05-08-1825

LGA Package
56-Lead (11.25mm × 9.00mm × 2.82mm)
(Reference LTC DWG # 05-08-1825 Rev A)
aaa Z
9.00
BSC
Y
PADS
SEE NOTES
2.72 – 2.92
X
SEE NOTES
DETAIL A
7.62
BSC
7
3
A
0.605 – 0.665
PAD 1
CORNER
MOLD
CAP
4
11.25
BSC
B
SUBSTRATE
C
D
8.89
BSC
0.27 – 0.37
2.45 – 2.55
E
Z
DETAIL B
bbb Z
DIA (0.635)
PAD 1
F
1.27
BSC
G
H
aaa Z
7
PACKAGE TOP VIEW
0.630 ±0.025 SQ. 56x
5
4
3
2
1
DETAIL B
3.810
2.540
1.270
0.3175
0.3175
1.270
2.540
3.810
0.000
eee S X Y
6
PACKAGE BOTTOM VIEW
DETAIL A
4.445
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.175
1.905
2. ALL DIMENSIONS ARE IN MILLIMETERS
0.635
0.000
0.635
3
LAND DESIGNATION PER JESD MO-222, SPP-010 AND SPP-020
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
1.905
3.175
5. PRIMARY DATUM -Z- IS SEATING PLANE
4.445
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
6. THE TOTAL NUMBER OF PADS: 56
SUGGESTED PCB LAYOUT
TOP VIEW
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 56 0113 REV A