AT25010B, AT25020B, AT25040B SPI Serial EEPROM 1K (128x8), 2K (256x8), 4K (512x8) DATASHEET Features Serial Peripheral Interface (SPI) Compatible Supports SPI Modes 0 (0,0) and 3 (1,1) ̶ Data Sheet Describes Mode 0 Operation Low-voltage and Standard-voltage Operation ̶ VCC = 1.8V to 5.5V 20MHz Clock Rate (5V) 8-byte Page Mode Block Write Protection ̶ Protect 1/4, 1/2, or Entire Array Write Protect (WP) Pin and Write Disable Instructions for Both Hardware and Software Data Protection Self-timed Write Cycle (5ms max) High Reliability ̶ ̶ Endurance: 1,000,000 Write Cycles Data Retention: 100 Years Green (Pb/Halogen-free/RoHS Compliant) Packaging Options Die Sales: Wafer Form, Waffle Pack, and Bumped Wafers Description The Atmel® AT25010B/020B/040B provides 1,024/2,048/4,096 bits of Serial Electrically Erasable Programmable Read-Only Memory (EEPROM) organized as 128/256/512 words of 8 bits each. The device is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT25010B/020B/040B is available in space saving, JEDEC SOIC, UDFN, TSSOP, XDFN, and VFBGA packages. The AT25010B/020B/040B is enabled through the Chip Select pin (CS) and accessed via a 3-Wire interface consisting of Serial Data Input (SI), Serial Data Output (SO), and Serial Clock (SCK). All programming cycles are completely self-timed, and no separate erase cycle is required before write. Block Write protection is enabled by programming the status register with one of four blocks of Write Protection. Separate Program Enable and Program Disable instructions are provided for additional data protection. Hardware Data Protection is provided via the WP pin to protect against inadvertent write attempts. The HOLD pin may be used to suspend any serial communication without resetting the serial sequence. Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 1. Pin Configurations Table 1-1. Pin Configurations Pin Name Function CS Chip Select SCK Serial Data Clock SI Serial Data Input SO Serial Data Output GND Ground VCC Power Supply WP Write Protect HOLD Suspends Serial Input 8-lead TSSOP 8-lead SOIC CS 1 8 VCC SO 2 7 HOLD WP 3 6 SCK GND 4 5 SI CS SO WP GND 1 2 3 4 8 7 6 5 VCC HOLD SCK SI Top View Top View 8-pad UDFN/XDFN VCC 8 1 CS VCC 8 1 CS HOLD 7 2 SO HOLD 7 2 SO SCK 6 3 WP SCK 6 3 WP SI 5 4 GND SI 5 4 GND Bottom View Note: 2. Bottom View Drawings are not to scale. Absolute Maximum Ratings* Operating Temperature . . . . . . . . . . -40C to + 125C Storage Temperature . . . . . . . . . . . . -65C to + 150C Voltage on any pin with respect to ground . . . . . . . . . . . . . . . . -1V to + 7V Maximum Operating Voltage . . . . . . . . . . . . . . . 6.25V DC Output Current . . . . . . . . . . . . . . . . . . . . . . . . 5mA 2 8-ball VFBGA AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 *Notice: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 3. Block Diagram Figure 3-1. Block Diagram VCC Status Register Memory Array 128/256/512 x 8 Address Decoder Data Register Output Buffer Mode Decode Logic Clock Generator AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 3 4. Electrical Characteristics 4.1 Pin Capacitance Table 4-1. Pin Capacitance(1) Applicable over recommended operating range from TA = 25°C, f = 1MHz, VCC = +5V (unless otherwise noted). Symbol Test Conditions COUT CIN Note: 4.2 1. Max Units Conditions Output Capacitance (SO) 8 pF VOUT = 0V Input Capacitance (CS, SCK, SI, WP, HOLD) 6 pF VIN = 0V This parameter is characterized and is not 100% tested. DC Characteristics Table 4-2. DC Characteristics Applicable over recommended operating range from: TAI = -40C to +85C, VCC = +1.8V to +5.5V, (unless otherwise noted). Symbol Parameter VCC1 Supply Voltage VCC2 Max Units 1.8 5.5 V Supply Voltage 2.5 5.5 V VCC3 Supply Voltage 4.5 5.5 V ICC1 Supply Current VCC = 5V at 20MHz SO = Open, Read 8.5 10 mA ICC2 Supply Current VCC = 5V at 10MHz SO = Open, Read, Write 4.5 5 mA ICC3 Supply Current VCC = 5V at 1MHz SO = Open, Read, Write 2 3 mA ISB1 Standby Current VCC = 1.8V, CS = VCC 0.1 0.5 μA ISB2 Standby Current VCC = 2.5V, CS = VCC 0.2 1 μA ISB3 Standby Current VCC = 5V, CS = VCC 2 3.5 μA IIL Input Leakage VIN = 0V to VCC 3 IOL Output Leakage VIN = 0V to VCC TAC = 0°C to 70°C 3 3 μA VIL(1) Input Low-voltage 0.6 VCC x 0.3 V VIH(1) Input High-voltage VCC x 0.7 VCC + 0.5 V VOL1 Output Low-voltage 3.6V VCC 5.5V IOL = 3mA 0.4 V VOH1 Output High-voltage 3.6V VCC 5.5V IOH = 1.60mA VOL2 Output Low-voltage 1.8V VCC 3.6V IOL = 0.15mA VOH2 Output High-voltage 1.8V VCC 3.6V IOH = 100μA Note: 4 1. Test Condition Min VIL min and VIH max are reference only and are not tested. AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 Typ μA VCC 0.8 V 0.2 VCC 0.2 V V 4.3 AC Characteristics Table 4-3. AC Characteristics Applicable over recommended operating range from TAI = -40 to +85°C, VCC = As Specified, CL = 1 TTL Gate and 30pF (unless otherwise noted). Symbol Parameter Voltage Min Max Units fSCK SCK Clock Frequency 4.5 5.5 2.5 5.5 1.8 5.5 0 0 0 20 10 5 MHz tRI Input Rise Time 4.5 5.5 2.5 5.5 1.8 5.5 2 2 2 μs tFI Input Fall Time 4.5 5.5 2.5 5.5 1.8 5.5 2 2 2 μs tWH SCK High Time 4.5 5.5 2.5 5.5 1.8 5.5 20 40 80 ns tWL SCK Low Time 4.5 5.5 2.5 5.5 1.8 5.5 20 40 80 ns tCS CS High Time 4.5 5.5 2.5 5.5 1.8 5.5 100 100 200 ns tCSS CS Setup Time 4.5 5.5 2.5 5.5 1.8 5.5 100 100 200 ns tCSH CS Hold Time 4.5 5.5 2.5 5.5 1.8 5.5 100 100 200 ns tSU Data In Setup Time 4.5 5.5 2.5 5.5 1.85.5 20 40 80 ns tH Data In Hold Time 4.5 5.5 2.5 - 5.5 1.8 - 5.5 20 40 80 ns tHD Hold Setup Time 4.5 5.5 2.5 5.5 1.8 5.5 20 40 80 ns tCD Hold Hold Time 4.5 5.5 2.5 5.5 1.8 5.5 20 40 80 ns tV Output Valid 4.5 5.5 2.5 5.5 1.8 5.5 0 0 0 tHO Output Hold Time 4.5 5.5 2.5 5.5 1.8 5.5 0 0 0 20 40 80 ns ns AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 5 Table 4-3. AC Characteristics (Continued) Applicable over recommended operating range from TAI = -40 to +85°C, VCC = As Specified, CL = 1 TTL Gate and 30pF (unless otherwise noted). Symbol Parameter Voltage Min Max Units tLZ Hold to Output Low Z 4.5 5.5 2.5 5.5 1.8 5.5 0 0 0 25 50 100 ns tHZ Hold to Output High Z 4.5 5.5 2.5 5.5 1.8 5.5 25 50 100 ns tDIS Output Disable Time 4.5 5.5 2.5 5.5 1.8 5.5 25 50 100 ns tWC Write Cycle Time 4.5 5.5 2.5 5.5 1.8 5.5 5 5 5 ms Endurance(1) 5V, 25C, Page Mode Note: 5. 1. 1,000,000 Write Cycles This parameter is characterized and is not 100% tested. Serial Interface Description Master: The device that generates the serial clock. Slave: Because the Serial Clock pin (SCK) is always an input, the AT25010B/020B/040B always operates as a slave. Transmitter/Receiver: The AT25010B/020B/040B has separate pins designated for data transmission (SO) and reception (SI). MSB: The Most Significant Bit (MSB) is the first bit transmitted and received. Serial Opcode: After the device is selected with CS going low, the first byte will be received. This byte contains the opcode which defines the operations to be performed. The opcode also contains address bit A8 in both the read and write instructions for the AT25040B. Invalid Opcode: If an invalid opcode is received, no data will be shifted into the AT25010B/020B/040B, and the serial output pin (SO) will remain in a high-impedance state until the falling edge of CS is detected again. This will reinitialize the serial communication. Chip Select: The AT25010B/020B/040B is selected when the CS pin is low. When the device is not selected, data will not be accepted via the SI pin, and the SO pin will remain in a high impedance state. Hold: The HOLD pin is used in conjunction with the CS pin to select the AT25010B/020B/040B. When the device is selected and a serial sequence is underway, HOLD can be used to pause the serial communication with the master device without resetting the serial sequence. To pause, the HOLD pin must be brought low while the SCK pin is low. To resume serial communication, the HOLD pin is brought high while the SCK pin is low (SCK may still toggle during HOLD). Inputs to the SI pin will be ignored while the SO pin is in the high impedance state. Write Protect: The write protect pin (WP) will allow normal read/write operations when held high. When the WP pin is brought low, all write operations are inhibited. WP going low while CS is still low will interrupt a write to the AT25010B/020B/040B. If the internal write cycle has already been initiated, WP going low will have no effect on any write operation. 6 AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 Figure 5-1. SPI Serial Interface Master: Microcontroller Data Out (MOSI) Data In (MISO) Serial Clock (SPI CK) SS0 SS1 SS2 SS3 Slave: AT25010B/020B/040B SI SO SCK CS SI SO SCK CS SI SO SCK CS SI SO SCK CS AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 7 6. Functional Description The AT25010B/020B/040B is designed to interface directly with the synchronous Serial Peripheral Interface (SPI) of the 6805 and 68HC11 series of microcontrollers. The AT25010B/020B/040B utilizes an 8-bit instruction register. The list of instructions and their operation codes are contained in Figure 6-1. All instructions, addresses, and data are transferred with the MSB first and start with a high-to-low CS transition. Table 6-1. Instruction Set for the AT25010B/020B/040B Instruction Name Instruction Format WREN 0000 X110 Set Write Enable Latch WRDI 0000 X100 Reset Write Enable Latch RDSR 0000 X101 Read Status Register WRSR 0000 X001 Write Status Register READ 0000 A011 Read Data from Memory Array WRITE 0000 A010 Write Data to Memory Array Note: 1. Operation “A” represents MSB address bit A8 for the AT25040B. Write Enable (WREN): The device will power-up in the Write Disable state when VCC is applied. All programming instructions must therefore be preceded by a Write Enable instruction. The WP pin must be held high during a WREN instruction. Write Disable (WRDI): To protect the device against inadvertent writes, the Write Disable instruction disables all programming modes. The WRDI instruction is independent of the status of the WP pin. Read Status Register (RDSR): The Read Status Register instruction provides access to the status register. The Read/Busy and Write Enable status of the device can be determined by the RDSR instruction. Similarly, the Block Write Protection bits indicate the extent of protection employed. These bits are set by using the WRSR instruction. Table 6-2. Status Register Format Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 X X X X BP1 BP0 WEN RDY Table 6-3. Read Status Register Bit Definition Bit Definition Bit 0 (RDY) Bit 0 = 0 (RDY) indicates the device is ready. Bit 0 = 1 indicates the write cycle is in progress. Bit 1 (WEN) Bit 1 = 0 indicates the device is not write enabled. Bit 1 = 1 indicates the device is write enabled. Bit 2 (BP0) See Table 6-4. Bit 3 (BP1) See Table 6-4. Bits 4 – 7 are zeros when device is not in an internal write cycle. Bits 0 – 7 are ones during an internal write cycle. 8 AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 Write Status Register (WRSR): The WRSR instruction allows the user to select one of four levels of protection. The AT25010B/020B/040B is divided into four array segments. None, one-quarter (¼), one-half (½), or all of the memory segments can be protected. Any of the data within any selected segment will therefore be read-only. The block write protection levels and corresponding status register control bits are shown in Table 6-4. Bits BP1 and BP0 are nonvolatile cells that have the same properties and functions as the regular memory cells (e.g., WREN, tWC, RDSR). Table 6-4. Block Write Protect Bits Status Register Bits Array Addresses Protected Level BP1 BP0 AT25010B AT25020B AT25040B 0 0 0 None None None 1 (¼) 0 1 607F C0 FF 180 FF 2 (½) 1 0 40 7F 80 FF 100 1FF 3 (All) 1 1 00 7F 00 FF 000 1FF Read Sequence (READ): Reading the AT25010B/020B/040B via the SO pin requires the following sequence. After the CS line is pulled low to select a device, the Read opcode (including A8 for the AT25040B) is transmitted via the SI line followed by the byte address to be read (A7 A0). Upon completion, any data on the SI line will be ignored. The data (D7 D0) at the specified address is then shifted out onto the SO line. If only one byte is to be read, the CS line should be driven high after the data comes out. The Read Sequence can be continued since the byte address is automatically incremented and data will continue to be shifted out. When the highest address is reached, the address counter will roll-over to the lowest address allowing the entire memory to be read in one continuous read cycle. Write Sequence (WRITE): In order to program the AT25010B/020B/040B, the Write Protect pin (WP) must be held high and two separate instructions must be executed. First, the device must be write enabled via the WREN instruction. Then a Write (WRITE) instruction may be executed. Also, the address of the memory location(s) to be programmed must be outside the protected address field location selected by the Block Write Protection level. During an internal write cycle, all commands will be ignored except the RDSR instruction. A Write instruction requires the following sequence. After the CS line is pulled low to select the device, the Write opcode (including A8 for the AT25040B) is transmitted via the SI line followed by the byte address (A7 A0) and the data (D7 D0) to be programmed. Programming will start after the CS pin is brought high. The low-to-high transition of the CS pin must occur during the SCK low time immediately after clocking in the D0 (LSB) data bit. The Ready/Busy status of the device can be determined by initiating a Read Status Register (RDSR) instruction. If Bit 0 = 1, the write cycle is still in progress. If Bit 0 = 0, the write cycle has ended. Only the RDSR instruction is enabled during the write programming cycle. The AT25010B/020B/040B is capable of an 8-byte Page Write operation. After each byte of data is received, the three low-order address bits are internally incremented by one; the six high-order bits of the address will remain constant. If more than eight bytes of data are transmitted, the address counter will roll-over and the previously written data will be overwritten. The AT25010B/020B/040B is automatically returned to the Write Disable state at the completion of a write cycle. Note: If the WP pin is brought low or if the device is not Write Enabled (WREN), the device will ignore the Write instruction and will return to the standby state, when CS is brought high. A new CS falling edge is required to reinitiate the serial communication. AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 9 7. Timing Diagrams Figure 7-1. Synchronous Data Timing (for Mode 0) t CS VIH CS VIL t CSH tCSS VIH t WH SCK t WL VIL tH t SU VIH Valid In SI VIL tV VOH SO WREN Timing CS SCK SI WREN Opcode HI-Z SO Figure 7-3. WRDI Timing CS SCK SI SO 10 AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 t DIS HI-Z HI-Z VOL Figure 7-2. t HO WRDI Opcode HI-Z Figure 7-4. RDSR Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCK SI Instruction Data Out High-impedance SO 7 6 5 4 3 2 1 0 8 9 10 11 12 13 14 15 2 1 0 MSB Figure 7-5. WRSR Timing CS 0 1 2 3 4 5 6 7 SCK Data In SI 6 5 4 3 High-impedance SO Figure 7-6. 7 Instruction READ Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCK Instruction SI Byte Address 8 7 6 5 4 3 2 1 0 9th bit of Address Data Out SO High-impedance 7 6 5 4 3 2 1 0 MSB AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 11 Figure 7-7. WRITE Timing CS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 7 6 SCK Instruction SI Byte Address 8 5 4 3 2 Data In 1 0 7 6 5 4 9th bit of Address SO Figure 7-8. High-impedance HOLD Timing CS t CD t CD SCK t HD HOLD t HD t HZ SO tLZ 12 AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 3 2 1 0 8. Ordering Code Detail AT 2 5 0 1 0 B - S S H L - B Atmel Designator Product Family 25 = Standard SPI Serial EPPROM Shipping Carrier Option B = Bulk (Tubes) T = Tape and Reel, Standard Quantity Option E = Tape and Reel, Expanded Quantity Option Operating Voltage M = 1.8V to 5.5V Device Density 010 = 1k 020 = 2k 040 = 4k Device Revision Package Device Grade or Wafer/Die Thickness H = Green, NiPdAu Lead Finish, Industrial Temperature Range (-40˚C to +85˚C) U = Green, Matte Sn Lead Finish, Industrial Temperature Range (-40˚C to +85˚C) 11 = 11mil Wafer Thickness Package Option SS = X = MA = ME = C = WWU = WDT = JEDEC SOIC TSSOP UDFN XDFN VFBGA Wafer unsawn Die in Tape and Reel AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 13 9. Part Markings AT25010B, AT25020B and AT25040B: Package Marking Information 8-lead TSSOP 8-lead SOIC 8-pad UDFN 2.0 x 3.0 mm Body ### H%@ YXX ATHYWW ###% @ AAAAAAA ATMLHYWW ###% @ AAAAAAAA 8-ball VFBGA 8-pad XDFN 1.5 x 2.0 mm Body 1.8 x 2.2 mm Body ### YXX ###U YMXX PIN 1 Note 1: designates pin 1 Note 2: Package drawings are not to scale Catalog Number Truncation AT25010B Truncation Code ###: 51B AT25020B Truncation Code ###: 52B AT25040B Truncation Code ###: 54B Date Codes Y = Year 4: 2014 5: 2015 6: 2016 7: 2017 Voltages 8: 2018 9: 2019 0: 2020 1: 2021 M = Month A: January B: February ... L: December WW = Work Week of Assembly 02: Week 2 04: Week 4 ... 52: Week 52 Country of Assembly Lot Number @ = Country of Assembly AAA...A = Atmel Wafer Lot Number Trace Code % = Minimum Voltage L: 1.8V min Grade/Lead Finish Material H: Industrial/NiPdAu U: Industrial/Matte Tin/SnAgCu Atmel Truncation XX = Trace Code (Atmel Lot Numbers Correspond to Code) Example: AA, AB.... YZ, ZZ AT: Atmel ATM: Atmel ATML: Atmel 1/15/14 TITLE Package Mark Contact: [email protected] 14 25010-02-04BSM, AT25010B, AT25020B and AT25040B Package Marking Information AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 DRAWING NO. REV. 25010-02-04BSM B 10. Ordering Information Delivery Information Atmel Ordering Code Lead Finish AT25010B-SSHL-B AT25010B-XHL-B NiPdAu AT25010B-MEHL-T SnAgCu (Lead-free/Halogen-free) N/A AT25020B-SSHL-B AT25020B-XHL-B NiPdAu AT25020B-MEHL-T SnAgCu (Lead-free/Halogen-free) N/A AT25040B-SSHL-B AT25040B-XHL-B NiPdAu AT25040B-MEHL-T Note: 1. Tape and Reel 5,000 per Reel Tape and Reel 5,000 per Reel Tape and Reel 15,000 per Reel 8ME1 Tape and Reel 5,000 per Reel 8U3-1 Tape and Reel 5,000 per Reel Wafer 100 per Tube Tape and Reel 4,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Tape and Reel 5,000 per Reel Tape and Reel 15,000 per Reel 8ME1 Tape and Reel 5,000 per Reel 8U3-1 Tape and Reel 5,000 per Reel 8X Wafer SnAgCu (Lead-free/Halogen-free) N/A 100 per Tube Tape and Reel 4,000 per Reel Bulk (Tubes) 100 per Tube Tape and Reel 5,000 per Reel Tape and Reel 5,000 per Reel Tape and Reel 15,000 per Reel 8ME1 Tape and Reel 5,000 per Reel 8U3-1 Tape and Reel 5,000 per Reel Wafer Industrial Temperature (-40 to 85C) Industrial Temperature (-40 to 85C) Note 1 Bulk (Tubes) 8X Operation Range Note 1 Bulk (Tubes) 8MA2 AT25040B-MAHL-E AT25040B-WWU11L (1) 100 per Tube (Lead-free/Halogen-free) AT25040B-MAHL-T AT25040B-CUL-T Bulk (Tubes) 8X 8S1 AT25040B-SSHL-T AT25040B-XHL-T 4,000 per Reel 8MA2 AT25020B-MAHL-E AT25020B-WWU11L (1) Tape and Reel (Lead-free/Halogen-free) AT25020B-MAHL-T AT25020B-CUL-T 100 per Tube 8S1 AT25020B-SSHL-T AT25020B-XHL-T Bulk (Tubes) 8MA2 AT25010B-MAHL-E AT25010B-WWU11L (1) Quantity (Lead-free/Halogen-free) AT25010B-MAHL-T AT25010B-CUL-T Form 8S1 AT25010B-SSHL-T AT25010B-XHL-T Package Industrial Temperature (-40 to 85C) Note 1 Contact Atmel Sales for Wafer sales. AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 15 Package Type 16 8S1 8-lead, 0.15" wide, Plastic Gull Wing Small Outline (JEDEC SOIC) 8X 8-lead, 4.40mm body, Plastic Thin Shrink Small Outline Package (TSSOP) 8MA2 8-pad, 2.00mm x 3.00mm body, 0.50mm pitch, Plastic Ultra Thin Dual Flat No Lead (UDFN) 8ME1 8-pad, 1.80mm x 2.20mm body, 0.40mm pitch, Extra Thin Dual Flat No Lead (XDFN) 8U3-1 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Die Ball Grid Array (VFBGA) AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 11. Packaging Information 11.1 8S1 — 8-lead JEDEC SOIC C 1 E E1 L N Ø TOP VIEW END VIEW e b COMMON DIMENSIONS (Unit of Measure = mm) A A1 D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. SYMBOL MIN A 1.35 NOM MAX – 1.75 A1 0.10 – 0.25 b 0.31 – 0.51 C 0.17 – 0.25 D 4.80 – 5.05 E1 3.81 – 3.99 E 5.79 – 6.20 e NOTE 1.27 BSC L 0.40 – 1.27 Ø 0° – 8° 6/22/11 Package Drawing Contact: [email protected] TITLE 8S1, 8-lead (0.150” Wide Body), Plastic Gull Wing Small Outline (JEDEC SOIC) GPC SWB DRAWING NO. REV. 8S1 G AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 17 11.2 8X — 8-lead TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View End View A b A1 e D SYMBOL Side View Notes: COMMON DIMENSIONS (Unit of Measure = mm) A2 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. MIN NOM MAX A - - 1.20 A1 0.05 - 0.15 A2 0.80 1.00 1.05 D 2.90 3.00 3.10 2, 5 E NOTE 6.40 BSC E1 4.30 4.40 4.50 3, 5 b 0.19 0.25 0.30 4 e L 0.65 BSC 0.45 L1 C 0.60 0.75 1.00 REF 0.09 - 0.20 2/27/14 TITLE Package Drawing Contact: [email protected] 18 8X, 8-lead 4.4mm Body, Plastic Thin Shrink Small Outline Package (TSSOP) AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 GPC TNR DRAWING NO. 8X REV. E 11.3 8MA2 — 8-pad UDFN E 1 8 Pin 1 ID 2 7 3 6 4 5 D C TOP VIEW A2 SIDE VIEW A A1 E2 b (8x) 8 7 1 D2 6 3 5 4 e (6x) K L (8x) BOTTOM VIEW Notes: COMMON DIMENSIONS (Unit of Measure = mm) 2 Pin#1 ID 1. This drawing is for general information only. Refer to Drawing MO-229, for proper dimensions, tolerances, datums, etc. 2. The Pin #1 ID is a laser-marked feature on Top View. 3. Dimensions b applies to metallized terminal and is measured between 0.15 mm and 0.30 mm from the terminal tip. If the terminal has the optional radius on the other end of the terminal, the dimension should not be measured in that radius area. 4. The Pin #1 ID on the Bottom View is an orientation feature on the thermal pad. SYMBOL MIN NOM MAX A 0.50 0.55 0.60 A1 0.0 0.02 0.05 A2 - - 0.55 D 1.90 2.00 2.10 D2 1.40 1.50 1.60 E 2.90 3.00 3.10 E2 1.20 1.30 1.40 b 0.18 0.25 0.30 C L 3 1.52 REF 0.30 e K NOTE 0.35 0.40 0.50 BSC 0.20 - - 11/26/14 Package Drawing Contact: [email protected] TITLE 8MA2, 8-pad 2 x 3 x 0.6mm Body, Thermally Enhanced Plastic Ultra Thin Dual Flat No-Lead Package (UDFN) GPC DRAWING NO. REV. YNZ 8MA2 G AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 19 11.4 8ME1 — 8-pad XDFN D 7 8 6 5 E PIN #1 ID 2 1 3 4 A1 Top View A Side View e1 b L COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL 0.10 PIN #1 ID 0.15 b e End View MIN NOM MAX A – – 0.40 A1 0.00 – 0.05 D 1.70 1.80 1.90 E 2.10 2.20 2.30 b 0.15 0.20 0.25 e 0.40 TYP e1 1.20 REF L 0.26 0.30 NOTE 0.35 9/10/2012 Package Drawing Contact: [email protected] 20 TITLE GPC DRAWING NO. REV. 8ME1, 8-pad (1.80mm x 2.20mm body) Extra Thin DFN (XDFN) DTP 8ME1 B AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 11.5 8U3-1 — 8-ball VFBGA E D 2. b PIN 1 BALL PAD CORNER A1 A2 TOP VIEW A SIDE VIEW PIN 1 BALL PAD CORNER 3 1 2 4 d (d1) 8 7 6 5 COMMON DIMENSIONS (Unit of Measure - mm) e (e1) SYMBOL MIN NOM MAX BOTTOM VIEW A 0.73 0.79 0.85 8 SOLDER BALLS A1 0.09 0.14 0.19 A2 0.40 0.45 0.50 Notes: b 0.20 0.25 0.30 1. This drawing is for general information only. D 2. Dimension ‘b’ is measured at maximum solder ball diameter. 3. Solder ball composition shall be 95.5Sn-4.0Ag-.5Cu. NOTE 2 1.50 BSC E 2.0 BSC e 0.50 BSC e1 0.25 REF d 1.00 BSC d1 0.25 REF 6/11/13 Package Drawing Contact: [email protected] TITLE GPC DRAWING NO. 8U3-1, 8-ball, 1.50mm x 2.00mm body, 0.50mm pitch, Very Thin, Fine-Pitch Ball Grid Array Package (VFBGA) GXU 8U3-1 AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 REV. F 21 12. 22 Revision History Doc. Rev. Date Comments 8707F 01/2015 8707E 05/2014 8707D 04/2013 8707C 06/2011 8707B 10/2010 Remove Preliminary. 8707B 03/2010 Replace 8Y6 with 8MA2. 8707A 02/2010 Initial document release. Add the UDFN Expanded Quantity Option. Update the 8MA2 package outline drawing and the ordering information section. Update part markings, package drawings, package 8A2 to 8X, template, logos, and disclaimer page. No change to functional specification. Correct WRSR waveform figure 4-5, bit 7 is not writable. Update Atmel logos and disclaimer page. Correct AT25040B-SSHL marking detail. Replace 8A2 package drawing with version E. AT25010B/020B/040B [DATASHEET] Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015 XXXXXX Atmel Corporation 1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311 F: (+1)(408) 436.4200 | www.atmel.com © 2015 Atmel Corporation. / Rev.: Atmel-8707F-SEEPROM-AT25010B-020B-040B-Datasheet_012015. 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