Device Material Content 5555 NE Moore Ct. Hillsboro OR 97124 [email protected] Package: Total Device Weight December, 2012 % of Total Pkg. Wt. Weight (g) Die 1.00% 0.0071 Mold 55.89% 0.3940 D/A Epoxy Wire Solder Balls Substrate 0.16% 0.49% 13.78% 28.69% 256 ftBGA 0.705 Grams with SnAgCu Solder Balls Copper Bond Wire version MSL: 3 % of Total Weight (g) Pkg. Wt. Substance CAS # Silicon chip 7440-21-3 Peak Reflow Temp: 260°C Notes / Assumptions: Die size: 3.35 x 3.35 mm 48.06% 2.51% 1.68% 1.68% 1.68% 0.28% 0.3388 0.0177 0.0118 0.0118 0.0118 0.0020 Silica Fused Epoxy Resin Phenol Resin Phenol Novolac Metal Hydroxide Carbon Black 60676-86-0 9003-35-4 1333-86-4 0.13% 0.03% 0.0009 0.0002 Silver (Ag) Organic esters and resins 7440-22-4 - Mold Compound composition: 75 to 95% Silica Fused (LSC uses 86% in our calculation) 2 to 8% Epoxy resin (LSC uses 4.5% in our calculation) 1 - 5% Phenol resin (LSC uses 3% in our calculation) 1 - 5% Phenol Novolac (LSC uses 3% in our calculation) 1 - 5% Metal Hydroxide (LSC uses 3% in our calculation) 0.1 - 0.5% Carbon Black (LSC uses 0.5% in our calculation) Mold Compound Density ranges between 1.8 and 2.1 grams/cc Die attach epoxy Density: 4 grams/cc 60 to 100% Silver (LSC uses 80% in our calculation) 0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation) 0.48% 0.01% 0.0034 0.0001 Copper (Cu) Palladium (Pd) 7440-50-8 7440-05-3 0.8 mil dia.; 1 wire per solder ball 98.5% Cu 1.5% Pd 13.30% 0.41% 0.07% 0.0937 0.0029 0.0005 Tin (Sn) Silver (Ag) Copper (Cu) 7440-31-5 7440-22-4 7440-50-8 SAC305 96.5% Sn 3% Ag 0.5% Cu 13.10% 3.27% 8.19% 1.36% 0.05% 2.73% 0.0923 0.0231 0.0577 0.0096 0.0004 0.0192 BT Resin CCL-HL832 Copper Solder mask PSR4000 AUS 308 Nickel plating Gold plating Copper thickness in hole 7440-50-8 7440-02-0 7440-57-5 7440-50-8 BT Resin CCL-HL832 45.71% 11.43% 28.57% 4.76% 0.19% 9.52% 0.0011 0.0035 0.0971 0.202 Notes: The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible. Constituent substances and proportions in epoxy materials are before curing. The information provided above is representative of the package as of the date listed, and is subject to change at any time. www.latticesemi.com Rev. K