483

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
TSOP−5
CASE 483
ISSUE M
5
1
SCALE 2:1
DATE 17 MAY 2016
NOTE 5
2X
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
THICKNESS. MINIMUM LEAD THICKNESS IS THE
MINIMUM THICKNESS OF BASE MATERIAL.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT
EXCEED 0.15 PER SIDE. DIMENSION A.
5. OPTIONAL CONSTRUCTION: AN ADDITIONAL
TRIMMED LEAD IS ALLOWED IN THIS LOCATION.
TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2
FROM BODY.
D 5X
0.20 C A B
0.10 T
M
2X
0.20 T
5
B
1
4
2
S
3
K
B
DETAIL Z
G
A
A
TOP VIEW
DIM
A
B
C
D
G
H
J
K
M
S
DETAIL Z
J
C
0.05
H
C
SIDE VIEW
SEATING
PLANE
END VIEW
GENERIC
MARKING DIAGRAM*
SOLDERING FOOTPRINT*
0.95
0.037
MILLIMETERS
MIN
MAX
2.85
3.15
1.35
1.65
0.90
1.10
0.25
0.50
0.95 BSC
0.01
0.10
0.10
0.26
0.20
0.60
0_
10 _
2.50
3.00
1.9
0.074
5
5
XXXAYWG
G
1
1
Analog
2.4
0.094
XXX = Specific Device Code
A
= Assembly Location
Y
= Year
W = Work Week
G
= Pb−Free Package
1.0
0.039
XX MG
G
Discrete/Logic
XX = Specific Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
0.7
0.028
SCALE 10:1
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98ARB18753C
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
TSOP−5
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98ARB18753C
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
INITIATED NEW MECHANICAL OUTLINE #483. REQ BY WL CHIN/L. RENNICK.
28 OCT 1998
A
UPDATE OUTLINE DRAWING TO CORRECT DIN “C” (SHOULD BE FROM TIP OF
LID TO TOP OF PKG). DIM IN TABLE INCORRECTLY LISTED TO G, F TO H,
H TO J, N TO L & R TO M. REQ BY F. PADILLA
13 NOV 1998
B
CHANGE OF LEGAL ONWERSHIP FROM MOTOROLA TO ON SEMICONDUCTOR. REQ BY A. GARLINGTON
20 APR 2001
C
ADDED NOTE “4”. REQ BY S. RIGGS
27 JUN 2003
D
ADDED FOOTPRINT INFORMATION. UPDATED MARKING. REQ. BY D. JOERSZ
07 APR 2005
E
CHANGED DEVICE MARKING FROM AWW TO AYW. REQ. BY J. MANES.
14 SEP 2005
F
UPDATED DRAWINGS TO LATEST JEDEC STANDARDS. ADDED NOTE 5. REQ.
BY T. GURNETT.
07 JUN 2006
G
ADDED MARKING DIAGRAM FOR IC OPTION. REQ. BY J. MILLER.
21 FEB 2007
H
CORRECTED MARKING DIAGRAM ERROR BY REVERSING ANALOG AND
DISCRETE LABELS. REQ. BY GK SUA.
18 MAY 2007
J
CHANGED NOTE 4. REQ. BY A. GARLINGTON.
13 MAR 2013
K
REMOVED DIMENSION L AND ADDED DATUMS A AND B TO TOP VIEW. REQ.
BY A. GARLINGTON.
19 APR 2013
L
REMOVED −02 FROM CASE CODE VARIANT. REQ. BY N. CALZADA.
23 SEP 2015
M
CHANGED DIMENSIONS A & B FROM BASIC TO MIN AND MAX VALUES. REQ.
BY A. GARLINGTON.
17 MAY 2016
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
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© Semiconductor Components Industries, LLC, 2016
May, 2016 − Rev. M
Case Outline Number:
483
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