05-08-1817

LGA Package
70-Lead (15mm × 9mm × 4.32mm)
(Reference LTC DWG # 05-08-1817 Rev A)
9
BSC
aaa Z
SEE NOTES
DETAIL A
Y
7
6
5
4
3
2
4.22 – 4.42
7
1
C(0.30)
PAD 1
A
B
PAD 1
CORNER
MOLD
CAP
4
C
SUBSTRATE
D
0.27 – 0.37
3.95 – 4.05
E
DETAIL B
12.70
BSC
Z
// bbb Z
15
BSC
F
G
H
J
0.635 ±0.025 SQ. 70x
eee S X Y
DETAIL B
K
L
aaa Z
X
PACKAGE TOP VIEW
PADS
SEE NOTES
3
3.810
2.540
1.270
0.000
1.270
2.540
3.810
1.27
BSC
PACKAGE BOTTOM VIEW
DETAIL A
6.350
5.080
3.810
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
2.540
1.270
0.000
1.270
2.540
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 70
7
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
3.810
5.080
6.350
SUGGESTED PCB LAYOUT
TOP VIEW
7.62
BSC
SYMBOL TOLERANCE
aaa
0.15
bbb
0.10
eee
0.05
COMPONENT
PAD “A1”
TRAY PIN 1
BEVEL
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 70 1212 REV A
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