uPG2251T6M

GaAs INTEGRATED CIRCUIT
µPG2251T6M
D
+25 dBm MATCHED POWER AMPLIFIER FOR BluetoothTM Class 1
UE
DESCRIPTION
The µPG2251T6M is a fully matched, +25 dBm GaAs MMIC power amplifier for Bluetooth Class 1.
This device realizes high efficiency, high gain and high output power.
This device is housed in a 12-pin plastic TSQFN (Thin Small Quad Flat Non-leaded) (T6M) package, and is
suitable for high-density surface mounting.
FEATURES
• Operating frequency
: fopt = 2 400 to 2 500 MHz (2 450 MHz TYP.)
: VDD1, 2, 3 = 2.5 to 3.5 V (3.0 V TYP.)
: Vcont = 1.5 to 2.1 V (1.8 V TYP.)
IN
• Supply voltage
• Control voltage
: IDD = 230 mA TYP. @ VDD1, 2, 3 = 3.0 V, Vcont = 1.8 V, Pout = +25 dBm
• Output power
: Pout = +25.0 dBm TYP. @ VDD1, 2, 3 = 3.0 V, Vcont = 1.8 V, Pin = −5 dBm
• Gain control range
: GCR = 70 dB TYP. @ VDD1, 2, 3 = 3.0 V, Vcont = 0 to 1.8 V, Pin = −5 dBm
• High efficiency
: PAE = 47% TYP. @ VDD1, 2, 3 = 3.0 V, Vcont = 1.8 V, Pin = −5 dBm
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• Circuit current
• High-density surface mounting : 12-pin plastic TSQFN (T6M) package (2.0 × 2.0 × 0.37 mm)
APPLICATIONS
TM
• Power Amplifier for Bluetooth Class 1, ZigBee
etc.
ORDERING INFORMATION
Order Number
Package
SC
O
Part Number
µPG2251T6M-E2
µPG2251T6M-E2-A
12-pin plastic TSQFN
(T6M) (Pb-Free)
Marking
2251
Supplying Form
• Embossed tape 8 mm wide
• Pin 10, 11, 12 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark: To order evaluation samples, please contact your nearby sales office.
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Part number for sample order: µPG2251T6M-A
Caution: Observe precautions when handling, because these devices are sensitive to electrostatic discharge.
Document No. PG10783EJ01V0DS (1st edition)
Date Published October 2009 NS
µPG2251T6M
PIN CONNECTIONS AND INTERNAL BLOCK DIAGRAM
12
11
(Top View)
12
10
11
(Bottom View)
10
10
11
12
3
1
8
2
7
3
9
9
8
8
7
7
M/N
5
4
6
5
6
Vcont
1
2
GND
3
GND
4
Pin
5
VDD1
6
VDD2
7
GND
8
GND
9
GND
10
Pout
11
VDD3
12
VDD3
2
3
6
5
4
IN
4
1
UE
2251
2
9
Bias Circuit
M/N
1
Pin Name
D
(Top View)
Pin No.
Remark Exposed pad : GND
Parameter
Supply Voltage
Control Voltage
Circuit Current
Control Current
Input Power
Symbol
Ratings
Unit
VDD1, 2, 3
6.0
V
Vcont
3.0
V
IDD
300
mA
Icont
0.5
mA
Pin
+10
dBm
PD
SC
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Power Dissipation
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ABSOLUTE MAXIMUM RATINGS (TA = +25°C, unless otherwise specified)
600
Note
mW
Operating Ambient Temperature
TA
−40 to +85
°C
Storage Temperature
Tstg
−55 to +150
°C
Note Mounted on double-sided copper-clad 50 × 50 × 1.6 mm epoxy glass PWB, TA = +85°C
RECOMMENDED OPERATING RANGE (TA = +25°C, unless otherwise specified)
Parameter
Symbol
MIN.
TYP.
MAX.
Unit
fopt
2 400
2 450
2 500
MHz
Supply Voltage
VDD1, 2, 3
2.5
3.0
3.5
V
Control Voltage
Vcont
1.5
1.8
2.1
V
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Operating Frequency
2
Data Sheet PG10783EJ01V0DS
µPG2251T6M
ELECTRICAL CHARACTERISTICS (TA = +25°C, VDD1, 2, 3 = 3.0 V, Vcont = 1.8 V, f = 2.4 to 2.5 GHz,
unless otherwise specified)
Symbol
Test Conditions
MIN.
TYP.
MAX.
Unit
230
265
mA
IDD
Pin = −5 dBm
−
Output Power 1
Pout1
Pin = −5 dBm
+23
Output Power 2
Pout2
Vcont = 0 V, Pin = −5 dBm
−
Gain Control Range
GCR
Vcont = 0 to 1.8 V, Pin = −5 dBm
−
Efficiency
PAE
Pin = −5 dBm
2nd Harmonics
2f0
Pin = −5 dBm
3rd Harmonics
3f0
Pin = −5 dBm
Input Return Loss
RLin
Pin = −30 dBm
Output Return Loss
RLout
Pin = −30 dBm
−
dBm
−45
−30
dBm
70
−
dB
−
47
−
%
−
−35
−
dBc
−
−30
−
dBc
−
−5
−
dB
−
−10
−
dB
IN
EVALUATION CIRCUIT
+25
UE
Circuit Current
D
Parameter
Pout
VDD3
0.1µF
NT
6.8 nH
12
11
10
M/N
1
2
SC
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390 pF
Bias Circuit
Vcont
DI
3
9
8
7
M/N
4
5
6
2.2 nH
0.1µF
0.1µF
Pin
VDD1
VDD2
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Data Sheet PG10783EJ01V0DS
3
µPG2251T6M
240
30
200
IDD
25
160
Pout
20
120
15
80
10
40
PAE
5
0
–30
0
–25
–20
–15
–10
Input Power Pin (dBm)
–5
–40
0
–25
–30
2f0
–35
–40
3f0
–45
–50
–55
–30
–25
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Remark The graphs indicate nominal characteristics.
4
D
280
Gain
35
–20
–20
–15
IN
Output Power Pout (dBm), Gain (dB)
40
2ND HARMONICS, 3RD HARMONICS
vs. INPUT POWER
UE
320
45
Circuit Current IDD (mA), Efficiency PAE (%)
OUTPUT POWER, GAIN, CIRCUIT
CURRENT, PAE vs. INPUT POWER
2nd Harmonics 2f0 (dBc), 3rd Harmonics 3f0 (dBc)
TYPICAL CHARACTERISTICS (TA = +25°C, VDD1, 2, 3 = 3.0 V, Vcont = 1.8 V, f = 2.45 GHz, unless
otherwise specified)
Data Sheet PG10783EJ01V0DS
–10
–5
Input Power Pin (dBm)
0
5
µPG2251T6M
S-PARAMETERS
Condition : TA = +25°C, VDD1, 2, 3 =3.0 V, Vcont = 1.8 V, Pin = −30 dBm
S12-FREQUENCY
D
S11-FREQUENCY
1: –4.3 dB
2: –4.4 dB
1: –56.8 dB
2: –53.6 dB
3: –4.8 dB
4: –1.2 dB
3: –51.9 dB
4: –42.5 dB
0 dB
13
4
UE
0 dB
2
2
STOP 8.1 GHz
S21-FREQUENCY
2
1:
2:
3:
4:
S22-FREQUENCY
35.9 dB
35.5 dB
34.8 dB
–22.2 dB
NT
1 3
STOP 8.1 GHz
IN
START 0.1 GHz
4
1 3
START 0.1 GHz
1: –15.2 dB
2: –17.0 dB
3: –15.0 dB
4: –2.0 dB
0 dB
0 dB
2
4
1 3
SC
O
4
START 0.1 GHz
STOP 8.1 GHz
START 0.1 GHz
STOP 8.1 GHz
Remarks 1. The graphs indicate nominal characteristics.
DI
2. Maker 1 : 2.4 GHz, 2 : 2.45 GHz, 3 : 2.5 GHz, 4 : 4.9 GHz
Data Sheet PG10783EJ01V0DS
5
µPG2251T6M
MOUNTING PAD LAYOUT DIMENSIONS
12-PIN PLASTIC TSQFN (T6M) (UNIT: mm)
1.15
0.77
0.5
1.15
0.77
0.77
1.15
IN
12–0.23
0.5
0.94
0.5
UE
1.15
0.77
0.5
D
MOUNTING PAD
0.94
Remark The mounting pad layout in this document is for reference only.
NT
When designing PCB, please consider workability of mounting, solder joint reliability, prevention of solder
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SC
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bridge and so on, in order to optimize the design.
6
Data Sheet PG10783EJ01V0DS
µPG2251T6M
PACKAGE DIMENSIONS
12-PIN PLASTIC TSQFN (T6M) (UNIT: mm)
0.37+0.03
–0.05
IN
2.0±0.1
UE
D
2.0±0.1
(Bottom View)
A
0.94±0.1
NT
0.50±0.06
SC
O
A
0.11 MIN.
0.23+0.07
–0.05
(C 0.17)
0.23±0.1
0.94±0.1
Remark A > 0
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( ): Reference value
Data Sheet PG10783EJ01V0DS
7
µPG2251T6M
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions.
For soldering
methods and conditions other than those recommended below, contact your nearby sales office.
Infrared Reflow
Soldering Conditions
Peak temperature (package surface temperature)
: 260°C or below
Time at peak temperature
: 10 seconds or less
Time at temperature of 220°C or higher
: 60 seconds or less
Maximum number of reflow processes
: 120±30 seconds
: 3 times
Maximum chlorine content of rosin flux (% mass)
: 0.2%(Wt.) or below
Peak temperature (terminal temperature)
: 350°C or below
Soldering time (per side of device)
Maximum chlorine content of rosin flux (% mass)
: 3 seconds or less
: 0.2%(Wt.) or below
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IN
Caution Do not use different soldering methods together (except for partial heating).
8
IR260
UE
Preheating time at 120 to 180°C
Partial Heating
Condition Symbol
D
Soldering Method
Data Sheet PG10783EJ01V0DS
HS350
Bluetooth is a trademark owned by Bluetooth SIG, Inc., U.S.A.
ZigBee is a trademark of Koninklijke Philips Electronics N.V.
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µPG2251T6M
SC
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NT
IN
UE
• The information in this document is current as of October, 2009. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC Electronics data
sheets, etc., for the most up-to-date specifications of NEC Electronics products. Not all products
and/or types are available in every country. Please check with an NEC Electronics sales
representative for availability and additional information.
• No part of this document may be copied or reproduced in any form or by any means without the prior
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may
appear in this document.
• NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from the use of NEC Electronics products listed in this document
or any other liability arising from the use of such products. No license, express, implied or otherwise, is
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.
• Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of a customer's equipment shall be done under the full
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by
customers or third parties arising from the use of these circuits, software and information.
• While NEC Electronics endeavors to enhance the quality and safety of NEC Electronics products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. In addition, NEC
Electronics products are not taken measures to prevent radioactive rays in the product design. When customers
use NEC Electronics products with their products, customers shall, on their own responsibility, incorporate
sufficient safety measures such as redundancy, fire-containment and anti-failure features to their products in
order to avoid risks of the damages to property (including public or social property) or injury (including death) to
persons, as the result of defects of NEC Electronics products.
• NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and
"Specific".
The "Specific" quality grade applies only to NEC Electronics products developed based on a customerdesignated "quality assurance program" for a specific application. The recommended applications of an NEC
Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of
each NEC Electronics product before using it in a particular application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots.
"Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support).
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
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The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to
determine NEC Electronics' willingness to support a given application.
(Note)
(1) "NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its
majority-owned subsidiaries.
(2) "NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as
defined above).
M8E0904E
Data Sheet PG10783EJ01V0DS
9
µPG2251T6M
Caution
GaAs Products
This product uses gallium arsenide (GaAs).
GaAs vapor and powder are hazardous to human health if inhaled or ingested, so please observe
the following points.
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• Follow related laws and ordinances when disposing of the product. If there are no applicable laws
and/or ordinances, dispose of the product as recommended below.
1. Commission a disposal company able to (with a license to) collect, transport and dispose of
materials that contain arsenic and other such industrial waste materials.
2. Exclude the product from general industrial waste and household garbage, and ensure that the
product is controlled (as industrial waste subject to special control) up until final disposal.
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• Do not burn, destroy, cut, crush, or chemically dissolve the product.
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IN
• Do not lick the product or in any way allow it to enter the mouth.