Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Package Outline Drawing
L8.4x4
8 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
Rev 1, 03/15
2.4 REF
4.00
A
PIN #1 INDEX AREA
6X 0.80 BSC
6
B
4
1
8X 0 . 40 ± 0.10
6
PIN 1
INDEX AREA
4.00
2.50 ± 0.10
0.15
(4X)
8
5
TOP VIEW
0.10 M C A B
0.05 M C
4 8 X 0.30
3.45 ± 0.10
BOTTOM VIEW
( 3.45 )
SEE DETAIL "X"
0 .9 ± 0.10
( 8 X 0.60 )
0.10 C
BASE PLANE C
SIDE VIEW
( 3.80)
SEATING PLANE
0.08 C
( 2.50)
0 . 2 REF
C
( 6X 0 . 8 )
0 . 00 MIN.
0 . 05 MAX.
( 8X 0 . 30 )
DETAIL "X"
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1.
Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
3.
Unless otherwise specified, tolerance : Decimal ± 0.05
4.
Dimension applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5.
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
6.
The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
1