05-08-1757

LGA Package
108-Lead (15mm × 11.25mm × 2.32mm)
(Reference LTC DWG # 05-08-1757 Rev A)
SEE NOTES
DETAIL A
aaa Z
15
BSC
X
2.22 – 2.42
Y
7
13.97
BSC
0.22 × 45°
CHAMFER
J
H
G
MOLD
CAP
11.25
BSC
SUBSTRATE
F
10.16
BSC
E
0.27 – 0.37
PAD 1
CORNER
D
1.27
BSC
Z
// bbb Z
1.95 – 2.05
C
B
DETAIL B
4
A
aaa Z
PADS
SEE NOTES
PACKAGE TOP VIEW
12
10
9
8
7
6
5
4
3
2
1
PACKAGE BOTTOM VIEW
3
0.630 ±0.025 SQ. 108x
11
DETAIL B
DIA (0.635)
PAD 1
6.985
5.715
4.445
3.175
1.905
0.635
0.000
0.635
1.905
3.175
4.445
5.715
6.985
eee S X Y
5.080
3.810
DETAIL A
2.540
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
1.270
2. ALL DIMENSIONS ARE IN MILLIMETERS
0.000
1.270
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
2.540
3.810
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
5. PRIMARY DATUM -Z- IS SEATING PLANE
5.080
SUGGESTED PCB LAYOUT
TOP VIEW
6. THE TOTAL NUMBER OF PADS: 108
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 108 1212 REV A
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