Application Note

VISHAY SEMICONDUCTORS
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Rectifiers
Application Note
Soldering Process Notes
WAVE SOLDERING (THROUGH HOLE ONLY)
Sn-Pb Wave Soldering Profile
Lead (Pb)-free Wave Soldering Profile
235 °C to 260 °C wave temperature
250
300
Maximum temperature
can not exceed 265 °C
for PC board mounting
Second wave
Temperature (°C)
- 5 °C/s
+ 200 °C/s
150
100
+ 2 °C/s
200
235 °C ~ 260 °C
ca. 5 K/s
< 105 °C
to 165 °C
ca. 2 K/s
ca. 2 K/s
150
100 °C ~
130 °C
100
forced
cooling
2 K/s
50
27 °C
0
Second wave
First wave
- 2 °C/s
Preheat zone
50
250
Temperature (°C)
First Wave
200
Full line: Typical
Dotted line: Process limits
10 s
Activation
of Flux
0
0
60
120
Time (s)
180
240
0
50
100
150
200
250
Time (s)
REFLOW PROFILE (SURFACE MOUNT ONLY)
TABLE 1 - Sn-Pb EUTECTIC PROCESS
PACKAGE REFLOW TEMPERATURES
See Table 1 and Table 2
tp
TP
Critical zone
TL to TP
Temperature
Ramp-up
TL
PACKAGE
THICKNESS
VOLUME mm3
< 350
VOLUME mm3
 350
< 2.5 mm
240 + 0/- 5 °C
225 + 0/- 5 °C
 2.5 mm
225 + 0/- 5 °C
225 + 0/- 5 °C
tL
Ts max.
TABLE 2 - LEAD (Pb)-FREE PROCESS
PACKAGE CLASSIFICATION REFLOW
TEMPERATURE
Ts min.
ts
Preheat
PACKAGE
THICKNESS
25
t 25 °C to peak
Time
< 1.6 mm
VOLUME
mm3
< 350
VOLUME
mm3
350 TO 2000
VOLUME
mm3
> 2000
260 + 0 °C (1) 260 + 0 °C (1) 260 + 0 °C (1)
< 1.6 mm to 2.5 mm 260 + 0 °C (1) 250 + 0 °C (1) 245 + 0 °C (1)
 2.5 mm
250 + 0 °C (1) 245 + 0 °C (1) 245 + 0 °C (1)
Note
(1) Tolerance: The device manufacturer/supplier shall assure
process compatibility up to and including the stated
classification temperature at the rated MSL level.
Revision: 19-Oct-11
Document Number: 95418
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
APPLICATION NOTE
Ramp-down
Application Note
www.vishay.com
Vishay Semiconductors
Soldering Process Notes
TABLE 3 - CLASSIFICATION REFLOW PROFILE
PROFILE FEATURE
Sn-Pb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
3 °C/s maximum
3 °C/s maximum
Preheat
- Temperature minimum (Ts min.)
- Temperature maximum (Ts max.)
- Time (min. to max.) (ts)
100 °C
150 °C
60 s to 120 s
150 °C
200 °C
60 s to 180 s
Time maintained above:
- Temperature (TL)
- Time (tL)
183 °C
60 s to 150 s
217 °C
60 s to 150 s
Average ramp-up rate (Ts max. to TP)
Peak temperature
See table 1
See table 2
Time within 5 °C to actual peak temperature (tp)
10 s to 30 s
20 s to 40 s
Ramp-down rate
6 °C/s maximum
6 °C/s maximum
Time 25 °C to peak temperature
6 min maximum
8 min maximum
Note
• All temperatures refer to top side of the package, measured on the package body surface.
HAND SOLDERING (THROUGH HOLE ONLY)
Protection against overheating is essential when a device is being soldered. It is recommended, therefore, that connection
terminals are left as long as possible, are soldered at the tip only, and that any heat generated is quickly conducted away. The
time during which the specified maximum permissible device junction temperature is exceeded during the soldering operation
should be as short as possible, (i.e., for silicon, 260 °C + 5 °C - 0 °C for 10 s maximum). Excessive force on the body or leads
should be avoided during or just after soldering. Do not correct the position of an already soldered device by pushing, pulling
or twisting the body. Prevent fast cooling after soldering. The maximum Iron soldering temperatures are shown in table 4.
TABLE 4 - IRON SOLDERING
IRON TEMPERATURE
SOLDERING DISTANCE FORM THE CASE
MAXIMUM ALLOWABLE SOLDERING TIME
265 °C
1.5 mm to 5 mm
5s
265 °C
> 5 mm
10s
HAND SOLDERING (SURFACE MOUNT ONLY)
The maximum temperature of 260 °C over a period 10 s must not be exceeded during soldering. No aggressive fluxes may be
used. A soldering iron should be used only in exceptional cases (repairs, etc.). A temperature regulated miniature soldering iron
must be used, and care should be taken to avoid touching the component with the tip of the soldering iron. By preheating your
PCB assembly with an air bath you can achieve far lower reflow temperatures than you can without it.
APPLICATION NOTE
Example: The same solder joint that requires a 370 °C (700 °F) soldering iron can be made at only 226 °C (420 °F) if the assembly
is first briefly preheated for just seconds with an air bath. That is a temperature difference of 144 °C (280 °F)
Revision: 19-Oct-11
Document Number: 95418
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000