Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L24.4x5
24 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 2, 3/15
(0.711)
4.00
A
1.678
(0.461)
B
6
PIN #1
INDEX AREA
1
20x 0.40
24
6
PIN 1
INDEX AREA
0.20
5.00
1.25
4.40
3.15
24x 0.20
(4X)
12
13
0.10
24x 0.45
2.60
TOP VIEW
0.10 C
SEE DETAIL "X"
PACKAGE OUTLINE
(1.678)
0.65
C
BASE PLANE
SEATING PLANE
0.08 C
BOTTOM VIEW
0.711
0.461
0.10 M C A B
(20x 0.40)
0.20
(1.25)
C
0.60
0 . 203 REF
5
0.20
(5.00)
0 . 00 MIN.
0 . 05 MAX.
(4.40)
DETAIL "X"
0.40
(3.15)
2.60
0.40
0.20
2.60
0.25
(24x 0.65)
TYPICAL RECOMMENDED LAND PATTERN
0.70
0.90
0.035
0.203
SIDE VIEW
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
1
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may be
located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7.
JEDEC reference drawing MO-229.