Download Datasheet

STPS5045S
Power Schottky rectifier
Datasheet − production data
Features
A
■
Low forward voltage drop
■
Very small conduction losses
■
Negligible switching losses
■
Extremely fast switching
■
Low thermal resistance
■
200 °C maximum junction temperature
■
K
A
K
A
A
Avalanche rated
D2PAK
STPS5045SG-TR
Description
This device is a dual center tap Schottky rectifier
suited for switch mode power supply and high
frequency DC to DC converters.
j
Table 1.
Packaged in D2PAK, this device is especially
intended for use in low voltage, high frequency
inverters, freewheeling and polarity protection
applications. Also ideal for PV cell-bypass diode
for junction and smart junction boxes.
June 2012
This is information on a product in full production.
Doc ID022861 Rev 1
Device summary
Symbol
Value
IF(AV)
50 A
VRRM
45 V
Tj (max)
200 °C
VF(max)
0.48 V
1/7
www.st.com
7
Characteristics
1
STPS5045S
Characteristics
Table 2.
Absolute ratings (limiting values at 25 °C unless otherwise specified)
Symbol
Value
Unit
VRRM
Repetitive peak reverse voltage
45
V
IF(RMS)
Forward rms current
90
A
50
A
IF(AV)
Average forward current δ = 0.5
IFSM
Surge non repetitive forward current
tp = 10 ms sinusoidal
600
A
PARM
Repetitive peak avalanche power
tp = 10 µs Tj = 125 °C
1200
W
-65 to +175
°C
+200
°C
+175
°C
Value
Unit
1.0
°C/W
Tstg
Tj(1)
1.
Parameter
Tc = 135 °C
Storage temperature range
Maximum operating junction temperature in DC forward
mode(2)
Maximum operating junction temperature
1
dPtot <
condition to avoid thermal runaway for a diode on its own heatsink
Rth(j-a)
dTj
2. Maximum operating junction temperature only in DC forward mode
Table 3.
Thermal resistance
Symbol
Rth(j-c)
Table 4.
Symbol
IR
(1)
Parameter
Junction to case
Static electrical characteristics
Parameter
Test conditions
Reverse leakage current
Forward voltage drop
Max.
VR = VRRM
0.090
0.36
Tj = 75 °C
VR = 20 V
0.7
1.9
Tj = 125 °C
VR = VRRM
65
185
0.55
0.61
0.48
0.56
Tj = 125 °C
Tj = 200 °C
IF = 50 A
Unit
mA
V
IF = 10 A
0.22
IF =20 A
0.28
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses use the following equation:
P = 0.38 x IF(AV) + 0.0036 IF2(RMS)
2/7
Typ.
Tj = 25 °C
Tj = 25 °C
VF(2)
Min.
Doc ID022861 Rev 1
STPS5045S
Figure 1.
Characteristics
Average forward power dissipation Figure 2.
versus average forward current
PF(AV)(W)
45
60
δ = 0.1 δ = 0.2
Average forward current versus
ambient temperature
(δ = 0.5)
IF(AV)(A)
δ = 0.5
40
Rth(j -a)=Rth(j-c)
50
δ = 0.05
35
40
δ=1
30
25
30
20
15
20
T
T
10
10
5
IF(AV)(A)
0
0
10
Figure 3.
1
20
30
40
δ=tp/T
50
δ=tp/T
tp
Tamb(°C)
tp
0
60
70
Normalized avalanche power
derating versus pulse duration
0
25
Figure 4.
PARM(tp)
PARM(10µs)
1.0
50
75
100
125
150
175
Relative variation of thermal
impedance junction to case versus
pulse duration
Zth(j-c)/Rth(j-c)
0.9
0.8
0.7
0.1
0.6
0.5
0.4
0.3
0.01
0.2
0.1
tp(µs)
0.001
1
10
Single pulse
0.0
1.E-05
100
tp(s)
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1000
Doc ID022861 Rev 1
3/7
Characteristics
Figure 5.
STPS5045S
Reverse leakage current versus
reverse voltage applied
(typical values)
Figure 6.
C(pF)
IR(mA)
1.E+03
Junction capacitance versus
reverse voltage applied
(typical values)
10000
F=1MHz
Vosc =30mVRMS
Tj =25°C
Tj =150°C
1.E+02
Tj =125°C
1.E+01
Tj =100°C
Tj =75°C
1.E+00
1000
Tj =50°C
1.E-01
Tj =25°C
1.E-02
VR(V)
1.E-03
0
5
Figure 7.
1000.0
10
15
20
25
30
35
40
VR(V)
100
45
Forward voltage drop versus
forward current
1
Figure 8.
IFM(A)
100
Thermal resistance junction to
ambient versus copper surface
under tab
Rth(j-a)(°C/W)
80
Tj =125°C
(Maximum values)
100.0
10
epoxy printed circuit board FR4, copper thickness = 35 µm, D2PAK
70
Tj =125°C
(Typical values)
60
Tj =200°C
(Typical values)
50
Tj =25°C
(Maximum values)
10.0
40
30
20
1.0
10
VFM(V)
0.0
4/7
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
S(Cu)(cm²)
0
0.1
1.0
0
Doc ID022861 Rev 1
5
10
15
20
25
30
35
40
STPS5045S
2
Package information
Package information
●
Epoxy meets UL94, V0
●
Cooling method: by conduction (C)
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Table 5.
D2PAK dimensions
Dimensions
Ref
A
E
C2
L2
Millimeters
Inches
Min.
Max.
Min.
Max.
A
4.40
4.60
0.173
0.181
A1
2.49
2.69
0.098
0.106
A2
0.03
0.23
0.001
0.009
B
0.70
0.93
0.027
0.037
B2
1.14
1.70
0.045
0.067
C
0.45
0.60
0.017
0.024
C2
1.23
1.36
0.048
0.054
D
8.95
9.35
0.352
0.368
E
10.00
10.40
0.393
0.409
G
4.88
5.28
0.192
0.208
L
15.00
15.85
0.590
0.624
L2
1.27
1.40
0.050
0.055
L3
1.40
1.75
0.055
0.069
M
2.40
3.20
0.094
0.126
D
L
L3
A1
B2
R
C
B
G
A2
M
*
V2
* FLAT ZONE NO LESS THAN 2mm
R
V2
Figure 9.
0.40 typ.
0°
8°
0.016 typ.
0°
8°
Footprint (dimensions in millimeters)
16.90
10.30
5.08
1.30
8.90
Doc ID022861 Rev 1
3.70
5/7
Ordering information
3
Ordering information
Table 6.
4
Ordering information
Order code
Marking
Package
Weight
Base qty
Delivery mode
STPS5045SG-TR
STPS5045SG
D2PAK
1.48 g
1000
Tape and reel
Revision history
Table 7.
6/7
STPS5045S
Revision history
Date
Revision
28-June-2012
1
Changes
First issue.
Doc ID022861 Rev 1
STPS5045S
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY TWO AUTHORIZED ST REPRESENTATIVES, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2012 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
Doc ID022861 Rev 1
7/7
Similar pages