CS201 Transistor Optocoupler

ISOCOM LTD
®
PART NUMBER
CS201
COMPONENT
ISSUE 1
SPECIFICATION
August 2013
Component Specification
For Ceramic Hermetically Sealed, Radiation Hard
Transistor Optocoupler
BS9000
M1077 IECQ
1077/M
Further copies of this document may be obtained from:
ISOCOM LIMITED
WASHINGTON, UK
NE38 0AH
www.isocom.uk.com
For sales enquiries, or further information, please contact our sales office at:
Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, UK, NE38 0AH
Tel: +44 0191 4166 546 Fax: +44 0191 4155 055
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ISOCOM LTD
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Ceramic Hermetically Sealed, Radiation Hard
Transistor Optocoupler
■ CS201
■ CS201/L2
■ CS201/L2S
Features
Applications
▪ Released to European Standard and
complies to Mil Std
▪ Space Radiation Equipment
▪ Hermetically Sealed
▪ Military, high reliability system
▪ High Isolation 1500Vdc
▪ Medical instruments
▪ 6 Pin Dual In Line Package
▪ Mos, Cmos Applications
▪ Low Input Requirements
▪ Logic Interfacing
▪ High Current Transfer Ratio
▪ Data Transmission
 Total Ionizing Dose Tested to 150KRad(si)
▪ Power Supply
▪ Displacement Damage Tested to 1 MEV x10¹²
Description
These devices are single, hermetically sealed optically coupled isolators. Each channel is composed of a Gallium
Arsenide infra-red emitting diode and a silicon phototransistor. The CS200 series is being used in environments
encounted by space applications. It is manufactured to JANS standard in conjunction with MIL-PRF-19500
procedures (please see next page for all other applicable specifications). Package styles for this device include 6
Pin DIL Package with surface mount, solder dip option available.
Absolute maximum ratings, recommended operating conditions, electrical specifications and performance
characteristics are identical for all units. Any exceptions, due to packaging variations and limitations, are as noted.
For sales enquiries, or further information, please contact our sales office at:
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Tel: +44 0191 4166 546 Fax: +44 0191 4155 055
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Standards
The following specifications have been complied with in the manufacturing of this product:
Military Compliance Specifications
MIL-PRF-19500 – General Specification for Discrete Semiconductor Devices
IECQ – M1077
Military Compliance Standards
MIL-STD-202 – Test Method Standard Electronic and Electrical Component Parts
MIL-STD-883 – Test Method Standard Microcircuits
MIL-STD-750 – Test Methods for Semiconductor Devices
ISO 9001:2008 – Manufacturing of Optocouplers and Optoelectronic components.
Amendment Record
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Selection Guide Package Styles and Configuration Options
Package
6 pin DIL
Lead Style
Channels
Common Channel Wiring
Isocom Part Number and Options
Commercial
Defense Screen Level
Space Screen Level
Standard Gold Plate Finish
Butt Joint
Solder Dipped
Gull Wing
Butt Joint
1
CS201
CS201/L2
CS201/L2S
Gold Plate
Option 10
Option 20
Option 30
Option 60
Functional Diagrams
CS201
6 pin DIL
1 Channel
Device Marking
ISOCOM
XXXXXXX
XXXX
Outline Drawings
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Manufacturer
Isocom Part Number
Date Code (XX year XX week)
ISOCOM LTD
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Hermetic Optocoupler Options
Option
10
Description
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial hi-rel product in 6, 8 and 16 pin DIP
4.32 (0.17)
Max
0.51 (0.02)
Min
1.14 (0.045)
1.40 (0.055)
2.29 (0.09)
2.79 (0.11)
0.51 (0.02)
Max
4.32 (0.17)
Max
0.51 (0.2)
Min
2.29 (0.09)
2.79 (0.11)
0.51 (0.02)
Max
0.2 (0.008)
0.33 (0.013)
7.36 (0.29)
7.87 (0.31)
1.14 (0.045)
1.40 (0.055)
20
30
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is
available on commercial and hi-rel product in 6, 8 and 16 pin DIP.
4.57 (0.18)
Max
0.51 (0.02)
Min
2.29 (0.9)
2.79 (0.11)
5 deg
4.57 (0.18) Max
Max
0.51 (0.02)
Min
2.29 (0.09)
2.79 (0.11)
60
1.4 (0.055)
1.65 (0.065)
0.51 (0.02)
Max
4.57 (0.18)
Max
0.2 (0.008)
0.33 (0.013)
1.4 (0.055)
1.65 (0.065)
0.51 (0.02)
Max
9.65 (0.38)
9.91 (0.39)
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial hi-rel product in 6, 8 and 16 pin DIP
3.81 (0.15)
Min
0.51 (0.02)
Min
2.29 (0.09)
2.79 (0.11)
1.14 (0.045)
1.25 (0.049)
0.2 (0.008)
0.33 (0.013)
7.36 (0.29)
7.87 (0.31)
For sales enquiries, or further information, please contact our sales office at:
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3.81 (0.15)
Max
0.51 (0.02)
Min
2.29 (0.09)
2.79 (0.11)
1.02 (0.04)
Typ
ISOCOM LTD
®
Absolute Maximum Ratings
TA = 25°C U.O.S.
Storage Temperature
Operating Temperature
Lead Soldering Temperature
Input-to-Output Isolation Voltage
-65°C to +150°C
-55°C to +125°C
260°C 1.6mm from case for 10s
1500VDC
Input Diode
Average Forward Current
Reverse Voltage
Peak forward Current
Power Dissipation
50mA
7V
1.5A
100mW
1μS,
Derate linearly 1.6mW/ºC above 100ºC
70V
7V
70V
100mA
150mW
 10µS
t= 1mS
Derate linearly above 100ºC at 1.4W/ºC
Output Transistor
Collector-Emitter Voltage
Emitter-Collector Voltage
Collector-Base Voltage
Collector Current
Power Dissipation
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Electrical Characteristics
TA = 25°C U.O.S.
Input Diode Electrical Characteristics
Parameter
Symbol
Forward Voltage
VF
Reverse Breakdown
Voltage
Reverse Current
Test Conditions
IF = 10mA
IF = 10mA -55°C
IF = 10mA +125°C
Min
0.7
0.7
0.7
Type
1.18
1.29
1.10
Max
1.8
1.8
1.8
Units
V
V
V
VR
IR = 0.1mA
5
-
-
V
IR
VR = 3.0V
-
-
100
µA
70
-
-
V
70
-
-
V
7
-
-
V
5
-
-
V
-
6
8
100
100
100
µA
µA
µA
100
-
-
%
-
-
0.3
V
1500
-
1011
5
5
-
VDC
Ω
µS
µS
-
9.0
-
µS
-
25
-
µS
Output Detector Electrical Characteristics
Collector-Emitter
Breakdown Voltage
Collector-Base
Breakdown Voltage
Emitter-Collector
Breakdown Voltage
Emitter-Base
Breakdown Voltage
Collector–Emitter Leakage
Current
V(BR)CEO
V(BR)CBO
V(BR)ECO
V(BR)EBO
ICEO
IC = 1mA
IB = 100μA
IE = 0.1mA
IB = 0.1mA
VCE = 20v, IF = 0
VCE = 20v IF = 0, -55°C
VCE = 20v, IF = 0, +125°C
Coupled Electrical Characteristics
DC Current Transfer Ratio
Collector-Emitter Saturation
Voltage
Isolation Voltage
Input to Output Resistance
Rise Time
Fall Time
VCE
(Sat)
V in-out
R in-out
tr
tf
Turn on Time
ton
Turn off Time
toff
IC/IF
IF = 10.0mA, VCE = 5V (Note 1)
IC =2.5mA
IF = 10.0mA
T = 5s (Note 2)
VIO = 500V (Note 2)
RL = 100Ohms
RL = 100Ohms
RL = 100KOhms
Vcc = 5V
IF = 5.0mA
RL = 100KOhms
Vcc = 5V
IF = 5.0mA
Notes:
1)
Sample and hold pulse shall not be longer than 0.1 seconds. Duty cycle shall be 10.
2)
Measurements with inputs shorted together and outputs shorted together.
For sales enquiries, or further information, please contact our sales office at:
Isocom Ltd, 48, Hutton Close, Crowther Industrial Estate, Washington, Tyne and Wear, UK, NE38 0AH
Tel: +44 0191 4166 546 Fax: +44 0191 4155 055
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Switching Time
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GROUP TESTING to MIL-STD 750
GROUP TEST MIL‐STD‐750 Group A SG1 Visual inspection & mechanical dimensions DC static test at 25°C DC static test at 125°C and ‐55°C Dynamic test at 25°C Physical dimensions Solderability Resistance to solvents Thermal Shock Method 2071 READ AND RECORD Method 2066 Method 2026 Method 1022 Method 1056 Cond. B, 25 cycles yes yes yes Temperature cycling Hermetic seal fine and gross leak Electrical measurement Decap internal visual inspection Bond strength Die shear Intermittent operation life Method 1051, 100 cycles, ‐
55/+125°C Method 1071, Cond. H (fine), Cond. C (gross) pre and post 2075 Method 2037, Cond. D Method 2017 Method 1037, 1042, Cond D, Tab.5‐5 Method 1071, Cond. H (fine), Cond. C (gross) pre and post Method 2037, Cond. D Method 1027 pre and post Method 2037, Cond. D Method 1056, Cond. B, 25 shocks Method 1051, Cond. C, ‐55/+125°C , 25 cycles (total 45 cycles including screening) yes yes Method 1071, Cond. H (fine), Cond. C (gross) Method 1021 pre and post Method 2016, non‐operating, 1500 G, 0.5 ms, 5 blows in each orientation (X1,Y1,Z1) SG 3 Hermetic seal fine and gross leak Moisture resistance Electrical measurement Mechanical shock Vibration Constant acceleration SG 6 Electrical measurement Steady state operating life Not required as B5 is available on same lot Method 2056 Method 2006, at a peak level of 5000 G pre and post SG2 SG3 SG4 Group B SG 1 SG 2 SG 3 SG 4 SG 5 Group C SG 2 Hermetic seal fine and gross leak Electrical measurement Bond strength Acc. steady‐state operation life Electrical measurement Bond strength Thermal Shock Temperature cycling For sales enquiries, or further information, please contact our sales office at:
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yes yes yes yes yes yes yes ISOCOM LTD
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100% SCREENING to MIL-STD 750
TEST
MIL-STD-750
Internal Visual
2072
READ AND RECORD?
Sealing
(Fine Leak)
(Gross Leak)
Temp Cycling
Const. Acceler
PIND
Radiography
Initial Electrical
HTRB
Interim Electrical
Burn-In
Final Electrical
PDA
(Fine Leak)
(Gross Leak)
1071, Condition H1
1071, Condition C
1051, Condition
B‐55/+125°C, 20 Cycles.
2006, 5000G, Y1 only.
2052, Condition A
2076
125°C, ‐55°C, 25°C
1039
25°C only
1039
125°C, ‐55°C, 25°C
Max. 5%, pre/post B1
electrical and delta at RT
only
1071, Condition H1
1071, Condition C
R&R
R&R
R&R
Calculate & R
Solder Dip
Fine Leak
Gross Leak
1071, Condition H1
1071, Condition C
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For sales enquiries, or further information, please contact our sales office at:
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Tel: +44 0191 4166 546 Fax: +44 0191 4155 055
©2007 Copyright reserved to Isocom Limited
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For sales enquiries, or further information, please contact our sales office at:
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Tel: +44 0191 4166 546 Fax: +44 0191 4155 055
©2007 Copyright reserved to Isocom Limited
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