CSBGA Halogenfree Cuwire132

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124 USA
[email protected]
Package:
Total Device Weight
December, 2012
% of Total
Pkg. Wt.
Weight (g)
Die
6.93%
0.0086
Mold
56.76%
0.0704
D/A Epoxy
Wire
Solder Balls
Substrate
Foil
1.12%
1.44%
11.20%
13.71%
8.84%
132 csBGA
0.124
Grams
with SnAgCu Solder Balls
% of Total
Weight (g)
Pkg. Wt.
Copper Bond Wire version
Halogen Free
MSL: 3
Peak Reflow Temp: 260°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 4.71 x 2.90 mm
49.38%
2.84%
2.84%
1.56%
0.14%
0.0612
0.0035
0.0035
0.0019
0.00018
Silica
Epoxy Resin
Phenol Resin
Metal Hydroxide
Carbon Black
60676-86-0
1333-86-4
0.90%
0.22%
0.0011
0.0003
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
75 to 95% Fused silica filler (LSC uses 87% in our calculation)
2 to 10% Epoxy resin (LSC uses 5% in our calculation)
2 to 10% Phenol resin (LSC uses 5% in our calculation)
0.5 to 5% Metal hydroxide (LSC uses 2.75% in our calculation)
0.1 to 0.5% Carbon Black (LSC uses 0.25% in our calculation)
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 90% Silver (LSC uses 80% in our calculation)
10 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
1.42%
0.02%
0.00176
0.00003
Copper
Palladium
7440-50-8
7440-05-3
Pd coated Copper, 0.8 mil diameter
98.5%
1.5%
10.70%
0.45%
0.06%
0.0133
0.0006
0.0001
Tin (Sn)
Silver (Ag)
Copper (Cu)
7440-31-5
7440-22-4
7440-50-8
Solder ball composition Sn95.5/Ag4/Cu0.5
9.32%
4.39%
0.0116
0.0054
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0014
0.0018
0.0139
0.0170
0.0110
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. K
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