485AV

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
QFN52 6x6, 0.65P
CASE 485AV
ISSUE B
DATE 29 MAR 2016
SCALE 2:1
D
ÉÉÉ
ÉÉÉ
ÉÉÉ
PIN ONE
REFERENCE
PACKAGE
EDGE
A B
E
P
DIM
A
A1
b
D
D2
D3
E
E2
E3
eT
eR
L
P
0.15 C
2X
DETAIL A
0.15 C
2X
TOP VIEW
0.10 C
A
52X
0.08 C
A1
SEATING
PLANE
C
SIDE VIEW
D3
A7
L
1
eT
DETAIL A
52X
MILLIMETERS
NOM
MAX
0.90
1.00
0.05
0.10
0.20
0.25
6.00 BSC
3.20
3.30
3.40
5.50 BSC
6.00 BSC
3.20
3.30
3.40
5.50 BSC
0.65 BSC
0.65 BSC
0.35
0.40
0.45
0.05 REF
MIN
0.80
0.00
0.15
GENERIC
MARKING DIAGRAM*
D2
44X
A8
B7
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30mm FROM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
E3/2
A14
B12
B13
B6
XXXXXXXX
XXXXXXXX
AWLYYWWG
A15
E2 E3
A1
B18
B1
B24
A28
eR
XXXXX
A
WL
YY
WW
G
A21
B19
A22
52X
PIN 1 ID
b
0.10 C A B
0.05 C
BOTTOM VIEW
NOTE 3
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT
6.20
4.65
3.35
= Specific Device Code
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
DETAIL A
A1
B1
3.35 4.65 6.20
52X
8X
0.25 MIN
0.35
26X
DETAIL A
0.45
PACKAGE
OUTLINE
26X
0.65
PITCH
0.58
DIMENSIONS: MILLIMETERS
DOCUMENT NUMBER:
98AON32300E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
QFN52 6x6, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON32300E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY S. MOHAMMED.
02 SEP 2008
A
ADDED SOLDERING FOOTPRINT. REQ. BY S. MOHAMMED.
29 OCT 2008
B
CHANGED B DIMENSION FROM 0.25−0.35MM TO 0.15−0.25MM. REQ. BY C.
MAGPANTAY.
29 MAR 2016
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
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SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
© Semiconductor Components Industries, LLC, 2016
March, 2016 − Rev. B
Case Outline Number:
485AV
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