PHILIPS PCA2002

INTEGRATED CIRCUITS
DATA SHEET
PCA2002
32 kHz watch circuit with
programmable output period and
pulse width
Product specification
Supersedes data of 2003 Feb 04
2004 Jan 20
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
FEATURES
GENERAL DESCRIPTION
• 32 kHz quartz oscillator, amplitude regulated with
excellent frequency stability and high immunity to
leakage currents
The PCA2002 is a CMOS integrated circuit for battery
operated wrist watches with a 32 kHz quartz crystal as the
timing element and a bipolar stepping motor. The crystal
oscillator and the frequency divider are optimized for
minimum current consumption. A timing accuracy of
1 ppm is achieved with a programmable, digital frequency
adjustment.
• Electrically programmable time calibration with 1 ppm
resolution (stored in OTP memory)
• The quartz crystal is the only external component
required
The output period and the output pulse width can be
programmed. It can be selected between a full output
pulse or a chopped output pulse with a duty cycle of 75 %.
In addition, a stretching pulse can be added to the primary
driving pulse.
• Very low current consumption: typically 90 nA
• Output pulses for bipolar stepping motors
• Five different programmable output periods (1 s to 30 s)
• Output pulse width programmable between
1 ms and 8 ms
Pin RESET is used for stopping the motor, accurate time
setting and for an accelerated testing of the watch.
• Full or chopped motor pulse and pulse stretching,
selectable
• Stop function for accurate time setting and current
saving during the shelf life
• Test mode for accelerated testing of the mechanical
parts of the watch.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
PCA2002U/AA
PCA2002U/10AA
PCA2002T
PCA2002TK
2004 Jan 20
DESCRIPTION
−
bare die; chip in tray
−
bare die; chip on film frame carrier
PMFP8
HVSON10
VERSION
−
−
plastic micro flat package; 8 leads (straight)
SOT144-1
plastic thermal enhanced very thin small outline package;
no leads; 10 terminals; body 3 × 3 × 0.85 mm
SOT650-1
2
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
BLOCK DIAGRAM
32 Hz
OSCIN 3 (3)
8 kHz
÷4
OSCILLATOR
OSCOUT
(10) 8
DIVIDER
RESET
4 (4)
reset
TIMING ADJUSTMENT,
INHIBITION
VDD
VSS
RESET
5 (7)
1 (1)
VOLTAGE DETECTOR,
OTP-CONTROLLER
OTP-MEMORY
1 Hz
MOTOR CONTROL
PCA2002U
PCA2002T
(PCA2002TK)
(5)
(2) 2
(6)
6 (8)
7 (9)
MOT1
MOT2
n.c.
n.c.
i.c.
mbl568
M
The pin numbers in parenthesis represent the PCA2002TK.
Fig.1 Block diagram.
PINNING
PAD
PIN
SYMBOL
DESCRIPTION
PCA2002U
PCA2002T
PCA2002TK
VSS
1
1
1
ground
i.c.
2
2
2
internally connected
OSCIN
3
3
3
oscillator input
OSCOUT
4
4
4
oscillator output
n.c.
−
−
5
not connected
n.c.
−
−
6
not connected
VDD
5
5
7
supply voltage
MOT1
6
6
8
motor 1 output
MOT2
7
7
9
motor 2 output
RESET
8
8
10
reset input
2004 Jan 20
3
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
n.c.
5
6
n.c.
OSCOUT
4
7
VDD
8
MOT1
MOT2
handbook, halfpage
VSS
1
i.c.
2
8
RESET
7
MOT2
OSCIN
3
i.c.
2
9
VSS
1
10 RESET
PCA2002TK
PCA2002T
OSCIN
3
6
MOT1
OSCOUT
4
5
VDD
MBL569
terminal 1
index area
Fig.2 Pin configuration PMFP8.
001aaa284
Bottom view
Fig.3 Pin configuration HVSON10.
FUNCTIONAL DESCRIPTION
• Output periods of 1 s, 5 s, 10 s, 20 s and 30 s
Motor pulse
• Pulse width (tp) between 0.98 ms and 7.8 ms in steps of
0.98 ms
The motor driver delivers pulses with an alternating
polarity. The output waveform across the motor terminals
is illustrated in Fig.4. Between the motor pulses, both
terminals are connected to VDD which means that the
motor is short-circuited.
• Full or chopped (75 %) output pulse
• Pulse stretching: an enlargement pulse is added to the
primary motor pulse. This enlargement pulse has a duty
cycle of 25 % and a width which is twice the
programmed motor pulse width.
The following parameters can be selected and are stored
in a One Time Programmable (OTP) memory:
period
handbook, full pagewidth
full pulse
chopped
pulse
full pulse
with stretching
chopped pulse
with stretching
tp
2t p
tp
Fig.4 Motor output waveforms.
2004 Jan 20
4
2t p
MGU718
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
Time calibration
together with the calibration period in the OTP memory;
see Section “Programming procedure”.
The crystal oscillator has an integrated load capacitance of
5 pF, which is lower than the specified load capacitance of
8.2 pF for the quartz crystal.
The oscillator frequency can be measured at pad RESET,
where a square wave signal with the frequency of
1
------------- × f osc is provided.
1024
It oscillates therefore, at a frequency which is typically
60 ppm higher than 32.768 kHz. This positive frequency
offset is then compensated by removing, every minute or
every two minutes, the appropriate number of 8192 Hz
pulses (maximum 127 pulses) of the divider chain. The
timing correction is given in Table 1.
This frequency shows a jitter every minute or every two
minutes, depending on the programmed calibration period,
which originates from the time calibration.
Details on how to measure the oscillator frequency and the
programmed inhibition time are given in Section
“Programming procedure”.
After measuring the effective oscillator frequency, the
number of correction pulses must be calculated and stored
Table 1
Timing correction
CORRECTION PER STEP (N = 1)
CALIBRATION
PERIOD (min)
CORRECTION PER STEP (N = 127)
ppm
s/day
ppm
s/day
1
2.03
0.176
258
22.3
2
1.017
0.088
129
11.15
polarity to the last pulse before stopping. The debounce
time for the reset function is between 31 ms and 62 ms.
Reset
At pin RESET an output signal with a frequency of
1
------------- × f osc = 32 Hz is provided.
1024
Connecting pin RESET to VSS activates the test mode.
In this mode the motor output frequency is 32 Hz, which
can be used to test the mechanical function of the watch.
Connecting pin RESET to VDD stops the motor drive and
opens the motor switches.
Programming possibilities
After releasing pin RESET, the first motor pulse is
generated exactly one period later with the opposite
Table 2
PCA2002
The programming data is stored in two words; see Table 2.
Words and bits
BIT
WORD
1
A
B
2004 Jan 20
2
3
4
5
6
7
number of 8192 Hz pulses to be removed
pulse width
output period
5
8
calibration period
duty cycle
pulse stretching
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
Table 3
BIT
Description of word A bits
General start up sequence
VALUE
You must follow the next sequence to ensure the correct
operation at start up:
DESCRIPTION
Inhibit time
−
1 to 7
1. Apply the supply voltage to the circuit.
the number of the 8192 Hz pulses to
be removed (binary coded;
MSB = A1, LSB = A7)
2. Wait at least two seconds.
3. Connect pin RESET to pin VDD for a minimum of 62 ms
(this activates the stop mode).
Calibration period
8
Table 4
BIT
0
1 minute
1
2 minutes
4. Disconnect pin RESET from pin VDD (this resets the
circuit to normal operating mode).
After this sequence the memory contents are read
immediately and the programmed options are set. This
sequence also resets all major circuit blocks and ensures
that they function correctly.
Description of word B bits
VALUE
DESCRIPTION
To ensure that the oscillator starts up correctly you must
execute a reset sequence (see Fig.5).
Pulse width tp (ms)
1 to 3
000
0.98
001
1.95
010
2.9
011
3.9
100
4.9
101
5.9
110
6.8
111
7.8
t p(stop)
VDD
VP(stop)
t (start) > 500 ms
VDD(nom)
Output period (s)
4 to 6
PCA2002
000
1
001
5
010
10
011
20
100
30
VSS
001aaa285
Fig.5 Supply voltage at start up.
Programming procedure
For a watch it is essential that the timing calibration can be
made after the watch is fully assembled. In this situation,
the supply pins are often the only terminals which are still
accessible.
Duty cycle of motor pulse
7
0
75 %
1
100 %
Pulse stretching
8
2004 Jan 20
0
no pulse stretching
1
a pulse width of 2tp and a duty factor
of 25 % is added
Writing to the OTP cells and performing the related
functional checks is achieved in the PCA2002 by
modulating the supply voltage. The necessary control
circuit consists basically of a voltage level detector, an
instruction state counter (which determines the function to
be performed) and an 8-bit shift register which allows
writing the OTP cells of an 8-bit word in one step and which
acts as data pointer for checking the OTP content.
6
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
MEASUREMENT OF OSCILLATOR FREQUENCY AND INHIBIT TIME
There are four different instruction states:
• State 1; measurement of the crystal oscillator frequency
(divided by 1024)
The output of the two measuring states can either be
monitored directly at pin RESET or as a modulation of the
supply current (a modulating resistor of 30 kΩ is
connected between VDD and VSS when the signal at pin
RESET is HIGH):
• State 2; measurement of the inhibition time
• State 3; write/check word A
• State 4; write/check word B.
• State 1; crystal oscillator frequency divided by 1024;
state 1 starts with a pulse to VP(start) and ends with a
second pulse to VP(stop)
Each instruction state is switched on with a pulse to
VP(start). After this large pulse, an initial waiting time of t0 is
required. The programming instructions are then entered
by modulating the supply voltage with small pulses of an
amplitude VP(mod) and pulse width tmod. The first small
pulse defines the start time, the following pulses perform
three different functions, depending on the time delay (td)
from the preceding pulse (see Fig.6):
• State 2; inhibition time (see Fig.7); a frequency with the
period of (31.25 + n × 0.122) ms appears at pin RESET
and as current modulation at the supply pin.
• td = t1 (0.7 ms); increments the instruction counter
handbook, halfpage
• td = t2 (1.7 ms); clocks the shift register with D = 0 at the
input
VDD
VSS
• td = t3 (2.7 ms); clocks the shift register with D = 1 at the
input.
MGU720
Fig.7
VDD
handbook, halfpage
t p(stop)
t p(start)
t0
Applying the two-stage programming pulse (see Fig.8)
transfers the stored data in the shift register to the OTP
cells.
t1
Perform the following to programme a memory word:
VP(mod)
VDD(nom)
1. Starting with a VP(start) pulse, wait for the time period t0
then set the instruction counter to the word to be
written (td = t1)
VSS
MGU719
Fig.6
2. Enter the data to be stored into the shift register (td = t2
or t3), LSB first (bit 8) and MSB last (bit 1)
Supply voltage modulation for start and stop
of instruction state 2.
3. Applying the two-stage programming pulse Vpre-store
followed by Vstore stores the word. The delay between
the last data bit and the pre-store pulse Vpre-store is
td = t4. Store the word by raising the supply voltage to
Vstore (9.9 V for 100 ms); the delay between the last
data bit and the store pulse is td = t4 (0.2 ms).
The programming procedure requires a stable oscillator,
which means that a waiting time, determined by the
start-up time of the oscillator, is necessary after power-up
of the circuit.
The example shown in Fig.8 performs the following
functions: start, setting the instruction counter to state 4
(word B), entering data word 110101 into the shift register
(sequence: LSB first and MSB last) and writing the OTP
cells for word B.
After the VP(start) pulse, the instruction counter is in state 1
and the data shift register is cleared. The instruction state
ends with a second pulse to VP(start) or with the pulse to
Vstore. In any event the instruction states are terminated
automatically 2 seconds after the last VP(mod) pulse.
2004 Jan 20
Output waveform at pin RESET for
instruction state 2.
PROGRAMMING THE MEMORY CELLS
VP(stop)
VP(start)
31.25 ms + Inhibtion time
7
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
tpre-store
handbook, full pagewidth
VDD(mod)
Vstore
t p(start)
VP(start)
Vpre-store
t0
t1 t1 t1
t3
t2
t3
t2
t3
t3
t4
t store
VP(mod)
VDD
VSS
MGW356
Fig.8 Supply voltage modulation for programming.
CHECKING THE MEMORY CONTENT
The stored data of the OTP array can be checked bit-wise by measuring the supply current. The array word is selected
by the instruction state, the bit is addressed by the shift register. To read a word, the word is first selected (td = t1) and a
logic 1 is written into the first cell of the shift register (td = t3).
This logic 1 is then shifted through the entire shift register (td = t2, so that it points with each clock pulse to the next bit.
If the addressed OTP cell contains a logic 1, a 30 kΩ resistor is connected between VDD and VSS; this increases the
supply current accordingly.
VDD(mod)
t p(start)
t p(stop)
VP(start)
VP(stop)
t0
t1 t1 t1
t3
t2
t2
t2
t2
t2
VP(mod)
VDD
VSS
I DD
(1)
mgw357
V DD
(1) ∆I DD = --------------30 kΩ
The corresponding supply current variation for B = 110101 (the sequence is MSB first and LSB last).
Fig.9 Supply voltage modulation for reading word B.
2004 Jan 20
8
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
Frequency tuning at assembled watch
Figure 10 shows the test set-up for frequency tuning the assembled watch.
handbook, full pagewidth
32 kHz
M
PCA200x
FREQUENCY
COUNTER
motor
PROGRAMMABLE
DC POWER SUPPLY
battery
PC INTERFACE
PC
MGW568
Fig.10 Frequency tuning the assembled watch.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
VSS = 0 V; notes 1 and 2
MIN.
MAX.
UNIT
−1.8
+7
V
VSS − 0.5
VDD + 0.5
V
VDD
supply voltage
VI
all input voltages
tsc
short-circuit duration time
Tamb
ambient temperature
−10
+60
°C
Tstg
storage temperature
−30
+100
°C
indefinite
Notes
1. When writing to the OTP cells, the supply voltage (VDD) can be raised to a maximum of 12 V for a time period of 1 s.
2. Connecting the battery with reversed polarity does not destroy the circuit, but in this condition a large current flows
which rapidly discharges the battery.
HANDLING
Inputs and outputs are protected against electrostatic discharge in normal handling. However it is good practice to take
normal precautions appropriate to handling MOS devices (see “Handling MOS devices” ).
2004 Jan 20
9
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
CHARACTERISTICS
VDD = 1.55 V; VSS = 0 V; fosc = 32.768 kHz; Tamb = 25 °C; quartz crystal; Rs = 40 kΩ; C1 = 2 to 3 fF; CL = 8.2 pF; unless
otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supplies
VDD
supply voltage
normal operating mode;
Tamb = −10 °C to +60 °C
∆VDD
supply voltage variation ∆V/∆t = 1 V/µs
IDD
supply current
between motor pulses
1.1
1.55
3.6
V
−
−
0.25
V
−
90
120
nA
between motor pulses at
VDD = 3.5 V
−
120
180
nA
Tamb = −10 °C to +60 °C
−
−
200
nA
stop mode; pin RESET connected −
to VDD
100
135
nA
−
150
200
mV
Motor output
Vsat
saturation voltage
∑(P + N)
RM = 2 kΩ;
Tamb = −10 °C to +60 °C
Zo(sc)
short-circuit impedance between motor pulses;
Imotor < 1 mA
−
200
300
Ω
Vstart
starting voltage
1.1
−
−
V
gm
transconductance
5
10
−
µS
−
0.3
0.9
s
−
0.05
0.2
ppm
4.3
5.2
6.3
pF
allowed resistance between
adjacent pins
20
−
−
MΩ
Oscillator
tsu
start-up time
∆f/f
frequency stability
CL
integrated load
capacitance
Rpar
parasitic resistance
VOSCIN ≤ 50 mV (p-p)
∆VDD = 100 mV
Reset
fo
output frequency
−
32
−
Hz
∆Vo
output voltage swing
RL = 1 MΩ; CL = 10 pF
1.4
−
−
V
tr
rise time
RL = 1 MΩ; CL = 10 pF
−
1
−
µs
tf
fall time
RL = 1 MΩ; CL = 10 pF
−
1
−
µs
Ii(av)
average input current
pin RESET connected to VDD or
VSS
−
10
20
nA
2004 Jan 20
10
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
OTP PROGRAMMING CHARACTERISTICS
SYMBOL
PARAMETER(1)
MIN.
TYP.
MAX.
UNIT
VDD
supply voltage during programming procedure
1.5
−
3.0
V
VP(start)
supply voltage for starting programming procedure
6.6
−
6.8
V
VP(stop)
supply voltage for stopping programming procedure
6.2
−
6.4
V
VP(mod)
supply voltage modulation for entering instructions
320
350
380
mV
Vpre-store
supply voltage for pre-store pulse
6.2
−
6.4
V
Vstore
supply voltage for writing to the OTP cells
9.9
10.0
10.1
V
Istore
supply current for writing to the OTP cells
−
−
10
mA
tp(start)
pulse width of start pulse
8
10
12
ms
tp(stop)
pulse width of stop pulse
0.05
−
0.5
ms
tmod
modulation pulse width
25
30
40
µs
tpre-store
pulse width of pre-store pulse
0.05
−
0.5
ms
tstore
pulse width for writing to the OTP cells
95
100
110
ms
t0
waiting time after start pulse
20
−
30
ms
t1
pulse distance for incrementing the state counter
0.6
0.7
0.8
ms
t2
pulse distance for clocking the data register with
data = logic 0
1.6
1.7
1.8
ms
t3
pulse distance for clocking the data register with
data = logic 1
2.6
2.7
2.8
ms
t4
waiting time for writing to the OTP cells
0.1
0.2
0.3
ms
SR
slew rate for modulation of the supply voltage
0.5
−
5
V/µs
Rread
read out resistor for supply current modulation
18
30
45
kΩ
Note
1. Programme each word once only.
2004 Jan 20
11
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
BONDING PAD LOCATIONS
COORDINATES(1)
SYMBOL
y
1
−480
+330
i.c.(3)
2
−480
+160
OSCIN
3
−480
−160
OSCOUT
4
−480
−330
VDD
5
+480
−330
MOT1
6
+480
−160
MOT2
7
+480
+160
RESET
8
+480
+330
VSS
VSS
1
i.c.
2
y
x
0.90 mm
0
OSCIN
3
OSCOUT
4
8
RESET
7
MOT2
PC2002
x
(2)
1.20 mm
handbook, halfpage
PAD
0
6
MOT1
5
VDD
MBL574
Fig.11 Bonding pad locations.
Notes
1. All coordinates are referenced, in µm, to the centre of
the die (see Fig.11).
Table 5
2. The substrate (rear side of the chip) is connected to
VSS. Therefore, the die pad must be either floating or
connected to VSS.
Mechanical chip data; note 1
PARAMETER
VALUE
Bonding pad:
3. Pad i.c. is used for factory tests; in normal operation it
should be left open-circuit, and it has an internal
pull-down resistance to VSS.
metal
96 × 96 µm
opening
86 × 86 µm
Note
1. The substrate of the chip is connected to VSS. The
pad i.c. is used for factory test, in normal operation it
should be left open-circuit. The pad i.c. has an internal
pull-down resistor connected to VSS.
2004 Jan 20
12
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
TRAY INFORMATION
handbook, full pagewidth
A
x
G
C
H
y
1,1
2,1
1,2
2,2
3,1
x,1
D
B
1,3
F
x,y
1,y
A
A
E
M
J
SECTION A-A
MGU653
Fig.12 Tray details.
Table 6
Tray dimensions
DIMENSION
DESCRIPTION
VALUE
pocket pitch; x direction
2.15 mm
B
pocket pitch; y direction
2.43 mm
C
pocket width; x direction
1.01 mm
D
pocket width; y direction
1.39 mm
E
tray width; x direction
50.67 mm
F
tray width; y direction
50.67 mm
G
distance from cut corner to
pocket (1 and 1) centre
4.86 mm
H
distance from cut corner to
pocket (1 and 1) centre
4.66 mm
handbook, halfpage
PCA2002
A
MBL573
J
tray thickness
3.94 mm
M
pocket depth
0.61 mm
x
number of pockets in
x direction
20
The orientation of the IC in a pocket is indicated by the position of the
IC type name on the surface of the die, with respect to the cut corner
on the upper left of the tray.
y
number of pockets in
y direction
18
Fig.13 Tray alignment.
2004 Jan 20
13
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
PACKAGE OUTLINE
PMFP8: plastic micro flat package; 8 leads (straight)
SOT144-1
E
D
X
c
m
t
n
HE
8
5
Q2
A2
Q1
pin 1 index
L
detail X
1
4
e
w M
b
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A2
b
c
D (1)
E (1)
e
HE
L
m
max.
n
max.
Q1
Q2
t
w
mm
0.9
0.7
0.40
0.25
0.19
0.12
3.1
2.9
3.1
2.9
0.8
4.6
4.4
0.75
0.26
0.3
0.4
0.3
0.4
0.3
0.95
0.1
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
OUTLINE
VERSION
REFERENCES
IEC
JEDEC
JEITA
ISSUE DATE
95-01-24
03-03-12
SOT144-1
2004 Jan 20
EUROPEAN
PROJECTION
14
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
HVSON10: plastic thermal enhanced very thin small outline package; no leads;
10 terminals; body 3 x 3 x 0.85 mm
SOT650-1
0
1
2 mm
scale
X
A
B
D
A
A1
E
c
detail X
terminal 1
index area
C
e1
terminal 1
index area
e
5
y
y1 C
v M C A B
w M C
b
1
L
Eh
6
10
Dh
DIMENSIONS (mm are the original dimensions)
UNIT
A(1)
max.
A1
b
c
D(1)
Dh
E(1)
Eh
e
e1
L
v
w
y
y1
mm
1
0.05
0.00
0.30
0.18
0.2
3.1
2.9
2.55
2.15
3.1
2.9
1.75
1.45
0.5
2
0.55
0.30
0.1
0.05
0.05
0.1
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
JEITA
SOT650-1
---
MO-229
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2004 Jan 20
15
EUROPEAN
PROJECTION
ISSUE DATE
01-01-22
02-02-08
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
If wave soldering is used the following conditions must be
observed for optimal results:
SOLDERING
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
worldwide use of lead-free solder pastes is increasing.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
• below 225 °C (SnPb process) or below 245 °C (Pb-free
process)
Manual soldering
– for all BGA, HTSSON-T and SSOP-T packages
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
volume ≥ 350 mm3 so called thick/large packages.
• below 240 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
2004 Jan 20
PCA2002
16
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
REFLOW(2)
BGA, HTSSON..T(3), LBGA, LFBGA, SQFP, SSOP..T(3), TFBGA,
USON, VFBGA
not suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
suitable
PLCC(5), SO, SOJ
suitable
suitable
not
recommended(5)(6)
suitable
SSOP, TSSOP, VSO, VSSOP
not
recommended(7)
suitable
CWQCCN..L(8), PMFP(9), WQCCN..L(8)
not suitable
LQFP, QFP, TQFP
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted
on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar
soldering process. The appropriate soldering profile can be provided on request.
9. Hot bar or manual soldering is suitable for PMFP packages.
2004 Jan 20
17
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
PCA2002
DATA SHEET STATUS
LEVEL
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
Development
DEFINITION
I
Objective data
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Production
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
DEFINITIONS
DISCLAIMERS
Short-form specification  The data in a short-form
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
Life support applications  These products are not
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition  Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes  Philips Semiconductors
reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
Application information  Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2004 Jan 20
18
Philips Semiconductors
Product specification
32 kHz watch circuit with programmable
output period and pulse width
Bare die  All die are tested and are guaranteed to
comply with all data sheet limits up to the point of wafer
sawing for a period of ninety (90) days from the date of
Philips' delivery. If there are data sheet limits not
guaranteed, these will be separately indicated in the data
sheet. There are no post packing tests performed on
individual die or wafer. Philips Semiconductors has no
control of third party procedures in the sawing, handling,
packing or assembly of the die. Accordingly, Philips
Semiconductors assumes no liability for device
functionality or performance of the die or systems after
third party sawing, handling, packing or assembly of the
die. It is the responsibility of the customer to test and
qualify their application in which the die is used.
2004 Jan 20
19
PCA2002
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: [email protected]
SCA76
© Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R15/03/pp20
Date of release: 2004
Jan 20
Document order number:
9397 750 11671