TJA1055 Enhanced fault-tolerant CAN transceiver Rev. 04 — 17 February 2009 Product data sheet 1. General description The TJA1055 is the interface between the protocol controller and the physical bus wires in a Controller Area Network (CAN). It is primarily intended for low-speed applications up to 125 kBd in passenger cars. The device provides differential receive and transmit capability but will switch to single-wire transmitter and/or receiver in error conditions. The TJA1055 is the enhanced version of the TJA1054 and TJA1054A. TJA1055 has the same functionality but in addition offering a number of improvements. The most important improvements of the TJA1055 with respect to the TJA1054 and TJA1054A are: • • • • Improved ElectroStatic Discharge (ESD) performance Lower current consumption in sleep mode Wake-up signalling on RXD and ERR without VCC active 3 V interfacing with microcontroller possible with TJA1055T/3 2. Features 2.1 Optimized for in-car low-speed communication n n n n n n n n n n Pin-to-pin compatible with TJA1054 and TJA1054A Baud rate up to 125 kBd Up to 32 nodes can be connected Supports unshielded bus wires Very low ElectroMagnetic Emission (EME) due to built-in slope control function and a very good matching of the CANL and CANH bus outputs Very high ElectroMagnetic Immunity (EMI) in normal operating mode and in low power modes Fully integrated receiver filters Transmit Data (TxD) dominant time-out function High ESD robustness: u ±8 kV Electrostatic Discharge (ESD) protection Human Body Model (HBM) for off-board pins u ±6 kV Electrostatic Discharge (ESD) protection IEC 61000-4-2 for off-board pins Low-voltage microcontroller support 2.2 Bus failure management n Supports single-wire transmission modes with ground offset voltages up to 1.5 V n Automatic switching to single-wire mode in the event of bus failures, even when the CANH bus wire is short-circuited to VCC TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver n Automatic reset to differential mode if bus failure is removed n Full wake-up capability during failure modes 2.3 Protections n n n n n Bus pins short-circuit safe to battery and to ground Thermally protected Bus lines protected against transients in an automotive environment An unpowered node does not disturb the bus lines Microcontroller interface without reverse current paths, if unpowered 2.4 Support for low power modes n Low current sleep mode and standby mode with wake-up via the bus lines n Software accessible power-on reset flag 3. Quick reference data Table 1. Quick reference data Symbol Parameter Conditions VCC supply voltage VBAT battery supply voltage no time limit Typ Max Unit 4.75 - 5.25 V −0.3 - +40 V operating mode 5.0 - 40 V load dump - - 58 V IBAT battery supply current sleep mode at VRTL = VWAKE = VINH = VBAT = 14 V; Tamb = −40 °C to +125 °C - 25 40 µA VCANH voltage on pin CANH VCC = 0 V to 5.0 V; VBAT ≥ 0 V; no time limit; with respect to any other pin −58 - +58 V VCANL voltage on pin CANL VCC = 0 V to 5.0 V; VBAT ≥ 0 V; no time limit; with respect to any other pin −58 - +58 V VO(dom) dominant output voltage VTXD = 0 V; VEN = VCC on pin CANH on pin CANL tPD(L) propagation delay TXD (LOW) to RXD (LOW) Tvj virtual junction temperature [1] ICANH = −40 mA VCC − 1.4 - - V ICANL = 40 mA - - 1.4 V - - 1.5 µs −40 - +150 °C no failures; RCAN_L = RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 4 to Figure 6 [1] Junction temperature in accordance with “IEC 60747-1”. An alternative definition is: Tvj = Tamb + P × Rth(vj-a) where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and operating ambient temperature (Tamb). TJA1055_4 Product data sheet Min © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 2 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 4. Ordering information Table 2. Ordering information Type number Package TJA1055T Name Description Version SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 TJA1055T/3 5. Block diagram BAT 14 INH WAKE STB EN VCC 10 1 7 TEMPERATURE PROTECTION WAKE-UP STANDBY CONTROL 5 6 9 11 VCC 12 2 TXD 8 DRIVER (1) RTL CANH CANL RTH TIMER VCC(2) ERR FAILURE DETECTOR PLUS WAKE-UP PLUS TIME-OUT 4 TJA1055T VCC (2) FILTER RXD 3 RECEIVER FILTER 13 001aac769 GND (1) For TJA1055T/3 current source to GND; for TJA1055T pull-up resistor to VCC. (2) Not within TJA1055T/3. Fig 1. Block diagram TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 3 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 6. Pinning information 6.1 Pinning INH 1 14 BAT TXD 2 13 GND RXD 3 12 CANL ERR 4 TJA1055T 11 CANH TJA1055T/3 STB 5 EN 6 WAKE 7 10 VCC 9 RTL 8 RTH 001aac770 Fig 2. Pin configuration 6.2 Pin description Table 3. Pin description Symbol Pin Description INH 1 inhibit output for switching an external voltage regulator if a wake-up signal occurs TXD 2 transmit data input for activating the driver to the bus lines RXD 3 receive data output for reading out the data from the bus lines ERR 4 error, wake-up and power-on indication output; active LOW in normal operating mode when a bus failure is detected; active LOW in standby and sleep mode when a wake-up is detected; active LOW in power-on standby when a VBAT power-on event is detected STB 5 standby digital control signal input; together with the input signal on pin EN this input determines the state of the transceiver; see Table 5 and Figure 3 EN 6 enable digital control signal input; together with the input signal on pin STB this input determines the state of the transceiver; see Table 5 and Figure 3 WAKE 7 local wake-up signal input (active LOW); both falling and rising edges are detected RTH 8 termination resistor connection; in case of a CANH bus wire error the line is terminated with a predefined impedance RTL 9 termination resistor connection; in case of a CANL bus wire error the line is terminated with a predefined impedance VCC 10 supply voltage CANH 11 HIGH-level CAN bus line CANL 12 LOW-level CAN bus line GND 13 ground BAT 14 battery supply voltage TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 4 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 7. Functional description The TJA1055 is the interface between the CAN protocol controller and the physical wires of the CAN bus (see Figure 9 and Figure 10). It is primarily intended for low-speed applications, up to 125 kBd, in passenger cars. The device provides differential transmit capability to the CAN bus and differential receive capability to the CAN controller. To reduce EME, the rise and fall slopes are limited. This allows the use of an unshielded twisted pair or a parallel pair of wires for the bus lines. Moreover, the device supports transmission capability on either bus line if one of the wires is corrupted. The failure detection logic automatically selects a suitable transmission mode. In normal operating mode (no wiring failures) the differential receiver is output on pin RXD (see Figure 1). The differential receiver inputs are connected to pins CANH and CANL through integrated filters. The filtered input signals are also used for the single-wire receivers. The receivers connected to pins CANH and CANL have threshold voltages that ensure a maximum noise margin in single-wire mode. A timer function (TxD dominant time-out function) has been integrated to prevent the bus lines from being driven into a permanent dominant state (thus blocking the entire network communication) due to a situation in which pin TXD is permanently forced to a LOW level, caused by a hardware and/or software application failure. If the duration of the LOW level on pin TXD exceeds a certain time, the transmitter will be disabled. The timer will be reset by a HIGH level on pin TXD. 7.1 Failure detector The failure detector is fully active in the normal operating mode. After the detection of a single bus failure the detector switches to the appropriate mode (see Table 4). The differential receiver threshold voltage is set at −3.2 V typical (VCC = 5 V). This ensures correct reception with a noise margin as high as possible in the normal operating mode and in the event of failures 1, 2, 5 and 6a. These failures, or recovery from them, do not destroy ongoing transmissions. The output drivers remain active, the termination does not change and the receiver remains in differential mode (see Table 4). Failures 3, 3a and 6 are detected by comparators connected to the CANH and CANL bus lines. Failures 3 and 3a are detected in a two-step approach. If the CANH bus line exceeds a certain voltage level, the differential comparator signals a continuous dominant condition. Because of inter operability reasons with the predecessor products TJA1054 and TJA1054A, after a first time-out the transceiver switches to single-wire operation through CANH. If the CANH bus line is still exceeding the CANH detection voltage for a second time-out, the TJA1055 switches to CANL operation; the CANH driver is switched off and the RTH bias changes to the pull-down current source. The time-outs (delays) are needed to avoid false triggering by external RF fields. TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 5 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 4. Bus failures Failure Description Termination Termination CANH (RTH) CANL (RTL) CANH driver CANL driver Receiver mode 1 CANH wire interrupted on on on on differential 2 CANL wire interrupted on on on on differential on off on CANL 3 CANH short-circuited to battery weak[1] 3a CANH short-circuited to VCC weak[1] on off on CANL 4 CANL short-circuited to ground on weak[2] on off CANH 5 CANH short-circuited to ground on on on on differential 6 CANL short-circuited to battery on weak[2] on off CANH 6a CANL short-circuited to VCC on on on on differential 7 CANL and CANH mutually short-circuited on weak[2] on off CANH [1] A weak termination implies a pull-down current source behavior of 75 µA typical. [2] A weak termination implies a pull-up current source behavior of 75 µA typical. Failure 6 is detected if the CANL bus line exceeds its comparator threshold for a certain period of time. This delay is needed to avoid false triggering by external RF fields. After detection of failure 6, the reception is switched to the single-wire mode through CANH; the CANL driver is switched off and the RTL bias changes to the pull-up current source. Recovery from failures 3, 3a and 6 is detected automatically after reading a consecutive recessive level by corresponding comparators for a certain period of time. Failures 4 and 7 initially result in a permanent dominant level on pin RXD. After a time-out the CANL driver is switched off and the RTL bias changes to the pull-up current source. Reception continues by switching to the single-wire mode via pins CANH or CANL. When failures 4 or 7 are removed, the recessive bus levels are restored. If the differential voltage remains below the recessive threshold level for a certain period of time, reception and transmission switch back to the differential mode. If any of the wiring failure occurs, the output signal on pin ERR will be set to LOW. On error recovery, the output signal on pin ERR will be set to HIGH again. In case of an interrupted open bus wire, this failure will be detected and signalled only if there is an open wire between the transmitting and receiving node(s). Thus, during open wire failures, pin ERR typically toggles. During all single-wire transmissions, EMC performance (both immunity and emission) is worse than in the differential mode. The integrated receiver filters suppress any HF noise induced into the bus wires. The cut-off frequency of these filters is a compromise between propagation delay and HF suppression. In single-wire mode, LF noise cannot be distinguished from the required signal. TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 6 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 7.2 Low power modes The transceiver provides three low power modes which can be entered and exited via STB and EN (see Table 5 and Figure 3). The sleep mode is the mode with the lowest power consumption. Pin INH is switched to HIGH-impedance for deactivation of the external voltage regulator. Pin CANL is biased to the battery voltage via pin RTL. Pins RXD and ERR will signal the wake-up interrupt even in case VCC is not present. The standby mode operates in the same way as the sleep mode but with a HIGH level on pin INH. The power-on standby mode is the same as the standby mode, however, in this mode the battery power-on flag is shown on pin ERR instead of the wake-up interrupt signal. The output on pin RXD will show the wake-up interrupt. This mode is only for reading out the power-on flag. Table 5. Mode Normal operating and low power modes Pin STB Pin EN Pin ERR Pin RXD LOW HIGH LOW HIGH wake-up interrupt signal[1] [2][3] wake-up interrupt signal[1] [2][3] Goto-sleep command LOW HIGH Sleep LOW LOW[4] Standby LOW LOW Power-on standby HIGH LOW VBAT power-on flag[5] Normal operating HIGH HIGH error flag wake-up interrupt signal[1] no error flag dominant received data Pin RTL switched to VBAT VBAT recessive received data VCC [1] Wake-up interrupts are released when entering normal operating mode. [2] For TJA1055T a diode is added in series with the high-side driver of ERR and RXD to prevent a reverse current from ERR to VCC in the unpowered state. [3] For TJA1055T/3, ERR and RXD are open-drain. [4] In case the goto-sleep command was used before. When VCC drops, pin EN will become LOW, but due to the fail-safe functionality this does not effect the internal functions. [5] VBAT power-on flag will be reset when entering normal operating mode. Wake-up requests are recognized by the transceiver through two possible channels: • The bus lines for remote wake-up • Pin WAKE for local wake-up In order to wake-up the transceiver remotely through the bus lines, a filter mechanism is integrated. This mechanism makes sure that noise and any present bus failure conditions do not result into an erroneous wake-up. Because of this mechanism it is not sufficient to simply pull the CANH or CANL bus lines to a dominant level for a certain time. To guarantee a successful remote wake-up under all conditions, a message frame with a dominant phase of at least the maximum specified tdom(CANH) or tdom(CANL) in it is required. TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 7 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver A local wake-up through pin WAKE is detected by a rising or falling edge with a consecutive level exceeding the maximum specified tWAKE. On a wake-up request the transceiver will set the output on pin INH to HIGH which can be used to activate the external supply voltage regulator. A wake-up request is signalled on ERR or RXD with an active LOW signal. So the external microcontroller can activate the transceiver (switch to normal operating mode) via pins STB and EN. To prevent a false remote wake-up due to transients or RF fields, the wake-up voltage levels have to be maintained for a certain period of time. In the low power modes the failure detection circuit remains partly active to prevent an increased power consumption in the event of failures 3, 3a, 4 and 7. To prevent a false local wake-up during an open wire at pin WAKE, this pin has a weak pull-up current source towards VBAT. However, in order to protect the transceiver against any EMC immunity issues, it is recommended to connect a not used pin WAKE to pin BAT. Pin INH is set to floating only if the goto-sleep command is entered successfully. To enter a successful goto-sleep command under all conditions, this command must be kept stable for the maximum specified td(sleep). Pin INH will be set to a HIGH level again by the following events only: • VBAT power-on (cold start) • Rising or falling edge on pin WAKE • A message frame with a dominant phase of at least the maximum specified tdom(CANH) or tdom(CANL), while pin EN or pin STB is at a LOW level • Pin STB goes to a HIGH level with VCC active To provide fail-safe functionality, the signals on pins STB and EN will internally be set to LOW when VCC is below a certain threshold voltage (VCC(stb)). An unused output pin INH can simply be left open within the application. 7.3 Power-on After power-on (VBAT switched on) the signal on pin INH will become HIGH and an internal power-on flag will be set. This flag can be read in the power-on standby mode through pin ERR (STB = 1; EN = 0) and will be reset by entering the normal operating mode. 7.4 Protections A current limiting circuit protects the transmitter output stages against short-circuit to positive and negative battery voltage. If the junction temperature exceeds the typical value of 175 °C, the transmitter output stages are disabled. Because the transmitter is responsible for the major part of the power dissipation, this will result in a reduced power dissipation and hence a lower chip temperature. All other parts of the device will continue to operate. The pins CANH and CANL are protected against electrical transients which may occur in an automotive environment. TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 8 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver POWER-ON STANDBY 10 GOTO SLEEP (5) 01 NORMAL (4) 11 STANDBY 00 (1) (2) SLEEP 00 (3) mbk949 Mode 10 stands for: Pin STB = HIGH and pin EN = LOW. (1) Mode change via input pins STB and EN. (2) Mode change via input pins STB and EN; it should be noted that in the sleep mode pin INH is inactive and possibly there is no VCC. Mode control is only possible if VCC of the transceiver is active. (3) Pin INH is activated and pins RXD and ERR are pulled LOW after wake-up via bus or input pin WAKE. (4) Transitions to normal mode clear the internal wake-up: wake-up interrupt flag and power-on flag are cleared. (5) Transitions to sleep mode: pin INH is deactivated. Fig 3. Mode control 8. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter VCC Conditions Min Max Unit supply voltage −0.3 +6 V VBAT battery supply voltage −0.3 +58 V VTXD voltage on pin TXD −0.3 VCC + 0.3 V VRXD voltage on pin RXD −0.3 VCC + 0.3 V VERR voltage on pin ERR −0.3 VCC + 0.3 V VSTB voltage on pin STB −0.3 VCC + 0.3 V VEN voltage on pin EN −0.3 VCC + 0.3 V VCANH voltage on pin CANH −58 +58 V VCC = 0 V to 5.0 V; VBAT ≥ 0 V; no time limit; with respect to any other pin TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 9 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VCANL voltage on pin CANL VCC = 0 V to 5.0 V; VBAT ≥ 0 V; no time limit; with respect to any other pin −58 +58 V Vtrt(n) transient voltage on pins CANH and CANL see Figure 7 and 8 −150 +100 V VI(WAKE) input voltage on pin WAKE with respect to any other pin −0.3 +58 V II(WAKE) input current on pin WAKE −15 - mA VINH voltage on pin INH −0.3 VBAT + 0.3 V VRTH voltage on pin RTH with respect to any other pin −58 +58 V VRTL voltage on pin RTL with respect to any other pin −58 +58 V RRTH termination resistance on pin RTH 500 16000 Ω RRTL termination resistance on pin RTL 500 16000 Ω Tvj virtual junction temperature Tstg storage temperature Vesd electrostatic discharge voltage [2] [3] human body model all other pins −8 +8 kV −2 +2 kV −6 +6 kV −300 +300 V [6] any pin [1] All voltages are defined with respect to pin GND, unless otherwise specified. Positive current flows into the device. [2] Only relevant if VWAKE < VGND − 0.3 V; current will flow into pin GND. [3] Junction temperature in accordance with “IEC 60747-1”. An alternative definition is: Tvj = Tamb + P × Rth(vj-a) where Rth(vj-a) is a fixed value to be used for the calculation of Tvj. The rating for Tvj limits the allowable combinations of power dissipation (P) and operating ambient temperature (Tamb). [4] Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ resistor. [5] The ESD performance of pins CANH, CANL, RTH and RTL, with respect to GND, was verified by an external test house in accordance with IEC-61000-4-2 (C = 150 pF, R = 330 Ω). The results were equal to, or better than, ±6 kV. [6] Equivalent to discharging a 200 pF capacitor through a 10 Ω resistor and a 0.75 µH coil. TJA1055_4 Product data sheet °C °C [5] pins RTH, RTL, CANH and CANL machine model +150 +150 [4] pins RTH, RTL, CANH and CANL IEC 61000-4-2 −40 −55 © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 10 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 9. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions Typ Unit Rth(j-a) thermal resistance from junction to ambient in free air 120 K/W Rth(j-s) thermal resistance from junction to substrate in free air 40 K/W 10. Static characteristics Table 8. Static characteristics VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to ground; positive currents flow into the device; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit Supplies (pins VCC and BAT) VCC supply voltage 4.75 - 5.25 V VCC(stb) supply voltage for forced standby mode (fail-safe) 3.1 - 4.5 V ICC supply current normal operating mode; VTXD = VCC (recessive) 2.5 6 10 mA normal operating mode; VTXD = 0 V (dominant); no load 3 13 21 mA Tamb = −40 °C to +85 °C 0 0 5 µA Tamb = +85 °C to +125 °C 0 0 25 µA low power modes at VTXD = VCC VBAT IBAT battery supply voltage battery supply current no time limit −0.3 - +40 V operating mode 5.0 - 40 V load dump - - 58 V sleep mode at VRTL = VWAKE = VINH = VBAT = 14 V; Tamb = −40 °C to +125 °C - 25 40 µA VBAT = 5 V to 8 V 10 - 100 µA VBAT = 8 V to 40 V 10 - 75 µA - 150 220 µA power-on flag set - - 3.8 V power-on flag not set 5 - - V low power mode at VRTL = VWAKE = VINH = VBAT; Tamb = −40 °C to +125 °C normal operating mode at VRTL = VWAKE = VINH = VBAT = 5 V to 40 V Vpof(BAT) power-on flag voltage on pin BAT low power modes TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 11 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 8. Static characteristics …continued VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to ground; positive currents flow into the device; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit Isup(tot) total supply current low power modes; VCC = 5 V; VBAT = VWAKE = VINH = 14 V Tamb = −40 °C to +85 °C - 25 45 µA Tamb = +85 °C to +125 °C - 25 65 µA Pins STB, EN and TXD VIH HIGH-level input voltage 2.2 - 7 V VIL LOW-level input voltage −0.3 - +0.8 V IIH HIGH-level input current µA IIL pins STB and EN VI = 4 V - 11 21 pin TXD (TJA1055T) VI = 3 V −160 −80 −40 µA pin TXD (TJA1055T/3) normal operating mode; VI = 2.4 V 2 11 21 µA low power mode; VI = 2.4 V 0.1 0.9 2 µA LOW-level input current pins STB and EN VI = 1 V 2 11 - µA pin TXD (TJA1055T) VI = 1 V −400 −240 −100 µA pin TXD (TJA1055T/3) normal operating mode; VI = 1 V 2 11 - µA low power mode; VI = 1 V 0.1 0.9 2 µA on pin ERR IO = −100 µA VCC − 0.9 - VCC V on pin RXD IO = −1 mA VCC − 0.9 - VCC V IO = −100 µA VCC − 1.1 VCC − 0.7 VCC − 0.4 V Pins RXD and ERR (TJA1055T) VOH(norm) VOH(lp) HIGH-level output voltage in normal mode HIGH-level output voltage in low-power mode on pin ERR on pin RXD VOL LOW-level output voltage IO = −100 µA VCC − 1.1 VCC − 0.7 VCC − 0.4 V IO = 1.6 mA 0 - 0.4 V IO = 1.2 mA; VCC < 4.75 V 0 - 0.4 V IO = 5 mA 0 - 1.5 V Pins RXD and ERR (TJA1055T/3) IOL LOW-level output current VO = 0.4 V 1.3 3.5 - mA ILH HIGH-level leakage current VO = 3 V −5 0 +8 µA IIL LOW-level input current VWAKE = 0 V; VBAT = 40 V −12 −4 −1 µA Vth(wake) wake-up threshold voltage VSTB = 0 V 2.5 3.2 3.9 V ∆VH HIGH-level voltage drop IINH = −0.18 mA - - 0.8 V |IL| leakage current sleep mode; VINH = 0 V - - 5 µA Pin WAKE Pin INH TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 12 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 8. Static characteristics …continued VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to ground; positive currents flow into the device; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit VCC = 5 V −3.5 −3.2 −2.9 V VCC = 4.75 V to 5.25 V −0.70VCC −0.64VCC −0.58VCC V Pins CANH and CANL Vth(dif) VO(reces) VO(dom) IO(CANH) IO(CANL) Vdet(sc)(CANH) Vdet(sc)(CANL) Vth(wake) differential receiver threshold voltage recessive output voltage no failures and bus failures 1, 2, 5 and 6a; see Figure 4 VTXD = VCC on pin CANH RRTH < 4 kΩ - on pin CANL RRTL < 4 kΩ dominant output voltage - 0.2 V VCC − 0.2 - - V VTXD = 0 V; VEN = VCC on pin CANH ICANH = −40 mA VCC − 1.4 - - V on pin CANL ICANL = 40 mA - - 1.4 V normal operating mode; VCANH = 0 V; VTXD = 0 V −110 −80 −45 mA low power modes; VCANH = 0 V; VCC = 5 V - −0.25 - µA normal operating mode; VCANL = 14 V; VTXD = 0 V 45 70 100 mA low power modes; VCANL = 14 V; VBAT = 14 V - 0 - µA detection voltage for short-circuit to battery voltage on pin CANH normal operating mode; VCC = 5 V 1.5 1.7 1.85 V low power modes 1.1 1.8 2.5 V detection voltage for short-circuit to battery voltage on pin CANL normal operating mode VCC = 5 V 6.6 7.2 7.8 V VCC = 4.75 V to 5.25 V 1.32VCC 1.44VCC 1.56VCC V output current on pin CANH output current on pin CANL wake-up threshold voltage on pin CANL low power modes 2.5 3.2 3.9 V on pin CANH low power modes 1.1 1.8 2.5 V ∆Vth(wake) difference of wake-up threshold voltages (on pins CANL and CANH) low power modes 0.8 1.4 - V Vth(se)(CANH) single-ended receiver threshold voltage on pin CANH normal operating mode and failures 4, 6 and 7 VCC = 5 V 1.5 1.7 1.85 V VCC = 4.75 V to 5.25 V 0.30VCC 0.34VCC 0.37VCC V VCC = 5 V 3.15 3.3 3.45 V VCC = 4.75 V to 5.25 V 0.63VCC 0.66VCC 0.69VCC V 110 165 270 kΩ Vth(se)(CANL) Ri(se)(CANH) single-ended receiver threshold voltage on pin CANL single-ended input resistance on pin CANH normal operating mode and failures 3 and 3a normal operating mode TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 13 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 8. Static characteristics …continued VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to ground; positive currents flow into the device; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit Ri(se)(CANL) single-ended input resistance on pin CANL normal operating mode 110 165 270 kΩ Ri(dif) differential input resistance normal operating mode 220 330 540 kΩ Pins RTH and RTL Rsw(RTL) switch-on resistance on pin RTL normal operating mode; switch-on resistance between pin RTL and VCC; |IO| < 10 mA - 40 100 Ω Rsw(RTH) switch-on resistance on pin RTH normal operating mode; switch-on resistance between pin RTH and ground; |IO| < 10 mA - 40 100 Ω VO(RTH) output voltage on pin RTH low power modes; IO = 100 µA - 0.7 1.0 V IO(RTL) output current on pin RTL low power modes; VRTL = 0 V −1.5 −0.65 −0.1 mA Ipu(RTL) pull-up current on pin RTL normal operating mode and failures 4, 6 and 7 - 75 - µA Ipd(RTH) pull-down current on pin RTH - 75 - µA 160 175 190 °C normal operating mode and failures 3 and 3a Thermal shutdown Tj(sd) [1] shutdown junction temperature All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at Tamb = 125 °C for dies on wafer level, and above this for cased products 100 % tested at Tamb = 25 °C, unless otherwise specified. 11. Dynamic characteristics Table 9. Dynamic characteristics VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to ground; unless otherwise specified.[1] Symbol Conditions Min Typ Max Unit tt(reces-dom) transition time for recessive to dominant (on pins CANL and CANH) between 10 % and 90 %; RCAN_L = RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 5 and 6 0.2 0.6 - µs tt(dom-reces) transition time for dominant to recessive (on pins CANL and CANH) between 10 % and 90 %; RCAN_L = RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 5 and 6 0.3 0.7 - µs no failures; RCAN_L = RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 4 to Figure 6 - - 1.5 µs all failures except CAN_L shorted to CAN_H; RCAN_L = RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 4 to Figure 6 - - 1.9 µs failure 7, CAN_L shorted to CAN_H; RCAN_L = 1 MΩ; RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 4 to Figure 6 - - 1.9 µs tPD(L) Parameter propagation delay TXD (LOW) to RXD (LOW) TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 14 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver Table 9. Dynamic characteristics …continued VCC = 4.75 V to 5.25 V; VBAT = 5.0 V to 40 V; VSTB = VCC; Tvj = −40 °C to +150 °C; all voltages are defined with respect to ground; unless otherwise specified.[1] Symbol Parameter Conditions Min Typ Max Unit tPD(H) propagation delay TXD (HIGH) to RXD (HIGH) no failures; RCAN_L = RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 4 to Figure 6 - - 1.5 µs all failures except CAN_L shorted to CAN_H; RCAN_L = RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 4 to Figure 6 - - 1.9 µs failure 7, CAN_L shorted to CAN_H; RCAN_L = 1 MΩ; RCAN_H = 125 Ω; CCAN_L = CCAN_H = 1 nF; see Figure 4 to Figure 6 - - 1.9 µs 5 - td(sleep) delay time to sleep tdis(TxD) disable time of TxD permanent dominant timer tdom(CANH) dominant time on pin CANH [2] normal operating mode; VTXD = 0 V 50 µs 0.75 - 4 ms low power modes; VBAT = 14 V [2] 7 - 38 µs 7 - 38 µs 7 - 38 µs failures 3 and 3a 1.6 - 8.0 ms failures 4, 6 and 7 0.3 - 1.6 ms failures 3 and 3a 1.6 - 8.0 ms failures 4 and 7 0.1 - 1.6 ms failures 3 and 3a 0.3 - 1.6 ms failures 4 and 7 7 - 38 µs failure 6 125 - 750 µs 0.3 - 1.6 ms tdom(CANL) dominant time on pin CANL low power modes; VBAT = 14 V [2] tWAKE local wake-up time on pin WAKE low power modes; VBAT = 14 V; for wake-up after receiving a falling or rising edge [2] tdet failure detection time normal operating mode low power modes; VBAT = 14 V failure recovery time trec normal operating mode low power modes; VBAT = 14 V failures 3, 3a, 4 and 7 ndet pulse-count failure detection difference between CANH and CANL; normal operating mode and failures 1, 2, 5 and 6a; pin ERR becomes LOW - 4 - nrec number of consecutive pulses for failure recovery on CANH and CANL simultaneously; failures 1, 2, 5 and 6a - 4 - [1] All parameters are guaranteed over the virtual junction temperature range by design, but only 100 % tested at Tamb = 125 °C for dies on wafer level, and above this for cased products 100 % tested at Tamb = 25 °C, unless otherwise specified. [2] To guarantee a successful mode transition under all conditions, the maximum specified time must be applied. TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 15 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 2 V to VCC VTXD 0V VCANL 5V 3.6 V 1.4 V VCANH 0V 2.2 V −3.2 V ∆VCAN −5 V VRXD 0.7VCC 0.3VCC tPD(H) tPD(L) mgl424 ∆VCAN = VCANH − VCANL Fig 4. Timing diagram for dynamic characteristics 12. Test information VBAT = 5 V to 40 V +5 V INH WAKE VTXD TXD STB EN RXD CRXD 10 pF 1 VCC 10 8 RTH BAT 14 7 RRTH 500 Ω 2 5 12 11 CANH RRTL 500 Ω 3 13 GND 9 4 VCC CCAN_L RCAN_L CCAN_H RCAN_H CANL TJA1055T 6 BAT RTL FAILURE GENERATION GND ERR 001aac932 VTXD is a rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns. Termination resistors RCAN_L and RCAN_H (125 Ω) are not connected to pin RTL or pin RTH for testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω per transceiver. Fig 5. Test circuit for dynamic characteristics TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 16 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver VBAT = 5 V to 40 V +5 V INH WAKE VTXD TXD +3.3 V STB 2.5 kΩ EN RXD VCC 10 8 RTH BAT 1 14 7 BAT RRTH 500 Ω 2 12 11 6 CRXD 10 pF 9 4 13 RCAN_L CCAN_H RCAN_H FAILURE GENERATION CANH RRTL 500 Ω 3 CCAN_L CANL TJA1055T/3 5 VCC GND RTL ERR GND 001aac933 VTXD is a rectangular signal of 50 kHz with 50 % duty cycle and slope time < 10 ns. Termination resistors RCAN_L and RCAN_H (125 Ω) are not connected to pin RTL or pin RTH for testing purposes because the minimum load allowed on the CAN bus lines is 500 Ω per transceiver. Fig 6. Test circuit for dynamic characteristics (TJA1055T/3) +12 V +5 V 10 µF INH WAKE TXD STB EN RXD 1 125 Ω 1 nF 7 500 Ω 2 5 12 1 nF CANL TJA1055T 11 6 1 nF CANH GENERATOR 500 Ω 3 13 10 pF VCC 10 8 RTH BAT 14 GND 9 4 RTL 125 Ω 1 nF ERR 001aac934 The waveforms of the applied transients on pins CANH and CANL will be in accordance with “ISO 7637 part 1”: test pulses 1, 2, 3a and 3b. Fig 7. Test circuit for automotive transients TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 17 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver +12 V +5 V 10 µF INH WAKE TXD STB +3.3 V 2.5 kΩ EN RXD 1 VCC 10 8 RTH BAT 14 125 Ω 1 nF 7 500 Ω 2 12 1 nF CANL TJA1055T/3 5 11 6 GENERATOR 1 nF CANH 500 Ω 3 9 4 13 10 pF GND RTL 125 Ω 1 nF ERR 001aac935 The waveforms of the applied transients on pins CANH and CANL will be in accordance with “ISO 7637 part 1”: test pulses 1, 2, 3a and 3b. Fig 8. Test circuit for automotive transients (TJA1055T/3) VBAT VDD 5 V CAN CONTROLLER CTX0 CRX0 Px.x TXD WAKE 2 RXD 3 Px.x Px.x ERR STB 5 EN INH 6 4 1 7 14 TJA1055T 10 CAN TRANSCEIVER 13 8 11 RTH CANH +5 V 12 CANL BAT VCC GND 100 nF 9 RTL CAN BUS LINE 001aac936 For more information: refer to the separate FTCAN information available on our web site. Fig 9. Application diagram TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 18 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver VBAT VDD 3 V CAN CONTROLLER CTX0 CRX0 Px.x TXD WAKE 2 RXD 3 Px.x +5 V Px.x ERR STB 5 EN INH 6 4 1 7 14 TJA1055T/3 10 CAN TRANSCEIVER 13 8 11 RTH CANH +3 V 12 CANL BAT VCC GND 100 nF 9 RTL CAN BUS LINE 001aac937 For more information: refer to the separate FTCAN information available on our web site. Fig 10. Application diagram (TJA1055T/3) 12.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 19 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 13. Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A (A 3) A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 A2 A3 bp c D (1) E (1) e HE L Lp Q v w y Z (1) mm 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 1.05 1.0 0.4 0.7 0.6 0.25 0.25 0.1 0.7 0.3 0.01 0.019 0.0100 0.35 0.014 0.0075 0.34 0.16 0.15 0.010 0.057 inches 0.069 0.004 0.049 0.05 0.244 0.039 0.041 0.228 0.016 0.028 0.024 0.01 0.01 0.028 0.004 0.012 θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT108-1 076E06 MS-012 JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 Fig 11. Package outline SOT108-1 (SO14) TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 20 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 14. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description”. 14.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization. 14.2 Wave and reflow soldering Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following: • Through-hole components • Leaded or leadless SMDs, which are glued to the surface of the printed circuit board Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are: • • • • • • Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus SnPb soldering 14.3 Wave soldering Key characteristics in wave soldering are: • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 21 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 14.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see Figure 12) than a SnPb process, thus reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • Reflow temperature profile; this profile includes preheat, reflow (in which the board is heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 10 and 11 Table 10. SnPb eutectic process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 ≥ 350 < 2.5 235 220 ≥ 2.5 220 220 Table 11. Lead-free process (from J-STD-020C) Package thickness (mm) Package reflow temperature (°C) Volume (mm3) < 350 350 to 2000 > 2000 < 1.6 260 260 260 1.6 to 2.5 260 250 245 > 2.5 250 245 245 Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 12. TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 22 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver temperature maximum peak temperature = MSL limit, damage level minimum peak temperature = minimum soldering temperature peak temperature time 001aac844 MSL: Moisture Sensitivity Level Fig 12. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 15. Appendix 15.1 Overview of differences between the TJA1055 and the TJA1054A Table 12. Limiting values Symbol Parameter Conditions TJA1055 Min Max Min Max VCANH voltage on pin CANH −58 +58 −27 +40 V VCANL voltage on pin CANL −58 +58 −27 +40 V Vesd electrostatic discharge voltage Unit −8 +8 −4 +4 kV pins RTH, RTL, CANH, CANL human body model IEC 61000-4-2 [1] TJA1054A [1] The ESD performance of pins CANH, CANL, RTH and RTL, with respect to GND, was verified by an external test house in accordance with IEC-61000-4-2 (C = 150 pF, R = 330 Ω). The results were equal to, or better than, ±6 kV for TJA1055 and equal to, or better than, ±1.5 kV for TJA1054A. TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 23 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 16. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes TJA1055_4 20090217 Product data sheet - TJA1055_3 Modifications: • No technical content change; data sheet release date updated TJA1055_3 20070313 Product data sheet - TJA1055_2 TJA1055_2 20061030 Preliminary data sheet - TJA1055_1 TJA1055_1 (9397 750 14908) 20060801 Objective data sheet - - TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 24 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 17.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. 17.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] TJA1055_4 Product data sheet © NXP B.V. 2009. All rights reserved. Rev. 04 — 17 February 2009 25 of 26 TJA1055 NXP Semiconductors Enhanced fault-tolerant CAN transceiver 19. Contents 1 2 2.1 2.2 2.3 2.4 3 4 5 6 6.1 6.2 7 7.1 7.2 7.3 7.4 8 9 10 11 12 12.1 13 14 14.1 14.2 14.3 14.4 15 15.1 16 17 17.1 17.2 17.3 17.4 18 19 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Optimized for in-car low-speed communication . . . . . . . . . . . . . . . . . . . . . . . . . 1 Bus failure management. . . . . . . . . . . . . . . . . . 1 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Support for low power modes . . . . . . . . . . . . . . 2 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 Failure detector . . . . . . . . . . . . . . . . . . . . . . . . . 5 Low power modes. . . . . . . . . . . . . . . . . . . . . . . 7 Power-on. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 9 Thermal characteristics. . . . . . . . . . . . . . . . . . 11 Static characteristics. . . . . . . . . . . . . . . . . . . . 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 16 Quality information . . . . . . . . . . . . . . . . . . . . . 19 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20 Soldering of SMD packages . . . . . . . . . . . . . . 21 Introduction to soldering . . . . . . . . . . . . . . . . . 21 Wave and reflow soldering . . . . . . . . . . . . . . . 21 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22 Appendix. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Overview of differences between the TJA1055 and the TJA1054A. . . . . . . . . . . . . . 23 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 24 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Contact information. . . . . . . . . . . . . . . . . . . . . 25 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 17 February 2009 Document identifier: TJA1055_4