CABGA SNPB Auwire100

Device Material Content
5555 NE Moore Ct.
Hillsboro OR 97124
(503) 268-8000
[email protected]
Package:
Total Device Weight
November, 2009
% of Total
Pkg. Wt.
Weight (g)
Die
3.37%
0.0093
Mold
51.19%
0.1408
D/A Epoxy
0.54%
1.07%
0.0029
Solder Balls
16.31%
0.0449
Foil
21.29%
6.23%
% of Total
Weight (g)
Pkg. Wt.
with SnPb Solder Balls
MSL: 3
Peak Reflow Temp: 240°C
Substance
CAS #
Silicon chip
7440-21-3
Notes / Assumptions:
Die size: 3.53 x 4.17 mm
37.88%
10.24%
0.26%
0.51%
0.51%
1.54%
0.26%
0.1042
0.0282
0.0007
0.0014
0.0014
0.0042
0.0007
Silica
Epoxy/Phenol Resins
Antimony Trioxide
Antimony Pentoxide
Brominated Epoxy Resin
Siloxanes
Carbon Black
60676-86-0
1309-64-4
1314-60-9
1333-86-4
0.44%
0.11%
0.001
0.0003
Silver filled epoxy
Silver (Ag)
Organic esters and resins
7440-22-4
-
Mold Compound composition:
67 to 85% Fused silica filler (LSC uses 74% in our calculation)
15 to 28% Epoxy/Phenol resins (LSC uses 20% in our calculation)
0.1 to 1% Antimony Trioxide (LSC uses 0.5% in our calculation)
1% Antimony Pentoxide (LSC uses 1% in our calculation)
<2% Brominated Epoxy Resin (LSC uses 1% in our calculation)
1 to 5% Siloxanes (LSC uses 3% in our calculation)
0.1 to 1% Carbon Black (LSC uses 0.5% in our calculation)
Mold Compound Density ranges between 1.8 and 2.1 grams/cc
Die attach epoxy Density: 4 grams/cc
60 to 100% Silver (LSC uses 80% in our calculation)
0 to 40% Organic Esters and Resins (LSC uses 20% in our calculation)
Gold (Au)
7440-57-5
0.8 to 1.0 mil diameter; 1 wire per solder ball; wire length 3 mm
0.0015
Wire
Substrate
100 caBGA
0.275
Grams
10.28%
6.04%
0.0283
0.0166
Tin (Sn)
Lead (Pb)
7440-31-5
7439-92-1
Solder ball composition Sn63/Pb37
14.48%
6.81%
0.0398
0.0187
Glass fiber
BT Resins
65997-17-3
-
60 to 75% glass fiber (LSC uses 68% in our calculation)
Copper (Cu)
7440-50-8
0.0586
0.0171
Notes:
The values listed above are nominal values based on studies of representatives of this particular package type, and are believed to be as accurate as possible.
Constituent substances and proportions in epoxy materials are before curing.
The information provided above is representative of the package as of the date listed, and is subject to change at any time.
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Rev. A3
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