MIMMK100U160UX

MIMMK100U160UX
1600V 100A thyristor Module
RoHS Compliant
Features
· Isolated Module Package
· Isolation voltage 3000 V
· Three Phase Bridge and a Thyristor
Applications
· Current Stabilized Power Supply
· Switching Power Supply
· Inverter For AC or DC Motor Control
■ Diode
ABSOLUTE MAXIMUM RATINGS
Symbol
TC=25°C unless otherwise specified
Parameter
Test Conditions
Max.
Unit
1600
V
VRRM
Repetitive Reverse Voltage
ID(AV)
Average Forward Current
TC=90°C, moudle
100
A
Non-Repetitive Surge
TJ=45°C, t=10ms, 50Hz, Sine
1200
A
Forward Current
TJ=45°C, t=8.3ms, 60Hz, Sine
1300
A
TJ=45°C, t=10ms, 50Hz, Sine
7.2
KA2s
TJ=45°C, t=8.3ms, 60Hz, Sine
8.4
KA2s
IFSM
I2 t
I2t (For Fusing)
TJ
Junction Temperature
-40 to +150
°C
TSTG
Storage Temperature Range
-40 to +125
°C
Visol
Insulation Test Voltage
3000
V
215
g
AC, 50Hz, t=1min
Weight
ELECTRICAL AND THERMAL CHARACTERISTICS
Symbol
Parameter
IRM
Reverse Leakage Current
VF
Forward Voltage
RθJC
RθCS
Test Conditions
TC=25°C unless otherwise specified
Min.
Typ.
Max.
Unit
VR=1600V
--
--
500
µA
VR=1600V, TJ=125°C
--
--
5
mA
IF=100A
--
1.15
--
V
--
1.1
--
V
IF=100A,
TJ=125°C
Thermal Resistance
per diode
--
--
0.9
°C /W
Junction-to-Case
per module
--
--
0.15
°C /W
Thermal Resistance
per diode
--
--
0.42
°C /W
Case -to-Sink
per module
--
--
0.07
°C /W
MIMMK100U160UX
■ Thyristor
ABSOLUTE MAXIMUM RATINGS
Symbol
Test Condition
VRRM
TC=25°C unless otherwise specified
Value
Unit
1600
V
A
IT(AV)
TC=90 , 180° conduction, half sine wave;
100
ITSM
TJ=45 , t=10ms (50Hz), sine, VR=VRRM;
1500
TJ=45 , t=8.3 ms (60Hz), sine, VR= VRRM;
1650
A
TJ=45 , t=10ms (50Hz), sine, VR=VRRM;
9.1
TJ=45 , t=8.3 ms (60Hz), sine, VR= VRRM;
9.8
KA2s
dV/dt
TJ =125 , exponential to 67% rated VDRM
1000
V/us
dI/dt
TJ =125 , ITM=314A, rated VDRM
150
A/us
VISOL
50Hz, all terminals shorted, t=1s, IISOL≤1mA ;
3000
V~
TJ
Max. junction operating temperature range
-40~125
TSTG
Max. storage temperature range
I2 t
-40~125
℃
Mounting torque(M6)
3 to 5
N·m
Terminal connection torque(M6)
3 to 5
N·m
Terminal connection torque(M4)
1 to 2
N·m
ELECTRICAL AND THERMAL CHARACTERISTICS
Symbol Test Condition
IDRM/IRRM
TJ=125 , VD=VR=1600V;
VTM
ITM=314A, td=10 ms, half sine;
VA=6V, RA=1Ω, Tj=-40°C;
VGT
TC=25°C unless otherwise specified
Min. Typ. Max. Unit
50
1.54
mA
V
4
VA=6V, RA=1Ω;
2.5
VA=6V, RA=1Ω, Tj=125°C;
1.7
VA=6V, RA=1Ω, Tj=-40°C;
270
VA=6V, RA=1Ω;
150
VA=6V, RA=1Ω, Tj=125°C;
80
PGM
tp≤5ms, Tj=125°C;
12
W
PGM(AV)
f=50Hz, Tj=125°C;
3
W
Rthjc
Thermal Resistance , Junction-to-Case
0.3
K/W
RTHCS
Thermal Resistance, Case -to-Sink
0.07
K/W
IGT
V
mA
MIMMK100U160UX
Characteristic curves
1
160
-1
10
TJ =125°C
120
ZthJC (K/W)
Forward Current IF (A)
200
80
0
10-3
TJ =25°C
40
0
0.3
0.6
1.5
1.2
0.9
Duty
0.5
0.2
0.1
0.05
Single Pulse
10-2
10-4 -4
10
1.8
Forward Voltage Drop VF(V)
125
125
100
100
Output Current (A)
150
75
50
25
RTHSA=0.02K/W-Delta R
0.04K/W
0.06K/W
0.08K/W
0.1K/W
75
0.16K/W
0.2K/W
50
25
70
50
100
125
0
150
0
25
Output Current (A)
1
Transient Thermal Impedance ZthJC
Instantaneous On-state Current (A)
TJ=25℃
TJ=125℃
10
TJ =25°C
Per junction
0.5
1
1.5
2
2.5
75
100
125
150
Figure 4. SCR Output Current vs Case Temperature
1000
TJ =125°C
50
Case Temperature (°C)
Figure 3. SCR Output Current vs Power Dissipation
0
1
25
0
0
1
10-1
Figure 2. Diode Thermal Impedance ZthJC
150
100
10-2
Rectangular Pulse Duration (seconds)
Figure1. Diode Forward Voltage Drop vs Forward Current
Power Dissipation (W)
10-3
3
3.5
Steady State Value
(DC Operation)
0.1
0.01
0.001
0.001
0.01
0.1
1
Instantaneous On-state Voltage (V)
Square Wave Pulse Duration (s)
Figure 5. SCR On State Voltage Drop
Figure 6. SCR Thermal Impedance ZthJC
10
MIMMK100U160UX
Instantaneous Gate Voltage (V)
100 Rectangular gate pulse
(1) PGM = 200 W, tp = 300s
(2) PGM = 60 W, tp = 1 ms
(3) PGM = 30 W, tp = 2 ms
(4) PGM = 12 W, tp = 5 ms
a)Recommended load line
for rated di/dt:20V, 20Ω
tr =0.5s, tp≥6 s
b)Recommended load line
10 for ≤30% rated di/dt:15V, (a)
40Ω
(b)
TJ=-40℃
TJ=25℃
TJ=125℃
1
(4)
VGD
0.1
0.001
(2)
(1)
Frequency Limited by PG(AV)
IGD
0.01
(3)
0.1
1
Instantaneous Gate Current (A)
Figure 7. Gate Characteristics
Package Outline (Dimensions in mm)
10
100
1000