Reliability Report

AOS Semiconductor
Product Reliability Report
AOB1404L,
rev A
Plastic Encapsulated Device
ALPHA & OMEGA Semiconductor, Inc
www.aosmd.com
1
This AOS product reliability report summarizes the qualification result for AOB1404L. Accelerated
environmental tests are performed on a specific sample size, and then followed by electrical test
at end point. Review of final electrical test result confirms that AOB1404L passes AOS quality
and reliability requirements. The released product will be categorized by the process family and
be monitored on a quarterly basis for continuously improving the product quality.
Table of Contents:
I.
II.
III.
IV.
Product Description
Package and Die information
Environmental Stress Test Summary and Result
Reliability Evaluation
I. Product Description:
The AOB1404L uses a robust technology that 40V is designed to provide efficient and reliable
power conversion even in the most demanding applications, including motor control. With low
RDS(ON) and excellent thermal capability this device is appropriate for high current switching and
can endure adverse operating conditions.
-RoHS Compliant
-Halogen Free
Details refer to the datasheet.
II. Die / Package Information:
AOB1404L
Standard sub-micron
Low voltage N channel process
Package Type
3 leads TO263
Lead Frame
Bare Cu
Die Attach
Soft solder
Bond wire
Al wire
Mold Material
Epoxy resin with silica filler
Moisture Level
Up to Level 1 *
Note * based on info provided by assembler and mold compound supplier
Process
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III. Result of Reliability Stress for AOB1404L
Test Item
Test Condition
Time
Point
MSL
Precondition
168hr 85°c
/85%RH +3 cycle
[email protected]°c
Temp = 150°c ,
Vgs=100% of
Vgsmax
-
Temp = 150°c ,
Vds=80% of
Vdsmax
168hrs
500 hrs
1000 hrs
1 lot
130 +/- 2°c ,
85%RH, 33.3 psi,
Vgs = 100% of
Vgs max
121°c , 29.7psi,
RH=100%
100 hrs
96 hrs
HTGB
Lot
Attribution
13 lots
168hrs
500 hrs
1000 hrs
HAST
Pressure Pot
Temperature
Cycle
-65°c to 150°c ,
air to air,
250 / 500
cycles
Number
of
Failures
Reference
Standard
1705pcs
0
JESD22A113
77pcs
0
JESD22A108
77 pcs / lot
77pcs
0
JESD22A108
(Note A*)
6 lots
77 pcs / lot
330pcs
0
JESD22A110
(Note A*)
13 lots
55 pcs / lot
715pcs
0
JESD22A102
(Note A*)
55 pcs / lot
0
JESD22A104
1 lot
(Note A*)
HTRB
Total
Sample size
12 lots
(Note A*)
660pcs
55 pcs / lot
Note A: The reliability data presents total of available generic data up to the published date.
IV. Reliability Evaluation
FIT rate (per billion): 23
MTTF = 4957 years
The presentation of FIT rate for the individual product reliability is restricted by the actual burn-in
sample size of the selected product (AOB1404L). Failure Rate Determination is based on JEDEC
Standard JESD 85. FIT means one failure per billion hours.
2
9
9
Failure Rate = Chi x 10 / [2 (N) (H) (Af)] = 1.83 x 10
9
7
MTTF = 10 / FIT = 4.34 x 10 hrs = 4957 years
/ [2x2x77x1000) x258] = 23
Chi² = Chi Squared Distribution, determined by the number of failures and confidence interval
N = Total Number of units from HTRB and HTGB tests
H = Duration of HTRB/HTGB testing
Af = Acceleration Factor from Test to Use Conditions (Ea = 0.7eV and Tuse = 55°C)
Acceleration Factor [Af] = Exp [Ea / k (1/Tj u – 1/Tj s)]
Acceleration Factor ratio list:
55 deg C
70 deg C
85 deg C
100 deg C
115 deg C
Af
258
87
32
13
5.64
Tj s = Stressed junction temperature in degree (Kelvin), K = C+273.16
Tj u =The use junction temperature in degree (Kelvin), K = C+273.16
k = Boltzmann’s constant, 8.617164 X 10-5eV / K
130 deg C
150 deg C
2.59
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