506AC

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
DFN16, 4x1.6, 0.5P
CASE 506AC
ISSUE D
16
1
SCALE 4:1
DATE 22 AUG 2013
A
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION b APPLIES TO TERMINAL AND
IS MEASURED BETWEEN 0.25 AND 0.30 MM
FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
B
PIN ONE
REFERENCE
2X
E
0.15 C
2X
(A3)
TOP VIEW
0.15 C
L
(A3)
0.10 C
L1
A
16X
SEATING
PLANE
0.08 C
A1
SIDE VIEW
16X
L
C
e
1
2X
0.25 x 0.40 mm
TEST PAD SIZE
8
E2
16X
K
16
MILLIMETERS
MIN
MAX
0.80
1.00
0.00
0.05
0.20 REF
0.18
0.30
4.00 BSC
3.10
3.30
1.60 BSC
0.30
0.50
0.50 BSC
0.20
−−−
0.20
0.40
0.00
0.15
GENERIC
MARKING DIAGRAM*
D2
DETAIL A
DETAIL A
OPTIONAL
CONSTRUCTION
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
9
16X b
NOTE 3
BOTTOM VIEW
0.10 C A B
0.05 C
RECOMMENDED
SOLDERING FOOTPRINT*
XXX
= Specific Device Code
A
= Assembly Location
Y
= Year
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
4.10
0.50 PITCH
0.50
XXX
AYWG
G
1.91
16X
0.28
16X 0.51
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON19168D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
DFN16, 4.0X1.6 MM, 0.5 LEAD 1PITCH
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON19168D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. TAM.
13 SEP 2004
A
CHANGED MARKING DIAGRAM. REQ. BY A. TAM.
07 JAN 2005
B
ADDED SOLDERING FOOTPRINT. REQ. BY A. TAM.
08 JUN 2005
C
ADDED DETAIL A AND DIMENSION L1. REQ. BY K. LIM.
14 JAN 2010
D
ROTATED GENERIC MARKING DIAGRAM 90 DEGREES COUNTER−CLOCKWISE.
REQ. BY M. BEGONIA.
22 AUG 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
August, 2013 − Rev. D
Case Outline Number:
506AC
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