506AQ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN8 2x2, 0.5P
CASE 506AQ
ISSUE B
DATE 11 DEC 2012
1
SCALE 4:1
A B
D
0.10 C
2X
2X
0.10 C
E
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
ÏÏ
ÏÏ
TOP VIEW
EXPOSED Cu
A
(A3)
0.10 C
ALTERNATE
CONSTRUCTION
0.08 C
SIDE VIEW
DETAIL A
1
8X
D2
C
MOLD CMPD
DETAIL B
A1
NOTE 4
L
L1
ÎÎÎ
ÎÎÎ
PIN ONE
REFERENCE
L
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.20
0.30
2.00 BSC
1.10
1.30
2.00 BSC
0.50
0.70
0.50 BSC
0.20
−−−
0.25
0.45
−−−
0.15
GENERIC
MARKING DIAGRAM*
4
E2
L
1
XXMG
G
K
5
8
e
e/2
BOTTOM VIEW
8X
b
0.10 C A B
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
1.40
PACKAGE
OUTLINE
8X
0.57
2.30
0.75
1
8X
0.30
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
STYLE 1:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
7. CATHODE
8. CATHODE
STYLE 2:
PIN 1. ENABLE
2. DIM
3. N/C
4. GND
5. DRAIN1
6. DRAIN2
7. SOURCE2
8. SOURCE1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON21115D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN8 2.0X2.0, 0.5MM PITCH 1
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON21115D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. TAM
17 JUN 2005
A
ADDED SOLDERING FOOTPRINT. REQ. BY A. TAM
11 AUG 2005
B
ADDED DETAILS A & B SHOWING ALTERNATE TERMINAL CONSTRUCTIONS.
REQ. BY M. BEGONIA.
11 DEC 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
December, 2012 − Rev. B
Case Outline Number:
506AQ
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