Document No.001-97552 Rev. ** ECN # 4761406 Cypress Semiconductor Package Qualification Report QTP# 140204 VERSION** May, 2015 48 VFBGA (6x8x1.0mm) SAC 105, CuPd Wire MSL3, 260C Reflow CML-RA FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Manager Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 7 Document No.001-97552 Rev. ** ECN # 4761406 PACKAGE QUALIFICATION HISTORY QTP Number 140204 Description of Qualification Purpose Qualification of Amazon ULL65 on 48 VFBGA (6x8x1.0 mm) at CML-RA using Kinsus Substrate, GR9810-1PLA Mold Compound, QMI-506 Die Attach Epoxy, SAC-105 Solder Ball, 0.8 mil CuPd Wire, with MSL 3, 260°C Reflow Temperature Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 7 Date March 2014 Document No.001-97552 Rev. ** ECN # 4761406 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: BZ48A VFBGA (Very Fine Ball Grid Array) GR9810-1PLA/Henkel V-0 / UL94 Oxygen Rating Index: 54 (Typical) / 28 (Min. value) Substrate Material: BT resin Lead Finish, Composition / Thickness: SAC105 Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: QMI 506 Bond Diagram Designation: 001-85195 Wire Bond Method: Thermosonic Wire Material/Size: CuPd, 0.8 mil Thermal Resistance Theta JA °C/W: 32°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-91553 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Note: Please contact a Cypress Representative for other packages availability. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 7 Document No.001-97552 Rev. ** ECN # 4761406 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENTS Stress/Test Test Condition (Temp/Bias) Result P/F Acoustic Microscopy J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Ball Shear JESD22-B116 P Bond Pull MIL-STD-883 – Method 2011 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package MIL-STD-883, Method 2019 Per die size: <3000 sq. mils = 1.2 kgf Die Shear 30001-5000 sq. mils = 1.2 kgf P P >5001 sq. mils = 1.2 kgf Dye Penetrant Test Test to determine the existence and extent of cracks, Criteria: No Package Crack P Electrostatic Discharge Charge Device Model (ESD-CDM) 500V/1,000V/1,250V JESD22-C101 P Final Visual JESD22-B101 P High Accelerated Saturation Test (HAST) JEDEC STD 22-A110: 110°C, 85%RH, 3.65V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P High Temperature Storage JESD22-A103:150°C No bias P Internal Visual MIL-STD-883-2014 P Physical Dimension MIL-STD-1835, JESD22-B100 P Pressure Cooker JESD22-A102: 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P Solder Ball Shear JESD22-B117 P Temperature Cycle MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) P X-Ray MIL-STD-883 - 2012 P Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 7 Document No.001-97552 Rev. ** ECN # 4761406 Reliability Test Data QTP #: 140204 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 170 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 30 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 30 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 30 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 30 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 30 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 30 0 611348182 CML-RA COMP 5 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA 500 9 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA 1000 3 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA 1250 3 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 834 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 805 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 528 0 STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY7C1061G30 (7CC171061A) 9313001 STRESS: DIE SHEAR STRESS: DYE PENETRANT TEST STRESS: ESD-CHARGE DEVICE MODEL STRESS: FINAL VISUAL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 7 Document No.001-97552 Rev. ** ECN # 4761406 Reliability Test Data QTP #: 140204 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: HI-ACCEL SATURATION TEST, 110C, 85%RH, 3.65V, PRE COND 192 HR 30C/60%RH, MSL3 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA 264 30 0 STRESS: HIGH TEMPERATURE STORAGE, PLASTIC, 150C CY7C1061G30 (7CC171061A 9313001 611333088 CML-RA 500 79 0 CY7C1061G30 (7CC171061A 9313001 611333088 CML-RA 1000 79 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 5 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 30 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 30 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 30 0 STRESS: INTERNAL VISUAL STRESS: PHYSICAL DIMENSION STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY7C1061G30 (7CC171061A 9313001 611333088 CML-RA 168 78 0 CY7C1061G30 (7CC171061A 9313001 611333088 CML-RA 288 78 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 150 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 150 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 150 0 STRESS: SOLDER BALL SHEAR STRESS: TEMPERATURE CYCLE COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA 500 80 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA 1000 78 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA 500 80 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA 1000 79 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA 500 80 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA 1000 80 0 CY7C1061G30 (7CC171061A) 9313001 611348182 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348183 CML-RA COMP 15 0 CY7C1061G30 (7CC171061A) 9313001 611348184 CML-RA COMP 15 0 STRESS: X-RAY Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 7 Document No.001-97552 Rev. ** ECN # 4761406 Document History Page Document Title: Document Number: QTP#140204:48 VFBGA (6X8X1.0MM) SAC 105, CUPD WIRE, MSL3, 260C REFLOW, CML-RA 001-97552 Rev. ECN Orig. of No. Change ** 4761406 JYF Description of Change Initial spec release. Distribution: WEB Posting: None Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 7