517AE

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN12 2.5x1.2, 0.4P
CASE 517AE
ISSUE C
12
1
DATE 23 OCT 2012
SCALE 4:1
0.15 C
PIN ONE
REFERENCE
2X
A3
A
B
D
2X
ÏÏÏ
ÏÏÏ
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND
0.30 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
ÎÎ
ÏÏ
E
A1
DETAIL B
OPTIONAL
CONSTRUCTION
0.15 C
TOP VIEW
(A3)
DETAIL B
A
0.10 C
12X
SEATING
PLANE
0.08 C
SIDE VIEW
C
A1
L1
D2
DETAIL A
12X
L
1
e
(0.10)
E2
MILLIMETERS
MIN
NOM MAX
0.45
0.50
0.55
0.00
0.03
0.05
0.127 REF
0.15
0.20
0.25
2.50 BSC
1.70
1.80
1.90
1.20 BSC
0.20
0.30
0.40
0.40 BSC
0.20 TYP
0.20
0.25
0.30
−−−
−−−
0.10
GENERIC
MARKING DIAGRAM*
10X
6
L
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
XXXM
G
DETAIL A
12X
K
12
7
BOTTOM VIEW
OPTIONAL
CONSTRUCTION
12X
b
0.10 C A B
0.05 C
NOTE 3
1
XXX
M
G
= Specific Device Code
= Month Code
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
SOLDERING FOOTPRINT*
1.50
0.35
0.40
1.90
11X
0.25
0.40 PITCH
12 X
0.45
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON22155D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN12 2.5X1.2, 0.4P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON22155D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY A. TAM.
05 MAY 2006
A
REMOVED TWO END CONTACTS FROM SOLDERING FOOTPRINT DIAGRAM,
REQ. BY A. TAM.
07 APR 2009
B
MODIFIED SOLDERING FOOTPRINT DIMENSIONS. REQ. BY A. TAM.
21 APR 2009
C
CHANGED DIMENSION K FROM 0.20 MIN TO 0.20 TYP. REQ. BY M. BEGONIA.
23 OCT 2012
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2012
October, 2012 − Rev. C
Case Outline Number:
517AE
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