511AT

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511AT−01
ISSUE O
DATE 26 FEB 2010
SCALE 4:1
D
PIN ONE
REFERENCE
2X
0.10 C
2X
ALTERNATE TERMINAL
CONSTRUCTIONS
EXPOSED Cu
e/2
MOLD CMPD
DETAIL B
A
A1
A3
SIDE VIEW
DIM
A
A1
A3
b
D
E
e
L
L1
L2
ÉÉÉ
ÉÉÉ
ÉÉÉ
TOP VIEW
DETAIL B
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
DETAIL A
E
0.05 C
8X
L
L1
ÍÍ
ÍÍ
ÍÍ
0.10 C
L
A
B
ALTERNATE
CONSTRUCTIONS
C
GENERIC
MARKING DIAGRAM*
SEATING
PLANE
1
DETAIL A
e
1
7X
4
L
5
8X
BOTTOM VIEW
b
0.10 C A
0.05 C
XXMG
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
(Note: Microdot may be in either location)
L2
8
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
2.00 BSC
0.50 BSC
0.40
0.60
--0.15
0.50
0.70
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
B
RECOMMENDED
SOLDERING FOOTPRINT*
NOTE 3
7X
PACKAGE
OUTLINE
0.78
2.30
0.88
1
8X
0.30
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON48654E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
October, DESCRIPTION:
2002 − Rev. 0
PAGE 1 OFXXX
2
WDFN8, 2X2, 0.5 P
1
DOCUMENT NUMBER:
98AON48654E
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY D. SHORT.
DATE
26 FEB 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 01O
Case Outline Number:
511AT
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