N-channel dual gate MOSFET

BF1217WR
N-channel dual gate MOSFET
Rev. 2 — 20 June 2011
Product data sheet
1. Product profile
1.1 General description
Enhancement type N-channel field-effect transistor with source and substrate
interconnected. Integrated diodes between gates and source protect against excessive
input voltage surges. The BF1217WR is encapsulated in the SOT343R plastic package.
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Therefore care should be taken
during transport and handling.
1.2 Features and benefits




Excellent low frequency noise performance
Superior cross modulation performance during AGC
High forward transfer admittance
High forward transfer admittance to input capacitance ratio
1.3 Applications
 Gain controlled low noise amplifiers for VHF and UHF applications with 5 V supply
voltage
 digital and analog television tuners
 professional communication equipment
BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
1.4 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
-
-
6
V
-
-
30
mA
-
-
180
mW
23
27
38
mS
VDS
drain-source voltage
DC
ID
drain current
DC
Ptot
total power dissipation
Tsp  107 C
yfs
forward transfer admittance
f = 100 MHz; Tj = 25 C;
ID = 18 mA
Ciss(G1)
input capacitance at gate1
f = 100 MHz
[2]
-
2.5
-
pF
Crss
reverse transfer capacitance f = 100 MHz
[2]
-
20
-
fF
NF
noise figure
-
1.0
-
dB
-
1.5
-
dB
105
107
-
dBV
-
-
150
C
[1]
f = 400 MHz; YS = YS(opt)
f = 800 MHz; YS = YS(opt)
Xmod
cross modulation
Tj
junction temperature
input level for k = 1 % at
40 dB AGC; fw = 50 MHz;
funw = 60 MHz
[1]
Tsp is the temperature at the soldering point of the source lead.
[2]
Calculated from S-parameters.
[3]
Measured in Figure 17 test circuit.
[3]
2. Pinning information
Table 2.
Discrete pinning
Pin
Description
1
source
2
drain
3
gate 2
4
gate 1
Simplified outline
3
4
Graphic symbol
G1
G2
S
D
001aam153
2
1
3. Ordering information
Table 3.
Ordering information
Type number
BF1217WR
BF1217WR
Product data sheet
Package
Name Description
Version
-
SOT343R
plastic surface-mounted package; reverse pinning; 4 leads
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BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
4. Marking
Table 4.
Marking
Type number
Marking
Description
BF1217WR
VA%
% = p : made in Hong Kong
% = t : made in Malaysia
% = w : made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
Per MOSFET
VDS
drain-source voltage
DC
-
6
V
ID
drain current
DC
-
30
mA
IG1
gate1 current
-
10
mA
IG2
gate2 current
-
10
mA
Tsp  107 C
[1]
Ptot
total power dissipation
-
180
mW
Tstg
storage temperature
65
+150
C
Tj
junction temperature
-
150
C
[1]
Tsp is the temperature at the soldering point of the source lead.
001aac193
250
Ptot
(mW)
200
150
100
50
0
0
50
100
150
200
Tsp (˚C)
Fig 1.
BF1217WR
Product data sheet
Power derating curve
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BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
6. Thermal characteristics
Table 6.
Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-sp)
thermal resistance from junction to solder point
Typ
Unit
240
K/W
7. Static characteristics
Table 7.
Static characteristics
Tj = 25 C.
Symbol
Parameter
Conditions
Min Typ Max
Unit
VG1-S = VG2-S = 0 V; ID = 10 A
6
-
-
V
V(BR)G1-SS gate1-source breakdown voltage VG2-S = VDS = 0 V; IG1-S = 10 mA
6
-
10
V
V(BR)G2-SS gate2-source breakdown voltage VG1-S = VDS = 0 V; IG2-S = 10 mA
6
-
10
V
Per MOSFET; unless otherwise specified
V(BR)DSS
drain-source breakdown voltage
VF(S-G1)
forward source-gate1 voltage
VG2-S = VDS = 0 V; IS-G1 = 10 mA
0.5
-
1.5
V
VF(S-G2)
forward source-gate2 voltage
VG1-S = VDS = 0 V; IS-G2 = 10 mA
0.5
-
1.5
V
VG1-S(th)
gate1-source threshold voltage
VDS = 5 V; VG2-S = 4 V; ID = 100 A
0.3
-
1.0
V
VG2-S(th)
gate2-source threshold voltage
VDS = 5 V; VG1-S = 5 V; ID = 100 A
0.4
-
1.0
V
[1]
IDS
drain-source current
VG2-S = 4 V; VDS = 5 V; RG1 = 82 k
-
-
24
mA
IG1-S
gate1 cut-off current
VG2-S = 0 V; VDS = 0 V; VG1-S = 5 V
-
-
50
nA
IG2-S
gate2 cut-off current
VG2-S = 4 V; VDS = 0 V; VG1-S = 0 V
-
-
20
nA
[1]
RG1 connects gate1 to VGG = 5 V. See Figure 17.
BF1217WR
Product data sheet
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BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
8. Dynamic characteristics
Table 8.
Dynamic characteristics
Common source; Tamb = 25 C; VG2-S = 4 V; VDS = 5 V; ID = 18 mA.
Symbol Parameter
Conditions
yfs
f = 100 MHz; Tj = 25 C
forward transfer admittance
Min Typ Max Unit
23
27
38
mS
Ciss(G1)
input capacitance at gate1
f = 100 MHz
[1]
-
2.5
-
pF
Ciss(G2)
input capacitance at gate2
f = 100 MHz
[1]
-
1.0
-
pF
f = 100 MHz
[1]
-
0.8
-
pF
f = 100 MHz
[1]
-
20
-
fF
BS = BS(opt); BL = BL(opt)
[1]
f = 200 MHz; GS = 2 mS; GL = 0.5 mS
-
34
-
dB
f = 400 MHz; GS = 2 mS; GL = 1 mS
-
30
-
dB
f = 800 MHz; GS = 3.3 mS; GL = 1 mS
-
26
-
dB
f = 400 MHz; YS = YS(opt)
-
1.0
-
dB
f = 800 MHz; YS = YS(opt)
-
1.5
-
dB
at 0 dB AGC
90
104 -
dBV
at 10 dB AGC
-
100 -
dBV
at 20 dB AGC
-
104 -
dBV
at 40 dB AGC
105 107 -
dBV
Coss
output capacitance
reverse transfer capacitance
Crss
transducer power gain
Gtr
NF
noise figure
Xmod
cross modulation
[1]
Calculated from S-parameters.
[2]
Measured in Figure 17 test circuit.
BF1217WR
Product data sheet
input level for k = 1 %; fw = 50 MHz; funw = 60 MHz
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Rev. 2 — 20 June 2011
[2]
© NXP B.V. 2011. All rights reserved.
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BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
8.1 Graphs
001aam154
30
001aam155
30
(1)
(1)
(2)
(3)
(4)
ID
(mA)
(2)
ID
(mA)
(5)
20
(3)
(4)
20
(5)
(6)
(6)
(7)
10
(8)
10
(9)
(7)
(10)
(11)
(12)
(13)
0
0
0
0.5
1.0
1.5
2.0
2.5
VG1-S (V)
0
4
6
VDS (V)
(1) VG2-S = 4.0 V
(1) VG1-S = 2.2 V
(2) VG2-S = 3.5 V
(2) VG1-S = 2.1 V
(3) VG2-S = 3.0 V
(3) VG1-S = 2.0 V
(4) VG2-S = 2.5 V
(4) VG1-S = 1.9 V
(5) VG2-S = 2.0 V
(5) VG1-S = 1.8 V
(6) VG2-S = 1.5 V
(6) VG1-S = 1.7 V
(7) VG2-S = 1.0 V
(7) VG1-S = 1.6 V
VDS = 5 V; Tj = 25 C.
2
(8) VG1-S = 1.5 V
(9) VG1-S = 1.4 V
(10) VG1-S = 1.3 V
(11) VG1-S = 1.2 V
(12) VG1-S = 1.1 V
(13) VG1-S = 1.0 V
VG2-S = 4 V; Tj = 25 C.
Fig 2.
Transfer characteristics; typical values
BF1217WR
Product data sheet
Fig 3.
Output characteristics; typical values
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BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
001aam156
100
IG1
(μA)
80
001aam157
30
(1)
(2)
(3)
|Yfs|
(mS)
(1)
(2)
20
60
(4)
(3)
40
(4)
10
(5)
(5)
20
(6)
(6)
(7)
(7)
0
0
0
0.5
1.0
1.5
2.0
2.5
VG1-S (V)
0
5
(1) VG2-S = 4.0 V
(2) VG2-S = 3.5 V
(2) VG2-S = 3.5 V
(3) VG2-S = 3.0 V
(3) VG2-S = 3.0 V
(4) VG2-S = 2.5 V
(4) VG2-S = 2.5 V
(5) VG2-S = 2.0 V
(5) VG2-S = 2.0 V
(6) VG2-S = 1.5 V
(6) VG2-S = 1.5 V
(7) VG2-S = 1.0 V
(7) VG2-S = 1.0 V
VDS = 5 V; Tj = 25 C.
20
25
VDS = 5 V; Tj = 25 C.
Gate1 current as a function of gate1 voltage;
typical values
Fig 5.
001aam158
30
Forward transfer admittance as a function of
drain current; typical values
001aam159
30
ID
(mA)
ID
(mA)
20
20
10
10
0
0
0
20
40
0
60
1
IG1 (μA)
Product data sheet
3
4
5
VDS = 5 V; VG2-S = 4 V; RG1 = 82 k; Tj = 25 C.
Drain current as a function of gate1 current;
typical values
BF1217WR
2
VGG (V)
VDS = 5 V; VG2-S = 4 V; Tj = 25 C.
Fig 6.
15
ID (mA)
(1) VG2-S = 4.0 V
Fig 4.
10
Fig 7.
Drain current as a function of gate1 supply
voltage (VGG); typical values
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BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
001aam161
40
(1)
ID
(mA)
ID
(mA)
(2)
30
001aam162
40
(1)
30
(2)
(3)
20
(4)
20
(3)
(5)
(4)
10
(6)
10
(5)
0
0
0
1
2
3
4
5
VGG = VDS (V)
0
1
(1) RG1 = 20 k
(1) VGG = 5.0 V
(2) RG1 = 40 k
(2) VGG = 4.5 V
(3) RG1 = 80 k
(3) VGG = 4.0 V
(4) RG1 = 120 k
(4) VGG = 3.5 V
(5) RG1 = 160 k
(5) VGG = 3.0 V
VG2-S = 4 V; Tj = 25 C.
2
3
4
5
VG2-S (V)
(6) VGG = 2.5 V
Tj = 25 C; RG1 = 82 k (connected to VGG).
Fig 8.
Drain current as a function of VDS and VGG;
typical values
BF1217WR
Product data sheet
Fig 9.
Drain current as a function of gate2 voltage;
typical values
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BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
001aam163
0
gain
reduction
(dB)
10
001aam164
120
Xmod
(dBμV)
110
20
100
30
90
40
80
50
0
1
2
3
4
0
10
VAGC (V)
VDS = 5 V; VGG = 5 V; ID(nom) = 19 mA; RG1 = 82 k;
f = 50 MHz; Tj = 25 C; see Figure 17.
20
30
40
50
gain reduction (dB)
VDS = 5 V; VGG = 5 V; VG2-S(nom) = 4 V; RG1 = 82 k;
fw = 50 MHz; funw = 60 MHz; ID(nom) = 19 mA; Tj = 25 C;
see Figure 17.
Fig 10. Typical gain reduction as a function of the
AGC voltage; typical values
Fig 11. Unwanted voltage for 1 % cross modulation as
a function of gain reduction; typical values
001aam165
40
ID
(mA)
30
20
10
0
0
10
20
30
40
50
gain reduction (dB)
VDS = 5 V; VGG = 5 V; VG2-S(nom) = 4 V; RG1 = 82 k; fw = 50 MHz; ID(nom) = 19 mA; Tj = 25 C; see Figure 17.
Fig 12. Typical drain current as a function of gain reduction; typical values
BF1217WR
Product data sheet
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BF1217WR
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N-channel dual gate MOSFET
001aam166
102
001aam167
102
−102
gis, bis
(mS)
|Yfs|
(mS)
10
ϕfs
(deg)
|Yfs|
bis
1
−10
10
ϕfs
gis
10−1
10−2
10
102
1
103
10
−1
103
102
f (MHz)
f (MHz)
VDS = 5 V; VG2-S = 4 V; ID = 19 mA.
VDS = 5 V; VG2-S = 4 V; ID = 19 mA.
Fig 13. Input admittance as a function of frequency;
typical values
001aam168
103
−103
ϕfs
(deg)
|Yfs|
(mS)
ϕfs
102
−102
Fig 14. Forward transfer admittance and phase as a
function of frequency; typical values
001aam169
10
bos, gos
(mS)
bos
1
|Yfs|
−10
10
1
10
−1
103
102
10−1
gos
10−2
10
VDS = 5 V; VG2-S = 4 V; ID = 19 mA.
Product data sheet
103
VDS = 5 V; VG2-S = 4 V; ID = 19 mA.
Fig 15. Reverse transfer admittance and phase as a
function of frequency; typical values
BF1217WR
102
f (MHz)
f (MHz)
Fig 16. Output admittance as a function of frequency;
typical values
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N-channel dual gate MOSFET
8.2 Scattering parameters
Table 9.
Scattering parameters
VDS = 5 V; VG2-S = 4 V; ID = 19 mA; Tamb = 25 C; Z0 = 50 ; typical values.
f (MHz)
s11
s21
s12
s22
Magnitude
(ratio)
Angle
(deg)
Magnitude
(ratio)
Angle
(deg)
Magnitude
(ratio)
Angle
(deg)
Magnitude
(ratio)
Angle
(deg)
40
0.9960
3.50
2.77
177.20
0.00034
82.80
0.9945
1.00
50
0.9957
4.46
2.76
176.02
0.00046
82.50
0.9944
1.28
100
0.9935
8.66
2.74
172.19
0.00121
81.86
0.9938
2.69
200
0.9880
17.55
2.73
164.42
0.00231
80.28
0.9927
5.39
300
0.9805
26.17
2.69
156.64
0.00331
75.66
0.9909
8.17
400
0.9712
34.58
2.64
149.07
0.00414
71.21
0.9896
10.79
500
0.9589
42.78
2.58
141.74
0.00482
67.42
0.9872
13.30
600
0.9451
50.61
2.52
134.58
0.00526
64.33
0.9850
16.08
700
0.9309
58.23
2.45
127.49
0.00549
61.90
0.9836
18.74
800
0.9166
65.68
2.37
120.79
0.00551
60.77
0.9818
21.05
900
0.9034
72.70
2.29
114.37
0.00536
60.73
0.9796
23.59
1000
0.8894
79.30
2.22
107.90
0.00505
62.45
0.9781
26.44
8.3 Noise data
Table 10. Noise data
VDS = 5 V; VG2-S = 4 V; ID = 19 mA, Tamb = 25 C; typical values.
f (MHz)
NFmin (dB)
opt
rn (ratio)
(ratio)
(deg)
400
1.0
0.798
29.5
0.907
800
1.5
0.703
57.7
0.749
BF1217WR
Product data sheet
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BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
9. Test information
VAGC
R1
10 kΩ
C1
C3
4.7 nF
4.7 nF
C2
RGEN
50 Ω
VI
4.7 nF
R2
50 Ω
DUT
L1
≈ 2.2 μH
RL
50 Ω
C4
RG1
VGG
4.7 nF
VDS
001aad926
Fig 17. Cross modulation test setup
BF1217WR
Product data sheet
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N-channel dual gate MOSFET
10. Package outline
Plastic surface-mounted package; reverse pinning; 4 leads
D
SOT343R
E
B
A
X
HE
y
v M A
e
3
4
Q
A
A1
c
2
w M B
1
bp
Lp
b1
e1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
A1
max
bp
b1
c
D
E
e
e1
HE
Lp
Q
v
w
y
mm
1.1
0.8
0.1
0.4
0.3
0.7
0.5
0.25
0.10
2.2
1.8
1.35
1.15
1.3
1.15
2.2
2.0
0.45
0.15
0.23
0.13
0.2
0.2
0.1
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
97-05-21
06-03-16
SOT343R
Fig 18. Package outline SOT343
BF1217WR
Product data sheet
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N-channel dual gate MOSFET
11. Abbreviations
Table 11.
Abbreviations
Acronym
Description
AGC
Automatic Gain Control
DC
Direct Current
MOSFET
Metal-Oxide-Semiconductor Field-Effect Transistor
UHF
Ultra High Frequency
VHF
Very High Frequency
12. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BF1217WR v.2
20110620
Product data sheet
-
BF1217WR v.1
-
-
Modifications:
BF1217WR v.1
BF1217WR
Product data sheet
•
Package outline corrected.
20100803
Product data sheet
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N-channel dual gate MOSFET
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
BF1217WR
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 June 2011
© NXP B.V. 2011. All rights reserved.
15 of 17
BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BF1217WR
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 20 June 2011
© NXP B.V. 2011. All rights reserved.
16 of 17
BF1217WR
NXP Semiconductors
N-channel dual gate MOSFET
15. Contents
1
1.1
1.2
1.3
1.4
2
3
4
5
6
7
8
8.1
8.2
8.3
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Scattering parameters . . . . . . . . . . . . . . . . . . 11
Noise data. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Test information . . . . . . . . . . . . . . . . . . . . . . . . 12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 20 June 2011
Document identifier: BF1217WR