05-08-1843

LGA Package
144-Lead (15mm × 15mm × 4.32mm)
(Reference LTC DWG # 05-08-1843 Rev A)
aaa Z
15
BSC
X
4.22 – 4.42
Y
SEE NOTES
DETAIL A
3x, C (0.22 x45°)
0.12 – 0.28
7
13.97
BSC
M
L
K
J
H
15
BSC
SUBSTRATE
F
E
1.27
BSC
0.27 – 0.37
PAD 1
CORNER
G
13.97
BSC
MOLD
CAP
3.95 – 4.05
D
Z
bbb Z
DETAIL B
4
C
B
A
aaa Z
PACKAGE TOP VIEW
PADS
SEE NOTES
0.630 ±0.025 SQ. 143x
11
10
9
8
7
6
5
4
3
2
PACKAGE BOTTOM VIEW
DETAIL B
1
DIA 0.630
PAD 1
6.9850
5.7150
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
eee S X Y
6.9850
12
3
6.9850
5.7150
DETAIL A
4.4450
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
3.1750
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.9050
0.6350
0.0000
0.6350
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
1.9050
3.1750
5. PRIMARY DATUM -Z- IS SEATING PLANE
4.4450
6. THE TOTAL NUMBER OF PADS: 144
7
5.7150
6.9850
SUGGESTED PCB LAYOUT
TOP VIEW
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 144 1112 REV A
Similar pages