ESD8101 D

ESD8101, ESD8111
ESD Protection Diodes
Ultra Low Capacitance ESD Protection
Diode for High Speed Data Line
The ESD81x1 Series ESD protection diodes are designed to protect
high speed data lines from ESD. Ultra−low capacitance and low ESD
clamping voltage make this device an ideal solution for protecting
voltage sensitive high speed data lines.
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MARKING
DIAGRAMS
Features
• Low Capacitance (0.20 pF Typ, I/O to GND)
• Protection for the Following IEC Standards:
T
ESD8111 (0201)
WLCSP2
CASE 567AV
F
ESD8111P (0201)
WLCSP2
CASE 152AX
Typical Applications
• USB 3.0/3.1
• MHL 2.0
• eSATA
Q
•
•
IEC 61000−4−2 (Level 4)
Low ESD Clamping Voltage
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
ESD8101 (01005)
DSN2
CASE 152AK
T, F, Q = Device Code
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range
TJ
−55 to +150
°C
Storage Temperature Range
Tstg
−55 to +150
°C
Lead Solder Temperature −
Maximum (10 Seconds)
TL
260
°C
±23
±23
kV
kV
±30
±30
kV
kV
ESD8101:
IEC 61000−4−2 Contact
IEC 61000−4−2 Air
ESD8111:
IEC 61000−4−2 Contact
IEC 61000−4−2 Air
ESD
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
PIN CONFIGURATION
AND SCHEMATIC
1
2
=
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
See Application Note AND8308/D for further description of
survivability specs.
© Semiconductor Components Industries, LLC, 2016
June, 2016 − Rev. 4
1
Publication Order Number:
ESD8101/D
ESD8101, ESD8111
ELECTRICAL CHARACTERISTICS
I
(TA = 25°C unless otherwise noted)
Symbol
VRWM
IR
VBR
IPP
Parameter
RDYN
Working Peak Voltage
IHOLD
Maximum Reverse Leakage Current @ VRWM
Breakdown Voltage @ IT
VBR
VCVRWMVHOLD
IT
IR
V
Test Current
IR
IT
VHOLD
Holding Reverse Voltage
IHOLD
IHOLD
Holding Reverse Current
RDYN
Dynamic Resistance
IT
VBR
VHOLDVRWMVC
RDYN
IPP
Maximum Peak Pulse Current
VC
Clamping Voltage @ IPP
VC = VHOLD + (IPP * RDYN)
−IPP
VC = VHOLD + (IPP * RDYN)
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified)
Parameter
Reverse Working Voltage
Symbol
VRWM
Breakdown Voltage
VBR
Conditions
Min
Typ
I/O Pin to GND
IT = 1 mA, I/O Pin to GND
5.5
7.9
VRWM = 3.3 V, I/O Pin to GND
Max
Unit
3.3
V
8.6
V
1.0
mA
Reverse Leakage Current
IR
Reverse Holding Voltage
VHOLD
I/O Pin to GND
2.1
V
Holding Reverse Current
IHOLD
I/O Pin to GND
17
mA
ESD8111
Clamping Voltage
VC
IPP = 7.1 A, (8/20 ms pulse)
ESD8101, ESD8111
Clamping Voltage
TLP (Note 1)
VC
IPP = 8 A
IEC 61000−4−2 Level 2 equivalent
(±4 kV Contact, ±4 kV Air)
6.5
IPP = 16 A
IEC 61000−4−2 Level 2 equivalent
(±8 kV Contact, ±15 kV Air)
10
Junction Capacitance
CJ
VR = 0 V, f = 1 MHz
8.0
0.2
V
V
0.4
pF
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
1. ANSI/ESD STM5.5.1 − Electrostatic Discharge Sensitivity Testing using Transmission Line Pulse (TLP) Model.
TLP conditions: Z0 = 50 W, tp = 100 ns, tr = 4 ns, averaging window; t1 = 30 ns to t2 = 60 ns.
ORDERING INFORMATION
Package
Shipping†
ESD8101FCT5G
DSN2
(Pb−Free)
10,000 / Tape & Reel
ESD8111FCT5G
WLCSP2
(Pb−Free)
10,000 / Tape & Reel
WLCSP2 Side wall Isolated 0201
(Pb−Free)
10,000 / Tape & Reel
Device
ESD8111PFCT5G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
ESD8101, ESD8111
1.0
0.9
0.9
0.8
0.8
0.7
0.7
0.6
0.6
C (pF)
1.0
0.5
0.4
0.3
0.3
0.2
0.2
0.1
0
−3.5
0.1
0
−3.5
−2.5
−1.5
−0.5
0.5
1.5
2.5
3.5
−2.5
−1.5
−0.5
0.5
1.5
2.5
VBIAS (V)
VBIAS (V)
Figure 1. ESD8101 CV Characteristics
Figure 2. ESD8111 CV Characteristics
2
2
0
0
−2
−2
−4
−6
−8
−8
1E8
1E9
−10
1E7
1E10 3E10
1E8
1E10 3E10
1E9
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 3. ESD8101 S21 Insertion Loss
Figure 4. ESD8111 S21 Insertion Loss
1.0
3.5
−4
−6
−10
1E7
1.0
0.9
0.9
0.8
0.8
CAPACITANCE (pF)
CAPACITANCE (pF)
0.5
0.4
(dB)
(dB)
C (pF)
TYPICAL CHARACTERISTICS
0.7
0.6
0.5
0.4
0.3
0.7
0.6
0.5
0.4
0.3
0.2
0.2
0.1
0
0.1
0
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
FREQUENCY (GHz)
FREQUENCY (GHz)
Figure 5. ESD8101 Capacitance over
Frequency
Figure 6. ESD8111 Capacitance over
Frequency
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3
9
10
ESD8101, ESD8111
TYPICAL CHARACTERISTICS
20
20
10
18
16
12
TLP CURRENT (A)
14
6
10
8
4
6
4
2
2
0
0
2
4
6
8
10
12
14
16
18
8
14
12
6
10
8
4
6
4
2
2
0
0
20
0
0
2
4
6
VC, VOLTAGE (V)
8
10
12
14
16
18
20
VC, VOLTAGE (V)
Figure 7. ESD8101 Positive TLP I−V Curve
−20
Figure 8. ESD8111 Positive TLP I−V Curve
10
−20
10
−18
−18
6
−10
−8
4
−6
−4
TLP CURRENT (A)
−14
−12
−16
2
−2
0
0
2
4
6
8
10
12
14
16
18
8
VIEC, EQUIVALENT (kV)
8
VIEC, EQUIVALENT (kV)
−16
TLP CURRENT (A)
VIEC, EQUIVALENT (kV)
8
VIEC, EQUIVALENT (kV)
16
TLP CURRENT (A)
10
18
−14
−12
6
−10
−8
4
−6
−4
2
−2
0
0
20
0
0
VC, VOLTAGE (V)
2
4
6
8
10
12
14
16
18
20
VC, VOLTAGE (V)
Figure 9. ESD8101 Negative TLP I−V Curve
Figure 10. ESD8111 Negative TLP I−V Curve
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4
ESD8101, ESD8111
IEC61000−4−2 Waveform
IEC 61000−4−2 Spec.
Ipeak
Level
Test Voltage (kV)
First Peak
Current
(A)
Current at
30 ns (A)
Current at
60 ns (A)
1
2
7.5
4
2
2
4
15
8
4
3
6
22.5
12
6
4
8
30
16
8
100%
90%
I @ 30 ns
I @ 60 ns
10%
tP = 0.7 ns to 1 ns
Figure 11. IEC61000−4−2 Spec
Transmission Line Pulse (TLP) Measurement
L
Transmission Line Pulse (TLP) provides current versus
voltage (I−V) curves in which each data point is obtained
from a 100 ns long rectangular pulse from a charged
transmission line. A simplified schematic of a typical TLP
system is shown in Figure 12. TLP I−V curves of ESD
protection devices accurately demonstrate the product’s
ESD capability because the 10s of amps current levels and
under 100 ns time scale match those of an ESD event. This
is illustrated in Figure 13 where an 8 kV IEC 61000−4−2
current waveform is compared with TLP current pulses at
8 A and 16 A. A TLP I−V curve shows the voltage at which
the device turns on as well as how well the device clamps
voltage over a range of current levels.
50 W Coax
Cable
S Attenuator
÷
50 W Coax
Cable
10 MW
IM
VM
DUT
VC
Oscilloscope
Figure 12. Simplified Schematic of a Typical TLP
System
Figure 13. Comparison Between 8 kV IEC 61000−4−2 and 8 A and 16 A TLP Waveforms
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5
ESD8101, ESD8111
PACKAGE DIMENSIONS − ESD8101 (01005)
DSN2, 0.435x0.23, 0.27P, (01005)
CASE 152AK
ISSUE A
ÉÉ
ÉÉ
PIN 1
INDICATOR
0.02 C
2X
2X
0.02 C
MILLIMETERS
DIM MIN
MAX
A 0.165 0.195
A1
−−− 0.030
b 0.177 0.193
D
0.435 BSC
E
0.230 BSC
e
0.270 BSC
L 0.112 0.128
E
TOP VIEW
A
0.05 C
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
B
D
A1
0.02 C
2X
C
SIDE VIEW
RECOMMENDED
SOLDER FOOTPRINT*
SEATING
PLANE
0.44
e
2X
0.05
b
M
2X
C A B
0.23
1
1
2X
0.16
DIMENSIONS: MILLIMETERS
L
C A B
2X
0.05
M
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BOTTOM VIEW
PACKAGE DIMENSIONS − ESD8111 (0201)
WLCSP2, 0.6x0.3
CASE 567AV
ISSUE B
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A B
0.02 C
2X
2X
DIM
A
A1
b
D
E
e
L
E
0.02 C
TOP VIEW
0.02 C
A
0.02 C
A1
C
SIDE VIEW
MILLIMETERS
MIN
NOM MAX
0.250 0.275 0.300
0.000 0.250 0.500
0.140 0.155 0.170
0.570 0.600 0.630
0.270 0.300 0.330
0.36 BSC
0.190 0.215 0.240
RECOMMENDED
SOLDER FOOTPRINT*
SEATING
PLANE
2X
0.33
e
2X
L
2X b
0.05 C A B
2X
0.28
0.81
BOTTOM VIEW
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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6
ESD8101, ESD8111
PACKAGE DIMENSIONS − ESD8111P (0201)
DSN2, 0.60x0.30, 0.36P
CASE 152AX
ISSUE O
D
PIN 1
INDICATOR
0.025 C
2X
2X
0.025 C
ÈÈ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
A
B
DIM
A
A1
b
D
E
e
L
E
TOP VIEW
A
0.02 C
MILLIMETERS
MIN
MAX
0.175 0.225
−−− 0.018
0.205 0.225
0.575 0.625
0.275 0.325
0.36 BSC
0.145 0.165
A1
RECOMMENDED
SOLDER FOOTPRINT*
0.01 C
C
SIDE VIEW
SEATING
PLANE
0.65
2X
0.27
e
1
b
2X
1
0.05
L2
C A B
2X
0.05
M
BOTTOM VIEW
M
0.26
DIMENSIONS: MILLIMETERS
C A B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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ESD8101/D
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