PHILIPS BUJ105AX

Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
GENERAL DESCRIPTION
High-voltage, high-speed planar-passivated npn power switching transistor in a plastic full-pack envelope intended
for use in high frequency electronic lighting ballast applications, converters, inverters, switching regulators, motor
control systems, etc.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
VCESM
VCBO
VCEO
IC
ICM
Ptot
VCEsat
hFEsat
tf
Collector-emitter voltage peak value
Collector-Base voltage (open emitter)
Collector-emitter voltage (open base)
Collector current (DC)
Collector current peak value
Total power dissipation
Collector-emitter saturation voltage
VBE = 0 V
PIN
MAX.
UNIT
0.3
11
20
700
700
400
8
16
32
1.0
15
50
V
V
V
A
A
W
V
Ths ≤ 25 ˚C
IC = 4.0 A;IB = 0.8 A
IC = 4.0 A; VCE = 5 V
IC = 5 A; IB1 = 1.0A
Fall time
PINNING - SOT186A
TYP.
PIN CONFIGURATION
SYMBOL
DESCRIPTION
c
case
1
base
2
collector
3
emitter
ns
b
case isolated
e
1 2 3
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum Rating System (IEC 134)
SYMBOL
PARAMETER
CONDITIONS
VCESM
VCEO
VCBO
IC
ICM
IB
IBM
Ptot
Tstg
Tj
Collector to emitter voltage
Collector to emitter voltage (open base)
Collector to base voltage (open emitter)
Collector current (DC)
Collector current peak value
Base current (DC)
Base current peak value
Total power dissipation
Storage temperature
Junction temperature
VBE = 0 V
Ths ≤ 25 ˚C
MIN.
MAX.
UNIT
-65
-
700
400
700
8
16
4
8
32
150
150
V
V
V
A
A
A
A
W
˚C
˚C
TYP.
MAX.
UNIT
-
3.95
K/W
55
-
K/W
THERMAL RESISTANCES
SYMBOL
PARAMETER
CONDITIONS
Rth j-hs
Junction to mounting base
With heatsink compound
Rth j-a
Junction to ambient
in free air
February 1999
1
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
ISOLATION LIMITING VALUE & CHARACTERISTIC
Ths = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
Visol
R.M.S. isolation voltage from all
three terminals to external
heatsink
f = 50-60 Hz; sinusoidal
waveform;
R.H. ≤ 65% ; clean and dustfree
Cisol
Capacitance from T2 to external f = 1 MHz
heatsink
MIN.
TYP.
-
MAX.
UNIT
2500
V
-
10
-
pF
MIN.
TYP.
MAX.
UNIT
-
-
0.2
0.5
mA
mA
400
-
0.1
1
-
mA
mA
V
10
13
8
0.3
1.0
14
23
11
1.0
1.5
34
36
15
V
V
TYP.
MAX.
UNIT
0.65
1.8
0.3
1
2.5
0.5
µs
µs
µs
1.2
20
1.7
50
µs
ns
1.4
25
1.9
100
µs
ns
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL
PARAMETER
CONDITIONS
1
ICES,ICBO
ICES
Collector cut-off current
ICEO
IEBO
VCEOsust
Collector cut-off current
Emitter cut-off current
Collector-emitter sustaining voltage
VCEsat
VBEsat
hFE
hFE
hFEsat
Collector-emitter saturation voltage
Base-emitter saturation voltage
DC current gain
VBE = 0 V; VCE = VCESMmax
VBE = 0 V; VCE = VCESMmax;
Tj = 125 ˚C
VCEO = VCEOMmax (400V)
VEB = 9 V; IC = 0 A
IB = 0 A; IC = 10 mA;
L = 25 mH
IC = 4.0A;IB = 0.8 A
IC = 4.0A;IB = 0.8 A
IC = 1 mA; VCE = 5 V
IC = 500 mA; VCE = 5 V
IC = 4.0 A; VCE = 5 V
DYNAMIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
SYMBOL
ton
ts
tf
PARAMETER
CONDITIONS
Switching times (resistive load)
ICon = 5 A; IBon = -IBoff = 1 A;
RL = 75 ohms; VBB2 = 4 V;
Turn-on time
Turn-off storage time
Turn-off fall time
Switching times (inductive load)
ts
tf
Turn-off storage time
Turn-off fall time
Switching times (inductive load)
ts
tf
Turn-off storage time
Turn-off fall time
ICon = 5 A; IBon = 1 A; LB = 1 µH;
-VBB = 5 V
ICon = 5 A; IBon = 1 A; LB = 1 µH;
-VBB = 5 V; Tj = 100 ˚C
1 Measured with half sine-wave voltage (curve tracer).
February 1999
2
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
ICon
90 %
+ 50v
100-200R
90 %
IC
10 %
ts
Horizontal
ton
tf
toff
Oscilloscope
IBon
IB
Vertical
10 %
300R
1R
tr
30ns
6V
30-60 Hz
-IBoff
Fig.1. Test circuit for VCEOsust.
Fig.4. Switching times waveforms with resistive load.
VCC
IC / mA
LC
250
IBon
100
LB
T.U.T.
10
0
-VBB
min
VCE / V
VCEOsust
Fig.2. Oscilloscope display for VCEOsust.
VCC
Fig.5. Test circuit inductive load.
= 300 V; -VBE = 5 V; LC = 200 uH; LB = 1 uH
VCC
ICon
90 %
IC
RL
VIM
10 %
RB
0
T.U.T.
ts
toff
tp
IB
tf
t
IBon
T
t
-IBoff
Fig.3. Test circuit resistive load. VIM = -6 to +8 V
VCC = 250 V; tp = 20 µs; δ = tp / T = 0.01.
RB and RL calculated from ICon and IBon requirements.
February 1999
Fig.6. Switching times waveforms with inductive load.
3
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
120
BUJ105AX
Normalised Power Derating
PD%
VCEsat/V
110
2.0
100
90
1.6
80
IC=1A
70
2A
3A
4A
1.2
60
50
0.8
40
30
0.4
20
10
0
0
20
40
60
80
Tmb / C
100
120
0.0
0.01
140
0.10
1.00
10.00
IB/A
Fig.7. Normalised power dissipation.
PD% = 100⋅PD/PD 25˚C = f (Ths)
Fig.10. Collector-Emitter saturation voltage.
Solid lines = typ values, VCEsat = f(IB); Tj=25˚C.
VBESAT/V
1.4
HFE
50
1.3
30
Tj=100C
1.2
20
25C
15
1.1
-40C
10
1
0.9
5
-40C
0.8
Tj=100C
25C
0.7
2
VCE=1V
0.6
0.01
0.05
0.1
0.3
IC/A
1
2
3
5
0.5
0.1
10
Fig.8. Typical DC current gain. hFE = f(IC)
parameter VCE
0.5
1
IC/A
2
5
10
Fig.11. Base-Emitter saturation voltage.
Solid lines = typ values, VBEsat = f(IC); at IC/IB =4.
HFE
50
VCESAT/V
0.6
30
0.5
Tj=100C
Tj=100C
20
25C
0.4
15
-40C
0.3
10
25C
0.2
5
-40C
VCE=5V
2
0.01
0.05
0.1
0.1
0.3
IC/A
1
2
3
5
0
0.2
10
Fig.9. Typical DC current gain. hFE = f(IC)
parameter VCE
February 1999
0.4
0.6
1
IC/A
2
5
6
Fig.12. Collector-Emitter saturation voltage.
Solid lines = typ values, VCEsat = f(IC); at IC/IB =4.
4
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
10
Zth / (K/W)
BUJ105AX
IC/A
11
BU1706AX
10
1
0.1
0.5
9
0.2
0.1
0.05
8
7
6
0.02
5
PD
tp
D=
tp
-5V
T
4
-3V
0.01
3
D=0
0.001
t
T
2
-1V
1
1u
10u 100u 1m 10m 100m
t/s
1
10
100
0
0
Fig.13. Transient thermal impedance.
Zth j-hs = f(t); parameter D = tp/T
100
200
300
400
500
VCEclamp/V
600
700
800
Fig.15. Reverse bias safe operating area (Tj < Tjmax)
for -Vbe = 5V,3V & 1V.
VCC
LC
IBon
-VBB
VCL
LB
T.U.T.
Fig.14. Test circuit for reverse bias safe operating
area.
Vclamp < 700V; Vcc = 150V; -Vbe = 5V,3V & 1V;
LB = 1µH; LC = 200µH.
February 1999
5
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
MECHANICAL DATA
Dimensions in mm
Net Mass: 2 g
10.3
max
4.6
max
3.2
3.0
2.9 max
2.8
Recesses (2x)
2.5
0.8 max. depth
6.4
15.8
19
max. max.
15.8
max
seating
plane
3 max.
not tinned
3
2.5
13.5
min.
1
0.4
2
3
M
1.0 (2x)
0.6
2.54
0.9
0.7
0.5
2.5
5.08
1.3
Fig.16. SOT186A; The seating plane is electrically isolated from all terminals.
Notes
1. Refer to mounting instructions for F-pack envelopes.
2. Epoxy meets UL94 V0 at 1/8".
February 1999
6
Rev 1.000
Philips Semiconductors
Product specification
Silicon Diffused Power Transistor
BUJ105AX
DEFINITIONS
Data sheet status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and
operation of the device at these or at any other conditions above those given in the Characteristics sections of
this specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
 Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the
copyright owner.
The information presented in this document does not form part of any quotation or contract, it is believed to be
accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under patent or other
industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these
products can be reasonably expected to result in personal injury. Philips customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting
from such improper use or sale.
February 1999
7
Rev 1.000