
Data Sheet PG10668EJ02V0DS
μPG2318T5N
–5
7
18
6
15
5
12
4
3
ICC/10
6
EVM
3
0
2
0
5
10
1
15
20
0
25
30
POWER GAIN, CIRCUIT CURRENT,
EVM vs. OUTPUT POWER
27
10
8
7
21
6
18
5
15
12
4
ICC/10
9
3
2
6
3
0
EVM
0
5
10
3
–20
–25
–30
2
2f0
–35
–40
15
Vdet
–45
0
5
10
15
20
2f0, CONTROL CURRENT, Vdet,
vs. OUTPUT POWER
0
f = 2.40 GHz
2.45 GHz
2.50 GHz
–5
NT
9
GP
24
4
1
0
25
Output Power Pout (dBm)
SC
O
Power Gain GP (dB), Circuit Current ICC/10 (mA)
Output Power Pout (dBm)
Ienable
–15
–50
5
f = 2.40 GHz
2.45 GHz 1
2.50 GHz
0
20
25
–10
Ienable
–15
–20
5
4
3
–25
2f0
–30
2
–35
–40
1
–45
–50
Vdet
0
Output Power Pout (dBm)
5
10
15
20
Control Current Ienable (mA),
Power Detector Voltage Vdet (V)
9
–10
IN
U
8
21
f = 2.45 GHz
Control Current Ienable (mA),
Power Detector Voltage Vdet (V)
0
9
2f0, CONTROL CURRENT, Vdet,
vs. OUTPUT POWER
ED
GP
24
10
2nd Harmonics 2f0 (dBc)
f = 2.45 GHz
27
2nd Harmonics 2f0 (dBc)
30
Error Vector Magnitude EVM (%)
POWER GAIN, CIRCUIT CURRENT,
EVM vs. OUTPUT POWER
Error Vector Magnitude EVM (%)
Power Gain GP (dB), Circuit Current ICC/10 (mA)
TYPICAL CHARACTERISTICS 1
(TA = +25°C, VCC1, 2 = 3.3 V, Venable = 2.8 V, OFDM modulated signal : 64QAM/54 Mbps, with external
input and output matching circuits, unless otherwise specified)
0
25
Output Power Pout (dBm)
DI
Remark The graphs indicate nominal characteristics.
Data Sheet PG10668EJ02V0DS
5
μPG2318T5N
TYPICAL CHARACTERISTICS 2
(TA = +25°C, f = 2.45 GHz, OFDM modulated signal : 64QAM/54 Mbps, with external input and
output matching circuits, unless otherwise specified)
7
18
6
15
5
12
4
3
6
3
0
2
Venable = 2.7 V
2.8 V 1
2.9 V
0
20
25
EVM
5
10
15
POWER GAIN, EVM vs. OUTPUT POWER
9
GP
24
8
7
21
6
18
5
15
12
4
EVM
9
3
2
SC
O
6
3
0
5
10
15
15
7
5
ICC/10
12
9
6
4
Vdet
3
0
5
10
15
20
CIRCUIT CURRENT, Vdet,
vs. OUTPUT POWER
30
Venable = 2.8 V
27
VCC = 3.0 V
3.3 V 1
4.2 V
0
20
25
VCC = 3.0 V
3.3 V
4.2 V
24
21
3
2
1
0
25
7
5
ICC/10
12
4
3
9
6
2
Vdet
3
5
DI
Remark The graphs indicate nominal characteristics.
Data Sheet PG10668EJ02V0DS
9
6
15
0
10
8
18
Output Power Pout (dBm)
6
8
6
18
NT
27
Power Gain GP (dB)
10
Venable = 2.8 V
21
Output Power Pout (dBm)
Output Power Pout (dBm)
30
24
10
15
1
20
Output Power Pout (dBm)
0
25
Power Detector Voltage Vdet (V)
9
10
9
Venable = 2.7 V
2.8 V
2.9 V
IN
U
8
21
VCC1 = VCC2 = 3.3 V
Power Detector Voltage Vdet (V)
27
Circuit Current ICC/10 (mA)
24
30
9
Circuit Current ICC/10 (mA)
Power Gain GP (dB)
GP
10
Error Vector Magnitude EVM (%)
VCC1 = VCC2 = 3.3 V
27
Error Vector Magnitude EVM (%)
30
CIRCUIT CURRENT, Vdet,
vs. OUTPUT POWER
ED
POWER GAIN, EVM vs. OUTPUT POWER
μPG2318T5N
S-PARAMETERS (Reference Data) –This data is included external matching components–
Condition : TA = +25°C, f = 0.1 to 8.1 GHz, VCC1, 2 = 3.3 V, Venable = 2.8 V, Pin = −30 dBm
S21-FREQUENCY
S11-FREQUENCY
1: –15.41 dB
2: –16.03 dB
3: –14.79 dB
4: –4.39 dB
1
23
0 dB
4
4
10 dB/div
STOP 8.1 GHz
S12-FREQUENCY
START 0.1 GHz
–34.79 dB
–35.02 dB
–34.80 dB
–30.19 dB
0 dB
0 dB
1
4
10 dB/div
SC
O
23
START 0.1 GHz
10 dB/div
STOP 8.1 GHz
S22-FREQUENCY
NT
1:
2:
3:
4:
IN
U
23
START 0.1 GHz
26.08 dB
26.44 dB
25.59 dB
–4.49 dB
ED
0 dB
1:
2:
3:
4:
1
STOP 8.1 GHz
1
23
START 0.1 GHz
1:
2:
3:
4:
–5.13 dB
–4.80 dB
–5.51 dB
–0.66 dB
4
5 dB/div
STOP 8.1 GHz
Remark 1. The graphs indicate nominal characteristics.
2. Marker1 : 2.45 GHz
Marker2 : 2.40 GHz
Marker3 : 2.50 GHz
Marker4 : 4.90 GHz
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<R>
Data Sheet PG10668EJ02V0DS
7
μPG2318T5N
MOUNTING PAD AND SOLDER MASK LAYOUT DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
0.3
0.2
0.5
IN
U
1.0
0.5
0.3
0.5
0.3
ED
MOUNTING PAD
0.3
NT
SOLDER MASK
0.15
0.5
0.475
0.35
0.5
0.25
0.55
SC
O
0.475
0.25
Solder thickness : 0.08 mm
DI
Remark The mounting pad and solder mask layouts in this document are for reference only.
8
Data Sheet PG10668EJ02V0DS
μPG2318T5N
PACKAGE DIMENSIONS
6-PIN PLASTIC TSON (UNIT: mm)
(Top View)
(Bottom View)
(Side View)
1.2±0.1
IN
U
0.5±0.06
0.2+0.07
–0.05
1.5±0.1
ED
0.3±0.07
1.5±0.1
0.2±0.1
0.7±0.1
DI
SC
O
NT
0.37+0.03
–0.05
Data Sheet PG10668EJ02V0DS
9
μPG2318T5N
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
methods and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Preheating time at 120 to 180°C
: 120±30 seconds
Time at temperature of 220°C or higher
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Wave Soldering
Condition Symbol
Peak temperature (molten solder temperature)
IR260
ED
Infrared Reflow
Soldering Conditions
For soldering
: 60 seconds or less
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
Time at peak temperature
: 10 seconds or less
Maximum number of flow processes
: 1 time
Peak temperature (terminal temperature)
: 350°C or below
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
WS260
IN
U
Preheating temperature (package surface temperature) : 120°C or below
Maximum chlorine content of rosin flux (% mass)
Partial Heating
Soldering time (per side of device)
: 0.2%(Wt.) or below
: 3 seconds or less
DI
SC
O
NT
Caution Do not use different soldering methods together (except for partial heating).
10
Data Sheet PG10668EJ02V0DS
HS350
ED
μPG2318T5N
SC
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NT
IN
U
• The information in this document is current as of July, 2007. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all
products and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
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customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To
minimize risks of damage to property or injury (including death) to persons arising from defects in NEC
Electronics products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment and anti-failure features.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
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systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
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"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
DI
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E 02. 11-1
Data Sheet PG10668EJ02V0DS
11
μPG2318T5N
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
ED
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
• Do not burn, destroy, cut, crush, or chemically dissolve the product.
DI
SC
O
NT
IN
U
• Do not lick the product or in any way allow it to enter the mouth.
D
4590 Patrick Henry Drive
Santa Clara, CA 95054-1817
Telephone: (408) 919-2500
Facsimile: (408) 988-0279
UE
Subject: Compliance with EU Directives
CEL certifies, to its knowledge, that semiconductor and laser products detailed below are compliant
with the requirements of European Union (EU) Directive 2002/95/EC Restriction on Use of Hazardous
Substances in electrical and electronic equipment (RoHS) and the requirements of EU Directive
2003/11/EC Restriction on Penta and Octa BDE.
IN
CEL Pb-free products have the same base part number with a suffix added. The suffix –A indicates
that the device is Pb-free. The –AZ suffix is used to designate devices containing Pb which are
exempted from the requirement of RoHS directive (*). In all cases the devices have Pb-free terminals.
All devices with these suffixes meet the requirements of the RoHS directive.
This status is based on CEL’s understanding of the EU Directives and knowledge of the materials that
go into its products as of the date of disclosure of this information.
Lead (Pb)
Mercury
Concentration Limit per RoHS
(values are not yet fixed)
NT
Restricted Substance
per RoHS
< 1000 PPM
Concentration contained
in CEL devices
-A
Not Detected
< 1000 PPM
Not Detected
< 100 PPM
Not Detected
< 1000 PPM
Not Detected
PBB
< 1000 PPM
Not Detected
PBDE
< 1000 PPM
Not Detected
Cadmium
SC
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Hexavalent Chromium
-AZ
(*)
If you should have any additional questions regarding our devices and compliance to environmental
standards, please do not hesitate to contact your local representative.
DI
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