567DD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP5, 0.86x0.84
CASE 567DD
ISSUE C
SCALE 4:1
ÈÈ
ÈÈ
2X
0.10 C
2X
0.10 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
A B
E
PIN A1
REFERENCE
DATE 28 NOV 2012
D
TOP VIEW
DIM
A
A1
A2
b
D
E
e
e1
A
A2
0.10 C
0.05 C
5X
C
A1
NOTE 3
SEATING
PLANE
SIDE VIEW
b
C A B
0.10
M
NOTE 4
PIN A1
REFERENCE
GENERIC
MARKING DIAGRAM*
e
5X
C
B
A
X
Y
M
123
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
0.52
PITCH
X
YM
e1
A1
MILLIMETERS
MIN
MAX
0.39
0.29
0.10
0.14
0.23 REF
0.14
0.18
0.86 BSC
0.84 BSC
0.30 BSC
0.52 BSC
PACKAGE
OUTLINE
5X
0.30
PITCH
= Specific Device Code
= Year
= Date Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
0.16
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON56899E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP5, 0.86X0.84
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON56899E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY V. CRACIUNOIU.
05 MAY 2011
A
CHANGED PACKAGE DIMENSIONS TO 0.84X0.86. MODIFED DIMENSIONS A, A1,
& A2 SLIGHTLY AS WELL. REQ. BY V. CRACIUNOIU.
25 JUN 2012
B
CHANGED BOTTOM VIEW ROW LABELING TO A,B,C & 1,2,3. REQ. BY V. CRACIUNOIU.
22 AUG 2012
C
REVERSED DIMENSION D AND E LABELS TO 0.86 X 0.84. REQ. BY V. CRACIUNOIU.
28 NOV 2012
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
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© Semiconductor Components Industries, LLC, 2012
November, 2012 − Rev. C
Case Outline Number:
567DD
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