ESD7471 D

ESD7471, SZESD7471
Ultra-Low Capacitance ESD
Protection
Micro−Packaged Diodes for ESD Protection
The ESD7471 is designed to protect voltage sensitive components
that require ultra-low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, high
breakdown voltage, high linearity, low leakage, and fast response time
make these parts ideal for ESD protection on designs where board
space is at a premium. It has industry leading capacitance linearity
over voltage making it ideal for RF applications. This capacitance
linearity combined with the extremely small package and low
insertion loss makes this part well suited for use in antenna line
applications for wireless handsets and terminals.
http://onsemi.com
MARKING
DIAGRAM
Features
•
•
•
•
•
•
•
•
•
Industry Leading Capacitance Linearity Over Voltage
Ultra−Low Capacitance: 0.35 pF Max
Stand−off Voltage: 5.3 V
Low Leakage: < 1 nA
Low Dynamic Resistance: < 1 W
IEC61000−4−2 Level 4 ESD Protection
1000 ESD IEC61000−4−2 Strikes ±8 kV Contact / Air Discharged
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
•
•
•
•
RF Signal ESD Protection
RF Switching, PA, and Antenna ESD Protection
Near Field Communications
USB 2.0, USB 3.0
XDFN2
CASE 711AM
D
M
G
DM
G
= Specific Device Code
= Date Code
= Pb−Free Package
ORDERING INFORMATION
Package
Shipping†
ESD7471N2T5G
XDFN2
(Pb−Free)
8000 / Tape &
Reel
SZESD7471N2T5G
XDFN2
(Pb−Free)
8000 / Tape &
Reel
Device
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
IEC 61000−4−2 Contact (ESD) (Note 1)
IEC 61000−4−2 Air (ESD) (Note 1)
ESD
ESD
±20
±20
KV
kV
IEC 61000−4−5 (ESD) (Note 2)
ESD
2.2
A
Total Power Dissipation (Note 3) @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
°PD°
RqJA
300
400
mW
°C/W
TJ, Tstg
−55 to
+150
°C
TL
260
°C
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. At least 10 discharges at TA = 25°C, per IEC61000−4−2 waveform.
2. Non−repetitive current pulse at TA = 25°C, per IEC61000−4−5 waveform.
3. Mounted with recommended minimum pad size, DC board FR−4
© Semiconductor Components Industries, LLC, 2014
September, 2014 − Rev. 1
1
Publication Order Number:
ESD7471/D
ESD7471, SZESD7471
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted)
IPP
Parameter
Symbol
IPP
Maximum Reverse Peak Pulse Current
VC
Clamping Voltage @ IPP
VRWM
IR
VBR
IT
IT
VC VBR VRWM IR
IR VRWM VBR VC
IT
Working Peak Reverse Voltage
V
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
IPP
Test Current
Bi−Directional TVS
*See Application Note AND8308/D for detailed explanations of
datasheet parameters.
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Parameter
Reverse Working Voltage
Breakdown Voltage
Symbol
Condition
Min
Typ
VRWM
VBR
IT = 1 mA (Note 4)
Max
Unit
5.3
V
7.0
V
Reverse Leakage Current
IR
VRWM = 5.3 V
<1
50
nA
Clamping Voltage
VC
IPP = 1 A (Note 5)
13
15
V
Junction Capacitance
CJ
VR = 0 V, f = 1 MHz
VR = 0 V, f = 1 GHz
0.24
0.24
0.35
0.35
pF
Dynamic Resistance
RDYN
TLP Pulse
0.8
W
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Breakdown voltage is tested from pin 1 to 2 and pin 2 to 1.
5. Non−repetitive current pulse at 25°C, per IEC61000−4−5 waveform.
http://onsemi.com
2
ESD7471, SZESD7471
TYPICAL CHARACTERISTICS
1
1.E−04
0.9
1.E−05
0.8
CAPACITANCE (pF)
1.E−03
I (A)
1.E−06
1.E−07
1.E−08
1.E−09
1.E−10
0.7
0.6
0.5
0.4
0.3
0.2
1.E−11
0.1
1.E−12
−12 −10 −8
−6
−4
−2 0
2
VOLTAGE (V)
4
6
8
10
0
12
−6
−5
−4
−3
−2
−1
0
1
2
3
4
5
6
Vbias (V)
Figure 1. IV Characteristics
Figure 2. CV Characteristics
2
2.0
0
1.8
1.6
−2
1.4
(dB)
−4
1.2
−6
1.0
−8
0.8
0.6
−10
0.4
−12
0.2
−14
3.5 4.5 5.5
6.5
FREQUENCY (GHz)
Figure 3. RF Insertion Loss
Figure 4. Capacitance over Frequency
1E9
1E10
2E10
8
16
1.5
2.5
7.5
8.5
9.5
8
6
12
−12
6
−10
10
8
4
6
4
2
−8
4
−6
−4
2
−2
2
2
4
6
8
0
0
10 12 14 16 18 20 22 24 26
VC, VOLTAGE (V)
0
2
Figure 5. Positive TLP I−V Curve
4
6
8
0
10 12 14 16 18 20 22 24 26
VC, VOLTAGE (V)
Figure 6. Negative TLP I−V Curve
http://onsemi.com
3
EQUIVALENT VIEC (kV)
−14
EQUIVALENT VIEC (kV)
TLP CURRENT (A)
TLP CURRENT (A)
0.5
−16
14
0
0
0
VOLTAGE (V)
1E8
ESD7471, SZESD7471
PACKAGE DIMENSIONS
XDFN2 1.0x0.6, 0.65P (SOD−882)
CASE 711AM
ISSUE O
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. EXPOSED COPPER ALLOWED AS SHOWN.
0.10 C
ÉÉ
ÉÉ
A B
D
PIN 1
INDICATOR
E
DIM
A
A1
b
D
E
e
L
0.05 C
TOP VIEW
NOTE 3
0.10 C
A
0.10 C
A1
C
SIDE VIEW
MILLIMETERS
MIN
MAX
0.34
0.44
−−−
0.05
0.43
0.53
1.00 BSC
0.60 BSC
0.65 BSC
0.20
0.30
RECOMMENDED
SOLDER FOOTPRINT*
SEATING
PLANE
1.20
2X
e
2X
0.47
0.60
b
e/2
0.05
M
PIN 1
C A B
1
DIMENSIONS: MILLIMETERS
2X
L
0.05
M
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
C A B
BOTTOM VIEW
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks,
copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC
reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any
particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without
limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications
and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC
does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where
personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and
its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly,
any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture
of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
http://onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
ESD7471/D
Similar pages