Document No. 002-10599 Rev. *A ECN #: 5310650 Cypress Semiconductor Automotive Product Qualification Report QTP# 144001 VERSION *A June 2016 Automotive PSoC4A Device Family S8PF-10P Technology, Fab4 CY8C4124 CY8C4125 CY8C4244 CY8C4245 AUTOMOTIVE PROGRAMMABLE SYSTEM-ON-CHIP (PSOC(R)) FOR ANY QUESTIONS ON THIS REPORT PLEASE CONTACT [email protected] : OR VIA LINK A CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Reliability Engineer Reviewed By: Rene Rodgers (RT) Reliability Engineer MTS Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 PRODUCT QUALIFICATION HISTORY QTP Number 144001 Description of Qualification Purpose Qualification of Automotive PSoC4A Device S8PF-10P Technology in CMI (Fab4) Company Confidential A printed copy of this document is considered uncontrolled. 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Page 2 of 13 Date Dec 15 Document No. 002-10599 Rev. *A ECN #: 5310650 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify Automotive PSoC4A Device S8PF-10P Technology in CMI (Fab 4) CY8C4124, CY8C4125, CY8C4244, CY8C4245 Marketing Part #: Device Description: Automotive PSOC Programmable System – On – Chip Cypress Division: Cypress Semiconductor Corporation – Programmable Systems Division (PSD) TECHNOLOGY/FAB PROCESS DESCRIPTION Number of Metal Layers: 5 Metal Metal 1: 100A Ti / 3200A Al 0.5%Cu / 300A TiW Composition: Metal 2: 100A Ti / 3200A Al 0.5%Cu / 350A TiW Metal 3: 150A Ti / 7200A AI 0.5%Cu / 350A TiW Metal 4: 150A Ti / 7200A Al 0.5%Cu / 350A TiW Metal 5: 300A Ti / 12000A Al 0.5%Cu / 300A TiW Passivation Type and Materials: Generic Process Technology/Design Rule ( -drawn): Gate Oxide Material/Thickness (MOS): Name/Location of Die Fab (prime) Facility: Die Fab Line ID/Wafer Process ID: NFUSOX/ Nitride S8PF-10P SiO2 / 32A/120A CMI / Minnesota Fab 4, S8PF-10P PACKAGE AVAILABILITY PACKAGE ASSEMBLY FACILITY SITE QTP NUMBER 28-Lead SSOP CML-RA 144202 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 3 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: SP282 Package Outline, Type, or Name: 28L- SSOP Package (209mils) Mold Compound Name/Manufacturer: KEG3000 / Kyocera Mold Compound Flammability Rating: V-O per UL94 Mold Compound Alpha Emission Rate: N/A Oxygen Rating Index: 70% Lead Frame Designation: Pre-plated with slot design Lead Frame Material: Copper Lead Finish, Composition / Thickness: NiPdAuAg (Roughened) Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Wafer saw Die Attach Supplier: Henkel Die Attach Material: QMI 509 Die Attach Method: Epoxy Bond Diagram Designation: 001-93568 Wire Bond Method: Thermosonic Wire Material/Size: Au / 0.8mil Thermal Resistance Theta JA °C/W: 61.10 C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 001-93568 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA, CML-R Note: Please contact a Cypress Representative for other packages availability. 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Page 4 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test High Temperature Operating Life Early Failure Rate High Temperature Operating Life Latent Failure Rate Endurance /High Temperature Operating Life Latent Failure Rate High Accelerated Saturation Test (HAST) Temperature Cycle Pressure Cooker Test Condition (Temp/Bias) AEC-Q100-008 and JESD22-A108, 150°C Dynamic Operating Condition, Vcc Max = 2.34V JESD22-A108, 150°C Dynamic Operating Condition, Vcc Max = 2.34V AEC-Q100-005 and JESD22-A108, 150°C Dynamic Operating Condition, Vcc Max = 2.34V JESD22-A110, 130C, 5.5V, 85%RH Precondition: JESD22-A113 Moisture Sensitivity MSL 3 (192 Hrs., 30 C, 60% RH, 260 C Reflow) JESD22-A104, -65 C to 150 C Precondition: JESD22-A113 Moisture Sensitivity MSL 3 (192 Hrs., 30 C, 60% RH, 260 C Reflow) JESD22-A102, 121C, 100%RH, 15 Psig Precondition: JESD22-A113 Moisture Sensitivity MSL 3 (192 Hrs., 30 C, 60% RH, 260 C Reflow) Result P/F P P P P P P Electrostatic Discharge Human Body Model (ESD-HBM) AEC-Q100-002 500V/1000V/1500V/2000V/4000V/6000V P Electrostatic Discharge Charge Device Model (ESD-CDM) AEC-Q100-011 250V/500V/ 750V (corner pins) P Wire Ball Shear AEC-Q100-001 P Wire Bond Pull Mil-Std 883, Method 2011 P Electrical Distribution AEC-Q100-009 P Endurance/Data Retention AEC-Q100-005, 150 C, non-biased P Final Visual JESD22-B101 P High Temperature Storage Life JESD22-A103, 150 C P Solderability JESD22-B102 P Acoustic Microscopy JEDEC JSTD-020 P Static Latch-up AEC-Q100-004, 85C, 140mA P Mil-Std 883, Method 2011 P Constructional Analysis Criteria: Meet external and internal characteristics of Cypress package P Dye Penetrant Test Criteria: No Package Crack P Post Temperature Cycle Wire Bond Pull Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 RELIABILITY FAILURE RATE SUMMARY Stress/Test High Temperature Operating Life Early Failure Rate NVM Endurance / High Temperature Operating Life1,2 Long Term Failure Rate Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate 10, 189 Devices 0 N/A N/A 0 PPM 179,520 Device Hours 0 0.7 170 30 FIT 1 Assuming an ambient temperature of 55 C and a junction temperature rise of 15 C. Chi-squared 60% estimations used to calculate the failure rate.. 3 Thermal Acceleration Factor is calculated from the Arrhenius equation 2 AF = exp EA k 1 - 1 T2 T1 where: EA =The Activation Energy of the defect mechanism. K = Boltzmann’s constant = 8.62x10-5 Ev/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Company Confidential A printed copy of this document is considered uncontrolled. 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Page 6 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 Reliability Test Data QTP #: Device 144001 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA COMP 22 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA COMP 22 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA COMP 22 0 CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA COMP 30 0 CY8C4245PVS (8A44200BC) 4405548 611507318 CML-RA COMP 30 0 CY8C4125PVS (8A44200BC) 4424970 611507320 CML-RA COMP 30 0 CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA COMP 30 0 CY8C4245PVS (8A44200BC) 4405548 611507318 CML-RA COMP 30 0 CY8C4125PVS (8A44200BC) 4424970 611507320 CML-RA COMP 30 0 4407790 611507486 CML-RA COMP 5 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA COMP 15 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA COMP 15 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA COMP 15 0 Failure Mechanism STRESS: ACOUSTICS STRESS: BALL SHEAR STRESS: BOND PULL STRESS: CONSTRUCTIONAL ANALYSIS CY8C4245PVA (8A44200BC) STRESS: DYE PENETRANT STRESS: ELECTRICAL DISTRIBUTION CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA COMP 30 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA COMP 30 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA COMP 30 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE, 150C, 2.34V, Vcc Max CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 48 412 0 CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA 48 2527 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA 48 969 0 CY8C4245PVS (8A44200BC) 4405548 611507318 CML-RA 48 2735 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA 48 860 0 CY8C4125PVS (8A44200BC) 4424970 611507320 CML-RA 48 2686 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 7 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Assy Loc 144001 Duration Samp Rej Failure Mechanism STRESS: ENDURANCE / DATA RETENTION TEST CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA 1000 78 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA 1000 79 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA 1000 79 0 STRESS: ENDURANCE / HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA 408 75 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA 408 75 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA 408 73 0 STRESS: ESD-CHARGE DEVICE MODEL CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 250 3 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 500 3 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 750 3 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22-A114 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 500 3 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 1000 3 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 2000 3 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 4000 3 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 6000 3 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA COMP 1400 0 CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA COMP 2800 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA COMP 1400 0 CY8C4245PVS (8A44200BC) 4405548 611507318 CML-RA COMP 2800 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA COMP 1400 0 CY8C4125PVS (8A44200BC) 4424970 611507320 CML-RA COMP 2800 0 STRESS: FINAL VISUAL STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4245PVA (8A44200BC) 4407790 611423519 CML-RA 96 77 0 CY8C4245PVA (8A44200BC) 4407790 611423646 CML-RA 96 76 0 CY8C4245PVA (8A44200BC) 4407790 611423520 CML-RA 96 77 0 Company Confidential A printed copy of this document is considered uncontrolled. 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Page 8 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 Reliability Test Data QTP #: Device Fab Lot # Assy Lot # Assy Loc 611423519 CML-RA 144001 Duration Samp Rej Failure Mechanism STRESS: HIGH TEMPERATURE STORAGE CY8C4245PVA (8A44200BC) 4407790 1000 80 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA 408 75 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA 408 75 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA 408 73 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4245PVA (8A44200BC) 4407790 611423519 CML-RA 96 78 0 CY8C4245PVA (8A44200BC) 4407790 611423519 CML-RA 168 78 0 CY8C4245PVA (8A44200BC) 4407790 611423646 CML-RA 96 78 0 CY8C4245PVA (8A44200BC) 4407790 611423646 CML-RA 168 78 0 CY8C4245PVA (8A44200BC) 4407790 611423520 CML-RA 96 78 0 CY8C4245PVA (8A44200BC) 4407790 611423520 CML-RA 168 78 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 96 80 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA 96 80 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA 96 80 0 STRESS: POST TEMPERATURE CYCLE WIRE BOND PULL CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 500 5 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 500 5 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA 500 5 0 STRESS: PRE /POST LFR CRITICAL PARAMETER CY8C4245PVA (8A44200BC) 4407790 611507487 CML-RA COMP 30+2 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA COMP 30+2 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA COMP 30+2 0 CML-RA COMP 6 0 STRESS: STATIC LATCH-UP TESTING, (+/-140Ma 85C) CY8C4245PVA (8A44200BC) 4407790 611507486 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 Reliability Test Data QTP #: Device 144001 Fab Lot # Assy Lot # Assy Loc Duration Samp Rej CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA COMP 15 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA COMP 15 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA COMP 15 0 Failure Mechanism STRESS: SOLDERABILITY STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH, MSL3 CY8C4245PVA (8A44200BC) 4407790 611423519 CML-RA 500 85 0 CY8C4245PVA (8A44200BC) 4407790 611423519 CML-RA 1000 80 0 CY8C4245PVA (8A44200BC) 4407790 611423646 CML-RA 500 85 0 CY8C4245PVA (8A44200BC) 4407790 611423646 CML-RA 1000 85 0 CY8C4245PVA (8A44200BC) 4407790 611423520 CML-RA 500 85 0 CY8C4245PVA (8A44200BC) 4407790 611423520 CML-RA 1000 85 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 500 85 0 CY8C4245PVA (8A44200BC) 4407790 611507486 CML-RA 1000 80 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA 500 85 0 CY8C4245PVS (8A44200BC) 4405548 611507317 CML-RA 1000 80 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA 500 85 0 CY8C4125PVS (8A44200BC) 4424970 611507319 CML-RA 1000 85 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 Reliability Test Data ER #: 162021 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max CY8C4245PVS (844200BC) 4405548 611507487 CML-RA 408 123 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 Reliability Test Data ER #: 162036 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE, 150C, 2.34V, Vcc Max CY8C4245PVS (844200BC) 4405548 611507318 CML-RA 408 94 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 13 Document No. 002-10599 Rev. *A ECN #: 5310650 Document History Page Document Title: Document Number: Rev. ECN No. ** *A 5071108 5310650 QTP# 144001: Automotive PSoC4A Device Family, S8PF-10P Technology, Fab 4 002-10599 Orig. of Change JYF HSTO Description of Change Initial spec release Added ER162021 and ER162036 LFR result Re-computed Device hours and FIT Rate Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 13