Plastic Packages for Integrated Circuits Package Outline Drawing L9.4x4 9 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE Rev 2, 5/15 3.2 REF 4.00 A PIN #1 INDEX AREA 6X 0.80 BSC 6 B 4 1 9X 0 . 40 ± 0.100 6 PIN 1 INDEX AREA 4.00 2.20 1.2 REF 0.15 (4X) 9 5 0.10 M C A B 0.05 M C 4 9 X 0.30 TOP VIEW 3.00 BOTTOM VIEW (3.00) SEE DETAIL "X" 0 .75 (9 X 0.60) 0.10 C BASE PLANE SIDE VIEW (3.80) SEATING PLANE 0.08 C (2.20) (1.2) 4 0 . 2 REF C 0 . 00 MIN. 0 . 05 MAX. (9X 0.30) (6X 0.8) DETAIL "X" TYPICAL RECOMMENDED LAND PATTERN NOTES: 1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only. 2. Dimensioning and tolerancing conform to ASME Y14.5m-1994. 3. Unless otherwise specified, tolerance : Decimal ± 0.05 4. E-Pad is offset from center. 5. Tiebar shown (if present) is a non-functional feature and may be located on any of the 4 sides (or ends). 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 1 C