Document No.001-64406 Rev. *D ECN # 4550042 Cypress Semiconductor Package Qualification Report QTP 100401 VERSION*D October 2014 68-Lead Saw QFN (Quad Flat No-Lead) (8 x 8 x 1.0mm) NiPdAu, MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEAE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Honesto Sintos Reliability Engineer Reviewed By: Rene Rodgers Reliability Manager Approved By: Richard Oshiro Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-64406 Rev. *D ECN # 4550042 PACKAGE QUALIFICATION HISTORY QUAL REPORT DESCRIPTION OF QUALIFICATION PURPOSE DATE COMP. 100401 Qualify 68-Lead Saw QFN (8 x 8 x 1.0 mm), NiPdAu, using Nitto GE7470 Mold Compound, QMI519 Epoxy, MSL3, 260C Reflow assembled at CML-RA March 2011 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Document No.001-64406 Rev. *D ECN # 4550042 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: LT68A Package Outline, Type, or Name: 68-Lead Saw Quad Flat No Lead (QFN) Mold Compound Name/Manufacturer: GE7470 / Nitto Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: <0.1 cm2/h Oxygen Rating Index: N/A Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer Saw Die Attach Supplier: Henkel Die Attach Material: QMI519 Die Attach Method: Epoxy Bond Diagram Designation 001-54870 Wire Bond Method: Thermosonic Wire Material/Size: 0.8mil / Au Thermal Resistance Theta JA °C/W: 45C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-64406 Rev. *D ECN # 4550042 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Test Condition (Temp/Bias) Result P/F MIL-STD-883C, Method 1010, Condition C, -65 C to 150 C Temperature Cycle Precondition: JESD22 Moisture Sensitivity MSL3 P (192 Hrs., 30C, 60% RH) JESD22-A102: 121°C, 100%RH, 15 Psig Pressure Cooker Test Precondition: JESD22 Moisture Sensitivity MSL3 P (192 Hrs., 30C, 60% RH) Electrostatic Discharge Human Body Model (ESD HBM) Electrostatic Discharge Charge Device Model (ESD CDM) (750V) JEDEC EIA/JESD22-A114-B P (500V) JESD22-C101 P JEDEC STD 22-A110: 130 C, 85%RH, 3.63V High Accelerated Saturation Test (HAST) Precondition: JESD22 Moisture Sensitivity Level P (192 Hrs., 30C, 60% RH) High Temp Storage JESD22-A103: 150C, no bias P Ball Shear JESD22-B116A, Cpk : 1.33, Ppk : 1.66 P Bond Pull MIL-STD-883 – Method 2011, Cpk : 1.33, Ppk : 1.66 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf 30001-5000 sq. mils = 1.2 kgf Die Shear P >5001 sq. mils = 1.2 kgf Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack P Physical Dimension MIL-STD-1835, JESD22-B100 P J-STD-002, JESD22-B102 Solderability , Steam Aged 95% solder coverage minimum P Thermal Shock MIL-STD-883C, Method 1011, Condition B, -55 C to 125C and JESD22A106B, Condition C, -55 C to 125C P X-ray MIL-STD-883 2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 Document No.001-64406 Rev. *D ECN # 4550042 Reliability Test Data QTP #: Device 100401 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA COMP 15 0 CY8C3866LTI (8C38661BC) 4942670 611006167-2 CML-RA COMP 15 0 CY8C3866LTI (8C38661BC) 4942670 611006167-3 CML-RA COMP 15 0 4942670 611006167-1 CML-RA COMP 10 0 4942670 611006167-1 CML-RA COMP 10 0 4942670 611006167-1 CML-RA COMP 5 0 4942670 611006167-1 CML-RA COMP 15 0 Failure Mechanism STRESS: ACOUSTIC, MSL3 STRESS: BOND PULL CY8C3866LTI (8C38661BC) STRESS: BALL SHEAR CY8C3866LTI (8C38661BC) STRESS: CONSTRUCTIONAL ANALYSIS CY8C3866LTI (8C38661BC) STRESS: DIE SHEAR CY8C3866LTI (8C38661BC) STRESS: DYE PENETRANT TEST CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA COMP 15 0 CY8C3866LTI (8C38661BC) 4942670 611006167-2 CML-RA COMP 15 0 CY8C3866LTI (8C38661BC) 4942670 611006167-3 CML-RA COMP 15 0 COMP 9 0 10 0 STRESS: ESD-CHARGE DEVICE MODEL, (500V) CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114-E, 750V CY8C3866AXI (8C38661CC) 4016039 WAFER 21 CML-RA COMP STRESS: HI-ACCEL SATURATION TEST, 130C, 3.63V, 60%RH, PRE COND 192 HR 30C/60%RH, MSL3 CY8CTMA301E (8C20323D) 4937898 610944485-1 CML-RA 128 75 0 STRESS: HIGH TEMP STORAGE CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA 500 76 0 CY7C65640A (7C65642EC) 4841890 610902567-1 CML-RA 1000 76 0 4942670 611006167-1 CML-RA COMP 5 0 STRESS: INTERNAL VISUAL CY8C3866LTI (8C38661BC) STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA 168 70 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-64406 Rev. *D ECN # 4550042 Reliability Test Data QTP #: Device Fab Lot # 100401 Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PHYSICAL DIMENSION CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA COMP 30 0 CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA COMP 3 0 CY8C3866LTI (8C38661BC) 4942670 611006167-2 CML-RA COMP 3 0 CY8C3866LTI (8C38661BC) 4942670 611006167-3 CML-RA COMP 3 0 STRESS: SOLDERABILITY STRESS: TC COND. C –65C TO 150C, PRE COND 192 HR 30C/60%RH, MSL3 CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA 500 80 0 CY8C3866LTI (8C38661BC) 4942670 611006167-2 CML-RA 500 80 0 CY8C3866LTI (8C38661BC) 4942670 611006167-3 CML-RA 500 80 0 CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA 200 80 0 CY8C3866LTI (8C38661BC) 4942670 611006167-1 CML-RA 1000 80 0 4942670 611006167-1 CML-RA COMP 15 0 STRESS: THERMAL SHOCK STRESS: X-RAY CY8C3866LTI (8C38661BC) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-64406 Rev. *D ECN # 4550042 Document History Page Document Title: Reflow CML-RA Document Number: Rev. ECN No. ** 3041906 *A 3072361 *B 3184909 QTP 100401: 68-Lead Saw QFN (Quad Flat No-Lead) - 8 X 8 X 1.0mm NiPdAu, MSL3, 260C 001-64406 Orig. of Change NRG NRG NRG *C 3761797 NSR *D 4550042 HSTO Description of Change Initial spec release Modified HBM data to reflect 750V readpoint. Removed the word “Preliminary Qualification Report” Modified the reliability test table using the new template Updated the completion date and PCT result Updated the mold compound name to exclude the alphabetic revision. Removed reference Cypress specs in reliability tests performed table and replace with industry standards. Removed VERSION 2.0 in the title page. Removed obsolete specs. Align qualification report based on the new template in the front page Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7