Standard H-Bridge Module fastPACK 0 H 2nd gen Features - H-bridge 600V..1200V / 20A..100A Standard- and high speed IGBT´s or MOS-FET Ultra low inductive design Vincotech - Power Flow Through for simple PCB routing Vincotech - Clip In, the reliable interconnection between PCB, module and heatsink Temperature Sensor Easy paralleling to ½ bridge Optional capacitors Copyright by Vincotech Revision:2 fastPACK0-H V23990-P62x-Fxx-U-02-14 Module Types Voltage Current 600V 600V 30A 30A high speed IGBT P623-F04-PM P623-F14-PM high performance 600 V 600 V 60A 60A Trench Fieldstop IGBT P623-F24-PM P624-F24-PM P625-F24-PM 600V 600V 600V 50A 75A 100A Phantom Speed IGBT P629-F44-PM P629-F46-PM hyper fast FRED P629-F54-PM high performance P629-F56-PM high performance + hyper fast FRED 1200V 1200V 1200V 1200V 25A 25A 25A 25A with capacitor: MOS-FET P722-F64-PM P722-F74-PM high performance 600V 600V 30A 30A high speed IGBT P723-F04-PM P723-F14-PM high performance 600 V 600 V 60A 60A Phantom Speed IGBT P729-F44-PM P729-F46-PM hyper fast FRED P729-F54-PM high performance P729-F56-PM high performance + hyper fast FRED 1200V 1200V 1200V 1200V 25A 25A 25A 25A part – number V23990MOS-FET P622-F64-PM P622-F74-PM high performance Copyright by Vincotech Revision:2 fastPACK0-H V23990-P62x-Fxx-U-02-14 Schematics P622 modules: P623, P624, P625, P629 modules: P722 modules: P723, P729 modules: Copyright by Vincotech Revision:2 fastPACK0-H V23990-P62x-Fxx-U-02-14 Outline / Pinout Pin Table Pin 1 X 0 Y 22,5 2 2,9 22,5 3 8,3 22,5 4 10,8 22,5 5 19,6 22,5 6 22,1 22,5 7 29,1 22,5 8 32 22,5 9 33,5 17,8 10 33,5 15,3 Pin X Y 12 33,5 4,7 13 32 0 14 29,1 0 15 22,1 0 16 19,6 0 17 10,8 0 18 8,3 0 19 2,9 0 20 0 0 11 33,5 7,2 Tolerance of p Copyright by Vincotech Revision:2 fastPACK0-H V23990-P62x-Fxx-U-02-14 Handling Instructions PCB x The module must be fixed to the PCB by cliping into the adequate holes before pin soldering. For further details see PCB holes and Mounting in document V23990-P-M111-*-31. x After fixing all pins must be soldered into the PCB. For an appropriate solderprofile for module pins soldering see document, Typical heat profile for wave soldering on page 4 of V23990-P-M111-*-31. x During assembly, at a max. module temperature of 25°C, the pins should not be drawn or pushed over ±0.2 mm or loaded with higher force than 35N. x At a maximum substrate-temperature of 100°C the load of the pin should not exceed ±5N. x Vibration stress on pin is not allowed heatsink x the heatsink surface must be clean and particleless. x the flatness must be < 0.05 mm for 100 mm continuous. x the surface roughness should be less than: RZ 0.01mm. thermal conduction material: x OPTION 1: thermal paste Homogeneous applying of the thermal conductive paste over the whole module bottom with a thickness of max. 0.05 mm. x OPTION 2: thermal foil A thermal foil with a aluminium core layer and two outer layer made of phase change material should be used. The total thichness of the foil has to be less then 0,08mm / 0,003 inch. Thicker foils could cause braking of the ceramic substrate and will increase the thermal resistance. Recommended foil type: Kunze Folien KU-ALC5 or ALF5 Recommended foil dimensions: fastening screws to the heatsink if plain washer is used: x Tighten both screws with the half torque first. x Tighten both screws with max. torque second (if it is possible, tighten after 3 hours again). Flat washer DIN 125 or DIN 433, Screw M4 DIN 7985. fastening screws to the heatsink if plain washer is used together with a spring lock washer (recommended mounting): x Tighten both screws with max. torque. Flat washer DIN 125 or DIN 433, Spring washer DIN127 or DIN 128, Screw M4 DIN 7985. Torque instructions for the heatsink: x Mounting torque Ma =2.0-2.2Nm Copyright by Vincotech Revision:2 fastPACK0-H V23990-P62x-Fxx-U-02-14 PCB holes Copyright by Vincotech Revision:2 fastPACK0-H V23990-P62x-Fxx-U-02-14 Mounting 1. Insert the module pins into the PCB 2. Press one short side of the module gently as shown in figure 1.a. and 1.b. until two clips of that side are locked 3. Press the other side to lock the remaining two clips as shown in fig 2.a. and 2.b. 4. Module in place on PCB fig 3.a. and 3.b Vincotech does not recommend the use of its products for other applications. Especially it is not recommended to use the modules in life support applications where such use may directly threaten life or injure due to device failure or malfunction. We reserve the right to make changes of the product at any time without notice, in order to supply the best possible product. Copyright by Vincotech Revision:2