VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors High Speed Infrared Emitting Diodes, 940 nm, Surface Emitter Technology VSMY2940RG FEATURES VSMY2940G • Package type: surface mount • Package form: GW, RGW • Dimensions (L x W x H in mm): 2.3 x 2.3 x 2.8 • Peak wavelength: λp = 940 nm • High reliability • High radiant power • Very high radiant intensity DESCRIPTION • Angle of half intensity: ϕ = ± 10° As part of the SurfLightTM portfolio, the VSMY2940 series are infrared, 940 nm emitting diodes based on GaAlAs surface emitter chip technology with extreme high radiant intensities, high optical power and high speed, molded in clear, untinted plastic packages (with lens) for surface mounting (SMD). • Suitable for high pulse current operation • Terminal configurations: gullwing or reverse gullwing • Package matches with detector VEMD2000X01 series • Floor life: 4 weeks, MSL 2a, acc. J-STD-020 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 APPLICATIONS • IrDA compatible data transmission • Miniature light barrier • Photointerrupters • Optical switch • Emitter source for proximity sensors • IR touch panels PRODUCT SUMMARY COMPONENT Ie (mW/sr) ϕ (deg) λP (nm) tr (ns) VSMY2940RG 120 ± 10 940 10 VSMY2940G 120 ± 10 940 10 Note • Test conditions see table “Basic Characteristics“ ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM VSMY2940RG Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Reverse gullwing VSMY2940G Tape and reel MOQ: 6000 pcs, 6000 pcs/reel Gullwing Note • MOQ: minimum order quantity Rev. 1.0, 02-Feb-15 Document Number: 84221 1 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL VALUE UNIT VR 5 V Reverse voltage Forward current IF 100 mA Peak forward current tp/T = 0.5, tp = 100 μs IFM 200 mA Surge forward current tp = 100 μs IFSM 1 A PV 190 mW Power dissipation Junction temperature Operating temperature range Tj 100 °C Tamb -40 to +85 °C Storage temperature range Soldering temperature Thermal resistance junction/ambient Tstg -40 to +100 °C acc. figure 10, J-STD-020 Tsd 260 °C J-STD-051, soldered on PCB RthJA 250 K/W 120 200 IF - Forward Current (mA) PV - Power Dissipation (mW) 180 160 140 120 100 RthJA = 250 K/W 80 60 40 100 80 60 RthJA = 250 K/W 40 20 20 0 0 0 21890 10 20 30 40 50 60 70 80 0 90 100 Tamb - Ambient Temperature (°C) Fig. 1 - Power Dissipation Limit vs. Ambient Temperature 10 20 30 40 50 60 70 80 90 100 Tamb - Ambient Temperature (°C) 21891 Fig. 2 - Forward Current Limit vs. Ambient Temperature BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER Forward voltage Temperature coefficient of VF TEST CONDITION SYMBOL TYP. MAX. UNIT IF = 100 mA, tp = 20 ms VF 1.55 1.9 V IF = 1 A, tp = 100 μs VF 2.65 V IF = 100 mA TKVF -2.1 mV/K IR not designed for reverse operation μA VR = 0 V, f = 1 MHz, E = 0 mW/cm2 CJ 125 IF = 100 mA, tp = 20 ms Ie Reverse current Junction capacitance Radiant intensity MIN. 65 120 pF 195 mW/sr IF = 1 A, tp = 100 μs Ie 880 mW/sr IF = 100 mA, tp = 20 ms φe 55 mW IF = 100 mA TKφe -0.2 %/K Peak wavelength IF = 100 mA λp Spectral bandwidth IF = 30 mA Δλ 40 nm Temperature coefficient of λp IF = 30 mA TKλp 0.25 nm/K Rise time IF = 100 mA, 20 % to 80 % tr 10 ns Fall time IF = 100 mA, 20 % to 80 % tf 10 ns Radiant power Temperature coefficient of radiant power ϕ Angle of half intensity Rev. 1.0, 02-Feb-15 ± 10 920 940 deg 960 nm Document Number: 84221 2 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) 1000 Ie - Radiant Intensity (mW/sr) IF - Forward Current (mA) 1000 tp = 100 μs 100 10 1 tp = 100 μs 100 10 1 0.1 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 1 VF - Forward Voltage (V) VF - Forward Voltage (V) IF = 100 mA 1.80 1.70 1.60 1.50 1.40 1.30 20 40 60 80 110 IF = 100 mA 105 100 95 90 85 80 100 -60 -40 -20 Tamb - Ambient Temperature (°C) IF = 100 mA tp = 20 ms 110 105 100 95 90 0 20 40 60 80 100 Tamb - Ambient Temperature (°C) Fig. 5 - Relative Forward Voltage vs. Ambient Temperature Rev. 1.0, 02-Feb-15 20 40 60 80 100 Fig. 7 - Relative Radiant Intensity vs. Ambient Temperature Ie, rel - Relative Radiant Intensity (%) VF, rel - Relative Forward Voltage (%) 120 -60 -40 -20 0 Tamb - Ambient Temperature (°C) Fig. 4 - Forward Voltage vs. Ambient Temperature 115 1000 Fig. 6 - Radiant Intensity vs. Forward Current Ie, rel - Relative Radiant Intensity (%) 1.90 0 100 IF - Forward Current (mA) Fig. 3 - Forward Current vs. Forward Voltage -60 -40 -20 10 100 IF = 100 mA 90 80 70 60 50 40 30 20 10 0 800 850 900 950 1000 1050 λ - Wavelength (nm) Fig. 8 - Relative Radiant Intensity vs. Wavelength Document Number: 84221 3 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com 10° 20° DRYPACK 30° 40° 1.0 50° 0.9 60° 0.8 70° ϕ - Angular Displacement Ie rel - Relative Radiant Intensity 0° Vishay Semiconductors 80° 0.7 0.6 21111 0.4 0.2 0 Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 4 weeks Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 2a, acc. to J-STD-020. DRYING Fig. 9 - Relative Radiant Intensity vs. Angular Displacement SOLDER PROFILE In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. 300 Temperature (°C) max. 260 °C 245 °C 255 °C 240 °C 217 °C 250 200 max. 30 s 150 max. 100 s max. 120 s 100 max. ramp down 6 °C/s 50 max. ramp up 3 °C/s 0 0 19841 50 100 150 200 250 300 Time (s) Fig. 10 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 Rev. 1.0, 02-Feb-15 Document Number: 84221 4 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors PACKAGE DIMENISONS in millimeters: VSMY2940RG Ø 1.8 ± 0.1 0.3 1.6 Z 0.19 2.77 ± 0.2 0.05 ± 0.1 0.4 2.2 2.2 5.8 ± 0.2 exposed copper 1.1 ± 0.1 Z 20:1 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 0.75 anode pin ID 1.7 cathode solder pad proposal acc. IPC 7351 technical drawings according to DIN specifications Not indicated tolerances ± 0.1 Ø 2.3 ± 0.1 6.7 Drawing-No.: 6.544-5391.03-4 Issue: 2; 19.09.14 Rev. 1.0, 02-Feb-15 Document Number: 84221 5 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors PACKAGE DIMENSIONS in millimeters: VSMY2940G Ø 1.8 0.19 1.6 X 0.05 2.77 ± 0.2 0.3 0.4 2.2 2.2 4.2 ± 0.2 X 20:1 exposed copper 0.6 0.75 anode pin ID solder pad proposal acc. IPC 7351 0.254 2.3 ± 0.2 0.4 0.5 2.3 ± 0.2 cathode technical drawings according to DIN specifications Not indicated tolerances ± 0.1 2.45 5.15 Drawing-No.: 6.544-5383.03-4 Issue: 2; 19.09.14 Rev. 1.0, 02-Feb-15 Document Number: 84221 6 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2940RG Reel X unreel direction Ø 13 ± 0.5 Ø 330 ± 1 .5 ±0 Ø 62 ± 0.5 2.5 tape position coming out from reel 6000 pcs/reel technical drawings according to DIN specifications label posted here 12.4 ± 1.5 Leader and trailer tape empty (160 mm min.) parts mounted direction of pulling out Ø 1.55 ± 0.05 I 3.05 ± 0.1 4 ± 0.1 X 2:1 4 ± 0.1 2 ± 0.05 12 ± 0.3 Lead I Lead II Device VEMT2000 Collector Emitter VEMT2500 VEMD2000 VEMD2500 Cathode Anode VSMB2000 VSMG2000 VSMF2890RG VSMY2850RG Anode Cathode VSMY2940RG 5.5 ± 0.05 Terminal position in tape 1.75 ± 0.1 empty (400 mm min.) II Drawing-No.: 9.800-5100.01-4 Issue: 4; 19.09.14 Rev. 1.0, 02-Feb-15 Document Number: 84221 7 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 VSMY2940RG, VSMY2940G www.vishay.com Vishay Semiconductors TAPING AND REEL DIMENSIONS in millimeters: VSMY2940G Reel X unreel direction Ø 13 ± 0.5 Ø 330 ± 1 .5 ±0 Ø 62 ± 0.5 2.5 tape position coming out from reel 6000 pcs/reel technical drawings according to DIN specifications label posted here 12.4 ± 1.5 Leader and trailer tape empty (160 mm min.) parts mounted direction of pulling out Ø 1.55 ± 0.05 Lead I Lead II Cathode Anode Collector Emitter Anode Cathode I 3.05 ± 0.1 4 ± 0.1 X 2:1 4 ± 0.1 2 ± 0.05 12 ± 0.3 Device VSMB2020 VSMG2020 VEMD2020 VEMD2520 VSMF2890G VEMT2020 VEMT2520 VSMY2850G VSMY2940G 5.5 ± 0.05 Terminal position in tape 1.75 ± 0.1 empty (400 mm min.) II Drawing-No.: 9.800-5091.01-4 Issue: 5; 19.09.14 Rev. 1.0, 02-Feb-15 Document Number: 84221 8 For technical questions, contact: [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards. Revision: 02-Oct-12 1 Document Number: 91000