05-08-1504

LGA Package
144-Lead (16mm × 16mm × 1.91mm)
(Reference LTC DWG # 05-08-1504 Rev A)
SEE NOTES
DETAIL A
A
aaa Z
M
L
K
J
H
G
F
E
D
C
B
7
A
1
PAD “A1”
CORNER
2
4
b
DIA 0.630
PAD 1
3
4
5
6
MOLD
CAP
D
F
SUBSTRATE
7
8
H1
H2
Z
// bbb Z
9
10
DETAIL B
11
e
12
X
e
b
ddd M Z X Y
eee M Z
Y
E
aaa Z
Øb (144 PLACES)
SEE NOTES
G
DETAIL B
PACKAGE TOP VIEW
3
PACKAGE BOTTOM VIEW
6.9850
5.7150
4.4450
3.1750
2. ALL DIMENSIONS ARE IN MILLIMETERS
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994
DETAIL A
6.9850
5.7150
0.630 ±0.025 Ø 144x
4.4450
3.1750
1.9050
0.6350
0.0000
0.6350
1.9050
3.1750
4.4450
5.7150
6.9850
SUGGESTED PCB LAYOUT
TOP VIEW
3
LAND DESIGNATION PER JESD MO-222, SPP-010
4
DETAILS OF PAD #1 IDENTIFIER ARE OPTIONAL,
BUT MUST BE LOCATED WITHIN THE ZONE INDICATED.
THE PAD #1 IDENTIFIER MAY BE EITHER A MOLD OR
MARKED FEATURE
DIMENSIONS
SYMBOL
A
b
D
E
e
F
G
H1
H2
aaa
bbb
eee
MIN
1.81
0.60
0.36
1.45
NOM
1.91
0.63
16.0
16.0
1.27
13.97
13.97
0.41
1.50
MAX
2.01
0.66
NOTES
5. PRIMARY DATUM -Z- IS SEATING PLANE
6. THE TOTAL NUMBER OF PADS: 144
7
0.46
1.55
0.15
0.10
0.05
TOTAL NUMBER OF LGA PADS: 144
!
PACKAGE ROW AND COLUMN LABELING MAY VARY
AMONG µModule PRODUCTS. REVIEW EACH PACKAGE
LAYOUT CAREFULLY
LTMXXXXXX
µModule
COMPONENT
PIN “A1”
TRAY PIN 1
BEVEL
PACKAGE IN TRAY LOADING ORIENTATION
LGA 144 1015 REV A
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