05-08-1516

LGA Package
16-Lead (3mm × 3mm × 0.94mm)
ddd Z
(Reference LTC DWG # 05-08-1516 Rev Ø)
aaa Z
13
SEE NOTES
8
16
12
PAD “A1”
CORNER
4
1
6
b
D
F
A1
D1
Z
SEE NOTES
0.375
e
DETAIL C
0.375
3
9
4
SUBSTRATE
MOLD
CAP
X
DETAIL B
0.375
H1
H2
16b
eee M Z X Y
fff M Z
Z
// bbb Z
e/2
e
0.7500
0.2500
0.0000
0.2500
0.7500
DIMENSIONS
PACKAGE
OUTLINE
0.25 ±0.05
0.7500
0.2500
0.0000
0.2500
0.7500
3.50 ±0.05
SUGGESTED PCB LAYOUT
TOP VIEW
5
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
0.70 ±0.05
e
E1
PACKAGE BOTTOM VIEW
DETAIL B
3.50 ±0.05
b
G
PACKAGE TOP VIEW
2×
aaa Z
8
DETAIL C
Y
E
PIN 1 NOTCH
0.25 × 45°
ccc M Z X Y
16×
2×
DETAIL A
ccc M Z X Y
A
SYMBOL
A
A1
b
D
E
e
F
G
D1
E1
H1
H2
aaa
bbb
ccc
ddd
eee
fff
MIN
0.85
0.01
0.22
0.20
0.65
NOM
0.94
0.02
0.25
3.00
3.00
0.50
1.50
1.50
1.45
1.45
0.24
0.70
MAX
1.03
0.03
0.28
0.40
2. ALL DIMENSIONS ARE IN MILLIMETERS
3
METAL FEATURES UNDER THE SOLDER MASK OPENING NOT SHOWN
SO AS NOT TO OBSCURE THESE TERMINIALS AND HEAT FEATURES
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE
LOCATED WITHIN THE ZONE INDICATED. THE PAD #1 IDENTIFIER
MAY BE EITHER A MOLD OR MARKED FEATURE
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6
THE EXPOSED HEAT FEATURE MAY HAVE OPTIONAL CORNER RADII
7
CORNER SUPPORT PAD CHAMFER IS OPTIONAL
8
0.28
0.75
0.10
0.10
0.08
0.10
0.15
0.08
TOTAL NUMBER OF LGA PADS: 24
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
PACKAGE IN TRAY LOADING ORIENTATION
LGA 16 1015 REV Ø
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