86716.pdf

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
A
Add two vendors, CAGE 24355 and CAGE 17856. Add device type 02. Make
changes to 1.2.1, 1.3, 1.4, and table I, figure 1, and figure 3. Editorial changes
throughout.
89-11-09
M. A. Frye
B
Remove vendor, CAGE 24355 from device types 01 and 02. Add device type
03. Table I changes. Editorial changes throughout.
93-03-02
M. A. Frye
C
Update boilerplate to add class V. –rrp
00-09-07
R. Monnin
D
Update to current requirements. Editorial changes throughout. - drw
03-05-01
Raymond Monnin
E
Redrawn. Update paragraphs to MIL-PRF-38535 requirements. - drw
15-08-20
Charles F. Saffle
REV
SHEET
REV
SHEET
REV STATUS
REV
E
E
E
E
E
E
E
E
E
E
E
E
E
OF SHEETS
SHEET
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2
3
4
5
6
7
8
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11
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PMIC N/A
PREPARED BY
Rick Officer
STANDARD
MICROCIRCUIT
DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
http://www.landandmaritime.dla.mil
CHECKED BY
Charles E. Besore
APPROVED BY
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
Michael A. Frye
DRAWING APPROVAL DATE
87-01-30
REVISION LEVEL
E
MICROCIRCUIT, LINEAR, CMOS, HIGH SPEED
QUAD SPST ANALOG SWITCH, MONOLITHIC
SILICON
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
5962-86716
1 OF 13
5962-E434-15
1. SCOPE
1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and
M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part
or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
For device classes M and Q:
5962
-
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
86716
01
E
A
Device
type
(see 1.2.2)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
For device class V:
5962
-
Federal
stock class
designator
\
RHA
designator
(see 1.2.1)
86716
01
V
E
A
Device
type
(see 1.2.2)
Device
class
designator
(see 1.2.3)
Case
outline
(see 1.2.4)
Lead
finish
(see 1.2.5)
/
\/
Drawing number
1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are
marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device types. The device types identify the circuit function as follows:
Device type
Generic number
01
02
03
Circuit function
HI201HS
DG271
ADG201HST
High speed quad SPST CMOS analog switch
High speed quad SPST CMOS analog switch
High speed quad SPST CMOS analog switch
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Q or V
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A
Certification and qualification to MIL-PRF-38535
SIZE
5962-86716
A
REVISION LEVEL
E
SHEET
2
1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows:
Outline letter
E
2
Descriptive designator
GDIP1-T16 or CDIP2-T16
CQCC1-N20
Terminals
16
20
Package style
Dual-in-line
Square leadless chip carrier
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/, 2/
Positive supply voltage (V+ to ground):
Device type 01 .........................................................................................
Device types 02 and 03 ............................................................................
Negative supply voltage (V- to ground):
Device type 01 .........................................................................................
Device types 02 and 03 ............................................................................
Digital input voltage (VIN):
Device types 01 and 03 ............................................................................
+18 V
+25 V
-18 V
-25 V
V- (-4 V) to V+ (+4 V) or
20 mA, whichever comes first
Device type 02 ......................................................................................... V- (-2 V) to V+ (+2 V) or
20 mA, whichever comes first
Analog input voltage, one switch (VS) .......................................................... V- (-2 V) to V+ (+2 V) or
20 mA, whichever comes first
Maximum power dissipation (PD):
Device types 01 and 03 ............................................................................ 750 mW 3/
Device type 02 ......................................................................................... 900 mW 4/
Maximum junction temperature (TJ) ............................................................. +150°C
Lead temperature (soldering, 10 seconds) .................................................. +275°C
Thermal resistance, junction-to-case (θJC) ................................................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA) .............................................. 76°C/W
Storage temperature range .......................................................................... -65°C to +150°C
Peak current, S or D (pulsed at 1 ms, 10 percent duty cycle max):
Device type 01 ......................................................................................... 50 mA
Device type 02 ......................................................................................... 100 mA
Device type 03 ......................................................................................... 70 mA
Continuous current, any terminal (except S or D):
Device type 01 ......................................................................................... 25 mA
Device types 02 and 03 ............................................................................ 20 mA
1.4 Recommended operating conditions.
Positive supply voltage (V+) ........................................................................
Negative supply voltage (V-) ........................................................................
Minimum high level input voltage (VIH):
Device types 01 and 03 ............................................................................
Device type 02 .........................................................................................
Maximum low level input voltage (VIL) .........................................................
Ambient operating temperature range (TA) ..................................................
Ground (GND) .............................................................................................
1/
2/
3/
4/
+15 V dc
-15 V dc
2.4 V dc
2.0 V dc
0.8 V dc
-55°C to +125°C
0 V dc
Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
Unless otherwise specified, all voltages are referenced to ground.
Derate case E, 8 mW/°C above TA = +75°C. Derate case 2, 10 mW/°C above TA = +75°C.
Derate case E, 12 mW/°C above TA = +75°C. Derate case 2, 10 mW/°C above TA = +75°C.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-86716
A
REVISION LEVEL
E
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil or from the Standardization Document Order
Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with
MIL-PRF-38535 as specified herein, or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Functional diagram. The functional diagram shall be as specified on figure 2.
3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full
ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer
has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be
marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be
in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in
MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
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DSCC FORM 2234
APR 97
SIZE
5962-86716
A
REVISION LEVEL
E
SHEET
4
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C ≤ TA ≤+125°C
V+ = +15 V dc, V- = -15 V dc
unless otherwise specified
Device
type
4
All
Max
±15
V
1
All
50
Ω
Min
Analog signal range
VS
TA = +25°C
ON resistance
RDS(ON)
VS = ±10 V, ID = 1 mA,
VIN = 0.8 V
Source OFF leakage
current
IS(OFF)
2/
2, 3
VS = ±14 V, VD = ±14 V,
VIN = 2.4 V
Channel ON leakage
current
ID(OFF)
ID(ON)
75
1
±10
01
nA
±100
2, 3
VD = ±14 V, VS = ±14 V,
VIN = 2.4 V
Drain OFF leakage
current
Unit
Limits 1/
Group A
subgroups
±1
1
02, 03
2, 3
02
±100
03
±60
01
±10
VS = ±14 V, VD = ±14 V,
VIN = 2.4 V
2, 3
VD = ±14 V, VS = ±14 V,
VIN = 2.4 V
1
02, 03
2, 3
02
±100
03
±60
01
±10
1
VD = VS = ±14 V,
VIN = 0.8 V
±100
1
±1
±1
1
02, 03
2, 3
02
±100
03
±60
0.8
Low level input voltage
3/
VIL
7, 8
All
High level input voltage
3/
VIH
7, 8
01, 03
2.4
02
2.0
Input leakage current
(low)
IIL
VIN under test = 0 V,
All other VIN = 2.0 V
V
V
1, 2, 3
01
±500
1
02
±1
µA
±10
2, 3
VIN under test = 1.0 V,
All other VIN = 16.5 V,
nA
±100
2, 3
VIN under test = 0.8 V,
All other VIN = 4.0 V
nA
1, 2, 3
±1
03
VS = ±17 V
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
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DSCC FORM 2234
APR 97
SIZE
5962-86716
A
REVISION LEVEL
E
SHEET
5
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions
-55°C ≤ TA ≤+125°C
V+ = +15 V dc, V- = -15 V dc
unless otherwise specified
Device
type
VIN under test = 4.0 V,
All other VIN = 0.8 V
1, 2, 3
01
Max
±40
VIN under test = 2.0 V,
All other VIN = 0 V
1
02
±1
Min
Input leakage current
(high)
IIH
Unit
Limits 1/
Group A
subgroups
±10
2, 3
VIN under test = 16.5 V,
All other VIN = 1.0 V,
µA
1, 2, 3
03
±1
1, 2, 3
01
10
1
02
10
VS = ±17 V
Positive supply current
I+
VIN = 2.4 V or VIN = 0.8 V
for all switches
VIN = 0 V or VIN = 2.0 V
for all switches
Negative supply current
I-
2, 3
1, 2, 3
03
10
VIN = 2.4 V or VIN = 0.8 V
for all switches
1, 2, 3
01
-6
1
02
-6
2, 3
VIN = 2.4 V or VIN = 0.8 V
for all switches
Switch on time
tON
11
VIN = 3.0 V or VIN = 0.8 V
for all switches
VIN = 0 V or VIN = 2.0 V
for all switches
mA
mA
-10
1, 2, 3
03
-6
RL = 1 kΩ, CL = 35 pF,
9
01
50
VS = ±10 V, VIH = +3 V,
VIL = 0 V, See figure 3
10, 11
ns
100
RL = 1 kΩ, CL = 35 pF,
9
VS = ±10 V, VIH = +5 V,
VIL = 0 V, See figure 3
10, 11
02
65
RL = 1 kΩ, CL = 35 pF,
9, 10, 11
03
50
RL = 1 kΩ, CL = 35 pF,
9
01
50
VS = ±10 V, VIH = +3 V,
VIL = 0 V, See figure 3
10, 11
RL = 1 kΩ, CL = 35 pF,
9
VS = ±10 V, VIH = +5 V,
VIL = 0 V, See figure 3
10, 11
RL = 1 kΩ, CL = 35 pF,
9, 10, 11
80
VS = ±10 V, VIH = +3 V,
VIL = 0 V, See figure 3
Switch off time
tOFF
ns
100
02
65
80
03
50
VS = ±10 V, VIH = +3 V,
VIL = 0 V, See figure 3
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-86716
A
REVISION LEVEL
E
SHEET
6
TABLE I. Electrical performance characteristics – continued.
Test
Symbol
Conditions
-55°C ≤ TA ≤+125°C
V+ = +15 V dc, V- = -15 V dc
unless otherwise specified
CA
GND = 0 V, VIL = 0 V,
Device
type
4
All
Max
15
pF
4
All
15
pF
4
All
20
pF
4
All
60
dB
4
All
60
dB
4
All
Min
Capacitance address
Unit
Limits 1/
Group A
subgroups
f = 1 MHz, TA = +25°C 4/
Capacitance input
switch
CIS
Capacitance output
switch
COS
Off isolation
VISO
Crosstalk between
channels
VCT
Charge transfer error
VCTE
GND = 0 V, VIH = 5 V,
f = 1 MHz, TA = +25°C 4/
GND = 0 V, VIH = 5 V,
f = 1 MHz, TA = +25°C 4/
VGEN = 1 VP-P, f = 100 kHz,
TA = +25°C 2/
VGEN = 1 VP-P, f = 100 kHz,
TA = +25°C 2/
TA = +25°C 2/
±10
mV
1/ The limiting terms “min” (minimum) and “max” (maximum) shall be considered to apply to magnitudes only. Negative current
shall be defined as conventional current flow out of a device terminal.
2/ These parameters may not be tested, but shall be guaranteed to the limits specified in table I herein.
3/ Test not required if applied as a forcing function.
4/ Subgroup 4 (CA, CIS, and COS measurements) shall be measured only for the initial test and after process or design changes
which may affect capacitance.
3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535
listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of
compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see
6.6.2 herein). The certificate of compliance submitted to DLA Land and Maritime-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MILPRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for
device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing.
3.8 Notification of change for device class M. For device class M, notification to DLA Land and Maritime -VA of change of
product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing.
3.9 Verification and review for device class M. For device class M, DLA Land and Maritime, DLA Land and Maritime’s agent,
and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore
documentation shall be made available onshore at the option of the reviewer.
3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in
microcircuit group number 82 (see MIL-PRF-38535, appendix A).
STANDARD
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REVISION LEVEL
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SHEET
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Device types
Case outlines
Terminal number
01, 02, and 03
E
2
Terminal symbol
1
IN1
NC
2
3
D1
S1
IN1
D1
4
5
VGND
S1
V-
6
7
S4
D4
NC
GND
8
9
IN4
IN3
S4
D4
10
11
D3
S3
IN4
NC
12
13
NC
V+
IN3
D3
14
15
S2
D2
S3
NC
16
17
IN2
----
NC
V+
18
19
-------
S2
D2
20
----
IN2
NOTES:
1. NC = No connection
2. The source and drain are interchangeable and have
been arbitrarily established.
FIGURE 1. Terminal connections.
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FIGURE 2. Functional diagram.
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NOTE: Rise time and fall time ≤ 20 ns.
FIGURE 3. Test circuit and switching waveforms.
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4. VERIFICATION
4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with
MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan
shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in
accordance with MIL-PRF-38535, appendix A.
4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted
on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in
accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection.
4.2.1 Additional criteria for device class M.
a.
Burn-in test, method 1015 of MIL-STD-883.
(1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision
level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
(2) TA = +125°C, minimum.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
4.2.2 Additional criteria for device classes Q and V.
a.
The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under
document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
method 1015 of MIL-STD-883.
b.
Interim and final electrical test parameters shall be as specified in table IIA herein.
c.
Additional screening for device class V beyond the requirements of device class Q shall be as specified in
MIL-PRF-38535, appendix B.
4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in
accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups
A, B, C, D, and E inspections (see 4.4.1 through 4.4.4).
4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with
MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified herein. Quality conformance inspection for
device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed
for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections
(see 4.4.1 through 4.4.4).
4.4.1 Group A inspection.
a.
Tests shall be as specified in table IIA herein.
b.
Subgroups 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
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MICROCIRCUIT DRAWING
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REVISION LEVEL
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TABLE II. Electrical test requirements.
Test requirements
Interim electrical
parameters (see 4.2)
Final electrical
parameters (see 4.2)
Group A test
requirements (see 4.4)
Group C end-point electrical
parameters (see 4.4)
Group D end-point electrical
parameters (see 4.4)
Group E end-point electrical
parameters (see 4.4)
Subgroups
(in accordance with
MIL-STD-883,
method 5005, table I)
Device
class M
Device
class Q
Device
class V
1
1
1
1, 2, 3, 9, 10, 11 1/
1, 2, 3, 9, 10, 11
1/
1, 2, 3, 4, 7, 8,
9, 10, 11 1/, 2/
1, 2, 3, 4, 7, 8, 9, 10,
11
1, 2, 3, 4, 7, 8,
9, 10, 11
1, 2, 3, 4, 7, 8,
9, 10, 11
1
1
1 2/
1
1
1
----
----
----
Subgroups
(in accordance with
MIL-PRF-38535, table III)
1/ PDA applies to subgroup 1. Exclude delta from PDA.
2/ See table IIB for delta measurement parameters.
Table IIB. 240 hour burn-in and group C end-point electrical parameters.
Parameter
Device type
Burn-in
limit
Life test
limit
Delta
RDS(ON)
03
50 Ω
65 Ω
±15 Ω
ID(OFF)
03
±1 nA
±1 nA
±1 nA
IS(ON) + ID(ON)
03
±1 nA
±1 nA
±1 nA
4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883:
a.
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
b.
TA = +125°C, minimum.
c.
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-86716
A
REVISION LEVEL
E
SHEET
12
4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature,
or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The
test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with
MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the
inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of
MIL-STD-883.
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein).
a.
End-point electrical parameters shall be as specified in table IIA herein.
b.
For device classes Q and V, the devices or test vehicle shall be subjected to radiation hardness assured tests as
specified in MIL-PRF-38535 for the RHA level being tested. For device class M, the devices shall be subjected to
radiation hardness assured tests as specified in MIL-PRF-38535, appendix A for the RHA level being tested. All device
classes must meet the postirradiation end-point electrical parameter limits as defined in table I at TA = +25°C ±5°C,
after exposure, to the subgroups specified in table IIA herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes
Q and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor
prepared specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal.
6.3 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and which SMD's are applicable to that system. DLA Land and Maritime will maintain a record of users and
this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic
devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-8108.
6.4 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990,
or telephone (614) 692-0540.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in
MIL-HDBK-103 and QML-38535. The vendors listed in MIL-HDBK-103 and QML-38535 have submitted a certificate of
compliance (see 3.6 herein) to DLA Land and Maritime -VA and have agreed to this drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103.
The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been
submitted to and accepted by DLA Land and Maritime -VA.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-86716
A
REVISION LEVEL
E
SHEET
13
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 15-08-20
Approved sources of supply for SMD 5962-86716 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
5962-86716012A
Vendor
CAGE
number
34371
Vendor
similar
PIN 2/
HI4-201HS/883
5962-86716012A
17856
DG201HSAZ/883
5962-8671601EA
34371
HI1-201HS/833
5962-8671601EA
17856
DG201HSAK/883
5962-86716022A
17856
DG271AZ/883
5962-8671602EA
17856
DG271AK/883
5962-86716032A
3/
ADG201HSTE/883B
5962-8671603EA
3/
ADG201HSTQ/883B
5962-8671603VEA
3/
ADG201HSTQ/QMLV
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
3/ Not available from an approved source of supply.
Vendor CAGE
number
Vendor name
and address
34371
Intersil Corporation
1650 Robert J. Conlan Blvd. NE
Palm Bay, FL 32905-3406
17856
Siliconix, Inc.
2201 Laurelwood Road
Santa Clara, CA 95054-1516
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.