1SMF5920B - 2.5 Watt Zener Diode

1SMF5920B
2.5 Watt Zener Diode in Flat
Lead Package
This complete new line of 2.5 Watt Zener Diodes are offered in
highly efficient micro miniature and space saving surface mount
design. Because of its small size, it is ideal for use in cellular phones,
portable devices, business machines and many other industrial/
consumer applications.
Features
•
•
•
•
•
•
•
•
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Zener Breakdown Voltage: 6.2 V
Low Leakage < 5 mA
ESD Rating of Class 3 (> 16 kV) per Human Body Model
Small Footprint − Footprint Area of 8.45 mm2
Low Profile − Maximum Height of 1.0 mm
Supplied in 8 mm Tape and Reel − 3,000 Units per Reel
Cathode Indicated by Polarity Band
Lead Orientation in Tape: Cathode Lead to Sprocket Holes
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
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PLASTIC SURFACE MOUNT
2.5 WATT ZENER DIODE
6.2 VOLTS
1
2
1: CATHODE
2: ANODE
SOD−123FL
CASE 498
Mechanical Characteristics:
CASE: Void-free, transfer-molded, thermosetting plastic
MARKING DIAGRAM
Epoxy Meets UL 94 V−0
LEAD FINISH: 100% Matte Sn (Tin)
MOUNTING POSITION: Any
1
CATHODE
QUALIFIED MAX REFLOW TEMPERATURE: 260°C
Device Meets MSL 1 Requirements
5Y2M G
G
2
ANODE
5Y2 = Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
1SMF5920BT1G SOD−123FL
(Pb−Free)
Shipping†
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
August, 2014 − Rev. 0
1
Publication Order Number:
1SMF5920B/D
1SMF5920B
MAXIMUM RATINGS
Rating
DC Power Dissipation @ TA = 25°C (Note 1)
Derate above 25°C
Thermal Resistance, Junction−to−Ambient
Thermal Resistance, Junction−to−Lead
Symbol
Value
Unit
°PD°
RqJA
350
2.9
350
°mW
mW/°C
°C/W
RqJL
30
°C/W
°PD
2.5
W
TJ, Tstg
−55 to +150
°C
Maximum DC Power Dissipation (Notes 1 and 2)
Operating and Storage Temperature Range
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Mounted with recommended minimum pad size, PC board FR−4.
2. At lead temperature 75°C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless
otherwise noted, VF = 1.5 V Max. @ IF = 200 mA for all
types)
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
IR
IF
Parameter
Symbol
VRWM
I
VC VBR VRWM
V
IR VF
IT
Working Peak Reverse Voltage
Maximum Reverse Leakage Current @ VRWM
VBR
Breakdown Voltage @ IT
IT
Test Current
IF
Forward Current
VF
Forward Voltage @ IF
IPP
Uni−Directional TVS
ELECTRICAL CHARACTERISTICS (TL = 30°C unless otherwise noted, VF = 1.25 Volts @ 200 mA)
Zener Voltage (Note 3)
VZ @ IZT (Volts)
Device
Device
Marking
Min
Nom
1SMF5920BT1G
5Y2
5.89
6.2
VR
ZZT @ IZT
(Note 4)
(mA)
(V)
5.0
4.0
IZT
IR @ VR
Max
(mA)
6.51
60.5
ZZK @ IZK
(Note 4)
IZK
(W)
(W)
(mA)
2.0
200
1.0
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
3. Zener voltage is measured with the device junction in thermal equilibrium with an ambient temperature of 25°C.
4. Zener Impedance Derivation ZZT and ZZK are measured by dividing the AC voltage drop across the device by the AC current applied. The
specified limits are for IZ(ac) = 0.1 IZ(dc) with the ac frequency = 60 Hz.
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2
1SMF5920B
3.5
100
3
IZ, ZENER CURRENT (mA)
P D , MAXIMUM POWER DISSIPATION (W)
TYPICAL CHARACTERISTICS
2.5
2
TL
1.5
1
10
1
0.5
0
0.1
25
50
75
100
125
150
175
5
6
T, TEMPERATURE (°C)
7
8
9
10
VZ, ZENER VOLTAGE (VOLTS)
Figure 2. VZ
10
8
ZZ , DYNAMIC IMPEDANCE (OHMS)
qVZ, TEMPERATURE COEFFICIENT (mV/°C)
Figure 1. Steady State Power Derating
VZ @ IZT
6
4
2
0
−2
200
IZ(dc) = 1mA
100
70
50
−4
2
4
6
8
10
VZ, ZENER VOLTAGE (VOLTS)
30
20
10
7
5
10 mA
20 mA
3
2
5
12
7
iZ(rms) = 0.1 IZ(dc)
10
20
30
50
VZ, ZENER VOLTAGE (VOLTS)
70
100
Figure 4. Effect of Zener Voltage
Figure 3. Zener Voltage
1k
10,000
TJ = 25°C
iZ(rms) = 0.1 IZ(dc)
500
C, CAPACITANCE (pF)
Z Z , DYNAMIC IMPEDANCE (OHMS)
11
200
100
50
20
10
5
1000
MEASURED @ 0 V BIAS
MEASURED @ 50% VR
100
2
1
0.5 1
6.8 V
2
5
10
20
50 100 200
500
IZ, ZENER TEST CURRENT (mA)
10
1
10
VZ, REVERSE ZENER VOLTAGE (VOLTS)
Figure 6. Capacitance versus Reverse
Zener Voltage
Figure 5. Effect of Zener Current
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3
100
1SMF5920B
PACKAGE DIMENSIONS
SOD−123FL
CASE 498
ISSUE D
q
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH.
4. DIMENSIONS D AND J ARE TO BE MEASURED ON FLAT SECTION
OF THE LEAD: BETWEEN 0.10 AND 0.25 MM FROM THE LEAD TIP.
D
1
2
DIM
A
A1
b
c
D
E
L
HE
q
A1
POLARITY INDICATOR
OPTIONAL AS NEEDED
A
END VIEW
TOP VIEW
q
HE
MILLIMETERS
NOM
MAX
0.95
0.98
0.05
0.10
0.90
1.10
0.15
0.20
1.65
1.80
2.70
2.90
0.75
0.95
3.60
3.80
8°
−
MIN
0.035
0.000
0.028
0.004
0.059
0.098
0.022
0.134
0°
INCHES
NOM
0.037
0.002
0.035
0.006
0.065
0.106
0.030
0.142
−
MAX
0.039
0.004
0.043
0.008
0.071
0.114
0.037
0.150
8°
c
RECOMMENDED
SOLDERING FOOTPRINT*
SIDE VIEW
2X
2X
MIN
0.90
0.00
0.70
0.10
1.50
2.50
0.55
3.40
0°
L
b
2X
BOTTOM VIEW
1.22
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
ÉÉÉÉ
4.20
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
2X
1.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
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specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
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1SMF5920B/D