Document No.002-11674 Rev. *A ECN # 5226089 Cypress Semiconductor Product Qualification Report QTP# 151204 VERSION*A April 2016 PSoC4A-BLE 256K Device Family S8PIRS Technology, Fab 4 (CMI) CY8C4128 PSoC 4XX8_BLE Family Programmable System-on-Chip (PSoC) ® CY8C4248 PSoC 4XX8_BLE Family Programmable System-on-Chip (PSoC) ® CYBL10573 CYBL1XX7X Family Programmable Radio-on-Chip with Bluetooth Low Energy (PRoCTM BLE) FOR ANY QUESTIONS ON THIS REPORT, PLEASE CONTACT [email protected] or via a CYLINK CRM CASE Prepared By: Josephine Pineda (JYF) Sr. Reliability Engineer Reviewed By: Rene Rodgers (RT) Sr. MTS Reliability Engineer Approved By: Don Darling (DCDA) Reliability Director Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 1 of 21 Document No.002-11674 Rev. *A ECN # 5226089 QUALIFICATION HISTORY QTP Number 083401 141901 151204 152502 153606 155203 Description of Qualification Purpose Qualification of SONOS S8DI-5R Technology in Fab 4 using PsoC 8C20066BC Krypton Device Qualification of PSoC4A-BLE 128K Device at Fab 4 using S8PIR-10R Technology Qualification of PSoC4A-BLE 256K Device Rev.** Silicon at Fab 4 using S8PIRS Technology Qualification of PSoC4A-BLE 256K Device Rev.*A Silicon at Fab 4 using S8PIRS Technology Qualification of PSoC4A-BLE 256K Device Rev.*B Silicon at Fab 4 using S8PIRS Technology Qualification of PSoC4A-BLE 256KDevice Rev.*C Silicon at Fab 4 using S8PIRS Technology Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 2 of 21 Date Comp Jan. 2009 Dec. 2014 Nov. 2015 Mar. 2016 Feb. 2016 Mar. 2016 Document No.002-11674 Rev. *A ECN # 5226089 PRODUCT DESCRIPTION (for qualification) Qualification Purpose: Qualify PSoC4A-BLE 256K Device at Fab 4 using S8PIRS Technology Marketing Part #: CY8C4128/CY8C4248/CYBL10573 PSoC 4XX8_BLE Family Programmable System-on-Chip (PSoC) ® Device Description: CYBL1XX7X Family Programmable Radio-on-Chip with Bluetooth Low Energy (PRoCTM BLE) Cypress Semiconductor Corporation –Data Communication Division Cypress Division: TECHNOLOGY/FAB PROCESS DESCRIPTION Passivation Type and Materials Metal 1: 100A Ti / 3200Al/0.5%Cu / 300A TiW Metal 2: 100A Ti / 3200Al/0.5%Cu / 350A TiW Metal 3: 150A Ti / 7200Al/0.5%Cu / 350A TiW Metal 4: 150A Ti / 7200Al/0.5%Cu / 300A TiW Metal 5: 300A Ti / 12000Al/0.5%Cu / 300A TiW NFUXOX / Nitride Passivation Thickness 1000A/6000A Number of Transistors in Device 9 252 026 Number of Gates in Device 421.82K Gate Oxide Material/Thickness SiO2/ 32A /120A Generic Process Technology/Design Rule (µ-drawn): S8PIRS Name/Location of Die Fab (prime) Facility: CMI / Minnesota Die Fab Line ID/Wafer Process ID: S8PIRS Number of Metal Layers: 5 Metal Composition: PACKAGE AVAILABILITY PACKAGE ASSEMBLY SITE FACILITY QTP REFERENCE 56-Lead QFN CML-RA QTP# 151203 76-Ball WLCSP DT-Phils QTP# 151202 68 & 76-Ball WLCSP (thin CSP) DT-Phils QTP# 160101 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 3 of 21 Document No.002-11674 Rev. *A ECN # 5226089 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: Mold Compound Name/Manufacturer: Mold Compound Flammability Rating: LQ56A 56 Quad Flat No-Lead (7x7x0.6mm) G700Y/Sumitomo UL-94 V0 Oxygen Rating Index: 54% Leadframe Material: Copper Lead Finish, Composition / Thickness: NiPdAu Die Backside Preparation Method/Metallization: Backgrind Die Separation Method: Saw Die Attach Supplier: Henkel Die Attach Material: QMI 519 Bond Diagram Designation: 001-96712 Wire Bond Method: Thermosonic Wire Material/Size: CuPd, 0.9 mil Thermal Resistance Theta JA °C/W: 17.0°C/W Package Cross Section Yes/No: Yes Assembly Process Flow: 11-21099 Name/Location of Assembly (prime) facility: CML-RA MSL Level 3 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 4 of 21 Document No.002-11674 Rev. *A ECN # 5226089 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: FN76A 76-Ball Wafer Level Chip Scale Package (WLCSP) (4.04 x 3.87 x 0.55 mm) Die Backside Preparation Method: Backgrind Die Separation Method: Saw Solder Ball/Bump Material: SAC405 Bonding Method: Bump/ RDL Bond Diagram Designation: 001-96904 Thermal Resistance Theta JA °C/W: 19.0°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-69882 Name/Location of Assembly (prime) facility: Deca Technologies - DT MSL Level 1 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: DT-Philippines Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 5 of 21 Document No.002-11674 Rev. *A ECN # 5226089 MAJOR PACKAGE INFORMATION USED IN THIS QUALIFICATION Package Designation: Package Outline, Type, or Name: FL68A, FL76A 68-Ball (3.52X3.91X0.4mm) 76-Ball (4.04X3.87X0.4mm) Wafer Level Chip Scale Package Die Backside Preparation Method: Backgrind Die Separation Method: Saw Solder Ball/Bump Material: SAC405 Bonding Method: Bump/ RDL Bond Diagram Designation: 002-10657 Thermal Resistance Theta JA °C/W: 19.6°C/W Package Cross Section Yes/No: N/A Assembly Process Flow: 001-69882 Name/Location of Assembly (prime) facility: Deca Technologies - DT MSL Level 1 Reflow Profile 260C ELECTRICAL TEST / FINISH DESCRIPTION Test Location: DT-Philippines Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 6 of 21 Document No.002-11674 Rev. *A ECN # 5226089 RELIABILITY TESTS PERFORMED PER SPECIFICATION REQUIREMENT Stress/Test Acoustic Microscopy Age Bond Strength Current Density Data Retention Dynamic Latch-up Endurance Test Electrostatic Discharge Charge Device Model (ESD-CDM) Electrostatic Discharge Human Body Model (ESD-HBM) Electrostatic Discharge Machine Model (ESD-MM) High Temperature Operating Life Early Failure Rate High Temperature Operating Life Early Failure Rate , Regulator On High Temperature Operating Life Latent Failure Rate High Temperature Steady State Life High Accelerated Saturation Test (HAST) Low Temperature Operating Life Pressure Cooker Pre/Post LFR AC/DC Char SEM Analysis Soft Error (Neutron) Static Latch-up Temperature Cycle Test Condition (Temp/Bias) J-STD-020 Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) 200C, 4HRS MIL-STD-883, Method 883-2011 Meets the Technology Device Level Reliability Specifications 150 C, non-biased JESD22-A117 and JESD22-A103 125C , 8.5V JESD78 MIL-STD-883, Method 883-1033 500V/750V/1,000V/1,250V/1,500V/1,750V JESD22-C101 1,100V/2,200V/3,300V/4,000V JESD22-A114 200V/220V/275V/330V JESD22-A115 Dynamic Operating Condition, Vcc Max = 2.1V, 150°C Dynamic Operating Condition, Vcc Max = 2.07V, 125°C JESD22-A108 Dynamic Operating Condition, Vcc Max = 5V, 125°C/150°C Dynamic Operating Condition, Vcc Max = 2.07V/6V, 125°C JESD22-A108 Dynamic Operating Condition, Vcc Max = 2.1V, 150°C Dynamic Operating Condition, Vcc Max = 2.07V, 125°C JESD22-A108 Static Operating Condition, Vcc Max= 2.1V, 150°C JESD22-A108 JEDEC STD 22-A110: 130°C, 85%RH, 5.25/5.5V Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) Dynamic Operating Condition, Vcc = 2.1V, -30°C JESD22-A108 JESD22-A102: 121C, 100%RH, 15 PSIG Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) AC/DC Critical Parameter Char at 0 hour/500/1000hrs MIL-STD-883, Method 2018 JESD89 6.6 FIT/Dev 85°C/125°C , 140mA, 85°C , 200mA, 300mA JESD78 MIL-STD-883, Method 1010, Condition C, -65°C to 150°C Precondition: JESD22 Moisture Sensitivity Level (192 Hrs., 30C, 60% RH, 260C Reflow) Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 7 of 21 Result P/F P P P P P P P P P P P P P P P P P P P P P Document No.002-11674 Rev. *A ECN # 5226089 RELIABILITY FAILURE RATE SUMMARY Stress/Test Device Tested/ Device Hours # Fails Activation Energy Thermal AF3 Failure Rate 1,536 Devices 0 N/A N/A 0 PPM 1 High Temperature Operating Life2 Long Term Failure Rate (150°C) 585,000 DHRs 0 0.7 170 High Temperature Operating Life2 Long Term Failure Rate (125°C) 368,000 DHRs 0 0.7 55 High Temperature Operating Life1 Early Failure Rate 17 FIT2 1. 2. Early Failure Rate was computed from QTP# 153606. Long Term Failure Rate was computed from QTP# 083401, QTP# 141901 and QTP# 151204. 1 Assuming an ambient temperature of 55°C and a junction temperature rise of 15°C. Chi-squared 60% estimations used to calculate the failure rate.. 3 Thermal Acceleration Factor is calculated from the Arrhenius equation 2 E 1 1 AF = exp A - k T 2 T1 where: EA =The Activation Energy of the defect mechanism. k = Boltzmann's constant = 8.62x10-5 eV/Kelvin. T1 is the junction temperature of the device under stress and T2 is the junction temperature of the device at use conditions. Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 8 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 15 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 15 0 STRESS: AGE BOND STRENGTH CY8C20566 (8C20566AC) 4827949 610844164 CML-R COMP 3 0 CY8C20466 (8C20466AC) 4804681 610822808 Malaysia-CA COMP 3 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 3 0 610828990 Malaysia-CA COMP 1 0 STRESS: CURRENT DENSITY CY8C20466 (8C20466AC) 4810486 STRESS: DATA RETENTION, PLASTIC, 150C CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 78 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 500 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 1000 78 0 STRESS: DYNAMIC LATCH-UP (125C, 8.5V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA COMP 5 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 5 0 CY8C20566 (8C20566AC) 4810486 610830786 CML-R 168 77 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 168 77 0 CY8C20566 (8C20566AC) 4827949 610844164 CML-R 168 79 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 78 0 CY8C20566 (8C20566AC) 4836589 610851914 CML-R 168 76 0 STRESS: ENDURANCE Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 9 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: ESD-CHARGE DEVICE MODEL CY8C20566 (8C20566AC) 4810486 610830371 CML-R 500 9 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 9 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 9 0 STRESS: ESD-HUMAN BODY CIRCUIT PER JESD22, METHOD A114 CY8C20566 (8C20566AC) 4810486 610830371 CML-R 2200 8 0 CY8C20566 (8C20566AC) 4810486 610830371 CML-R 3300 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 3300 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 2200 8 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 3300 3 0 CY8C20236A (8C202662A) 4126494 611143319 KOREA-L 200 5 0 CY8C20236A (8C202662A) 4125077 611143627 PHIL-MB 200 5 0 CY8C20566 (8C20566AC) 4810486 610830371 CML-R 220 6 0 CY8C20566 (8C20566AC) 4810486 610830371 CML-R 275 3 0 CY8C20566 (8C20566AC) 4810486 610830371 CML-R 330 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 220 6 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 275 3 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 330 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 220 6 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 275 3 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 330 3 0 STRESS: ESD-MACHINE MODEL STRESS: HI-ACCEL SATURATION TEST (130C, 85%RH, 5.25V), PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 128 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 256 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 128 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 10 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20566 (8C20566AC) 4827949 610844164 CML-R 48 1002 0 CY8C20566 (8C20566AC) 4815537 610835437 CML-R 48 1008 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 48 1004 1 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 48 1004 0 Read NV Latch (1) STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (150C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 48 45 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 48 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 5V, Vcc Max) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 96 45 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE (150C, 2.1V, Vcc Max) CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 80 390 0 CY8C20466 (8C20466AC) 4836589 610851747 Malaysia-CA 500 390 0 STRESS: HIGH TEMP STEADY STATE LIFE TEST (150C, 2.1V) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 80 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 80 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 168 77 0 STRESS: LOW TEMPERATURE DYNAMIC OPERATING LIFE, -30C, 2.1V CY8C20566 (8C20566AC) 4815537 610835437 CML-R 500 77 0 CY8C20566 (8C20566AC) 4835945 610848270 CML-R 500 77 0 (1) Destroyed during failure analysis Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 11 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 083401 Device Fab Lot # Assy Lot # Assy Loc Duration Samp Rej Failure Mechanism STRESS: PRESSURE COOKER TEST (121C, 100%RH), 15 Psig, PRE COND 192 HR 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 333 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 288 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 168 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 288 77 0 N/A N/A COMP 1 0 STRESS: SEM CROSS SECTION CY8C20066 (8C20066AC) 4810486 STRESS: STATIC LATCH-UP (85C, 8.25V) CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4836589 610852813 Malaysia-CA COMP 6 0 CY8C20666 (8C20666AC) 4837410 410.23.02 Promex 6 0 COMP STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4810486 610828990 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4815537 610834184 Malaysia-CA 1000 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 500 77 0 CY8C20466 (8C20466AC) 4835945 610847274 Malaysia-CA 1000 77 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 12 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 141901 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C4247LQI (8CP42478A) 4427504 611436359/60/71/7117 CML-RA COMP 80 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 500 80 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1000 80 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1500 80 0 611431352 CML-RA 168 80 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 500 9 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 750 3 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1000 5 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1250 3 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1500 3 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1750 3 0 STRESS: DATA RETENTION STRESS: ENDURANCE CY8C4247LQI (8CP42478A) 4427504 STRESS: ESD-CHARGE DEVICE MODEL STRESS: ESD-HUMAN BODY CIRCUIT PER JEDEC EIA/JESD22-A114 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1100 3 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 2200 8 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 3300 3 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 4000 3 0 611431352 CML-RA 200 5 0 STRESS: ESD-MACHINE MODEL CY8C4247LQI (8CP42478A) 4427504 STRESS: HI-ACCEL SATURATION TEST, 130C, 85%RH, 5.5V, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4247LQI (8CP42478A) 4427504 611436359/60/71/7117 CML-RA 96 28 0 CY8C4247LQI (8CP42478A) 4427504 611436359/60/71/7117 CML-RA 128 28 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REG-ON (125C, 2.07V, Vcc Max) CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 96 45 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 13 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 141901 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE ( 125C, 2.07V, Vcc Max) CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 96 438 0 CYBL10563 (7CP45563A) 611438822/8959 CML-RA 96 499 0 CY8C4247LQI (8CP42478A) 4430358 611439787 CML-RA 96 496 0 CY8C4247LQI (8CP42478A) 4438329 611441462/9788 CML-RA 96 100 0 4430079 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE ( 125C, 2.07V, Vcc Max) CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 168 200 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1000 193 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4247LQI (8CP42478A) 4427504 611436359/60/71/7117 CML-RA 168 79 0 STRESS: PRE/POST LFR CRITICAL PARAMETERS CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 0 10 0 CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA 1000 10 0 COMP 6 0 COMP 3 0 COMP 3 0 STRESS: STATIC LATCH-UP TESTING, 85C, 8.25V/2.92V, +/-140mA CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA STRESS: STATIC LATCH-UP TESTING, 85C, 9.1V/3.22V, +/-200mA CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA STRESS: STATIC LATCH-UP TESTING, 85C, 9.1V/3.22V, +/-300mA CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA STRESS: STATIC LATCH-UP TESTING, 125C, 8.25V/2.92V, +/-140mA CY8C4247LQI (8CP42478A) 4427504 611431352 CML-RA COMP 3 0 611431352 CML-RA COMP 4 0 80 0 STRESS: SOFT ERROR TEST CY8C4247LQI (8CP42478A) 4427504 STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C4247LQI (8CP42478A) 4427504 611436359/60/71/7117 CML-RA 500 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 14 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 151204 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: ACOUSTIC, MSL3 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA COMP 15 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA COMP 15 0 CYBL10562 (7CP45562A) 611506212 CML-RA COMP 15 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 500 80 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 1000 80 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA 500 80 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA 1000 80 0 CY8C4248LQI (8CP42488A) 4518732 611528802 CML-RA 500 79 0 CY8C4248LQI (8CP42488A) 4518732 611528802 CML-RA 1000 79 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 168 81 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 500 81 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA 168 82 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA 500 82 0 CY8C4248LQI (8CP42488A) 4518732 611528802 CML-RA 168 84 0 CY8C4248LQI (8CP42488A) 4518732 611528802 CML-RA 500 84 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 500 9 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 750 3 0 CY8C4247LQI (8CP42488A) 4511216 611514304 CML-RA 1000 3 0 CY8C4247LQI (8CP42488A) 4511216 611514304 CML-RA 1250 3 0 CY8C4247LQI (8CP42488A) 4511216 611514304 CML-RA 1500 3 0 4440903 STRESS: DATA RETENTION STRESS: ENDURANCE STRESS: ESD-CHARGE DEVICE MODEL Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 15 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 151204 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: ESD-HUMAN BODY CIRCUIT PER JEDEC EIA/JESD22-A114 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 1100 3 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 2200 8 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 3300 3 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 4000 3 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA 1100 3 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA 2200 8 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA 3300 3 0 CY8C4248LQI (8CP42488A) 4511217 611518965 CML-RA 4000 3 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 2.07V, Vcc Max) CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 96 1509 0 CY8C4128LQI (8CP41288A) 4511217 611518964 CML-RA 96 751 0 CYBL10573 (7CP47573A) 611518963 CML-RA 96 745 0 4511217 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE REGULATOR ON (125C, 6V, Vcc Max) CY8C4248LQI (8CP42488A) 4511216 611516036 CML-RA 96 49 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-LATENT FAILURE RATE ( 125C, 2.07V, Vcc Max) CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 168 180 0 CY8C4248LQI (8CP42488A)) 4511216 611514304 CML-RA 1000 175 0 STRESS: PRESSURE COOKER TEST, 121C, 100%RH, 15 Psig, PRE COND 192 HR 30C/60%RH, MSL3 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 168 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 16 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 151204 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism STRESS: STATIC LATCH-UP TESTING, 85C, 8.25V/2.92V, +/-140mA CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA COMP 3 0 COMP 3 0 COMP 3 0 STRESS: STATIC LATCH-UP TESTING, 85C, 9.1V/3.22V, +/-200mA CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA STRESS: STATIC LATCH-UP TESTING, 125C, 8.25V/2.92V, +/-140mA CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA STRESS: TC COND. C -65C TO 150C, PRE COND 192 HRS 30C/60%RH (MSL3) CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 500 80 0 CY8C4248LQI (8CP42488A) 4511216 611514304 CML-RA 1000 80 0 Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 17 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 152502 Device Fab Lot # Assy Lot # Fab/Ass Loc Duration Samp Rej Failure Mechanism 4535572 0 FAB 4 COMP EQUIVALENT CYBL10573 (7CP47573A) 4518732 611528903 CML-RA COMP EQUIVALENT CYBL10573 (7CP47573A) 4519073 611528904 CML-RA COMP EQUIVALENT CY8C4128LQI (8CP41288A) 4518732 611528801 CML-RA COMP EQUIVALENT CY8C4248LQI (8CP42488A) 4518732 611528802 CML-RA COMP EQUIVALENT CS8480AAT (7F47573A) 4519073 611537883 DT-PHILS COMP EQUIVALENT CS8480AAT (7F47573A) 4520736 611537882 DT-PHILS COMP EQUIVALENT CS8480AAT (7F47573A) 4520736 611537884 DT-PHILS COMP EQUIVALENT YIELD: SORT 7C47300AC YIELD: CLASS Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 18 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 153606 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 500 (250V RF) 9 0 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 750 (250V RF) 3 0 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 1000 (500V RF) 3 0 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 1250 3 0 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 1500 3 0 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 1750 3 0 STRESS: ESD-CHARGE DEVICE MODEL STRESS: ESD-HUMAN BODY CIRCUIT PER JEDEC EIA/JESD22-A114 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 1100 (250V RF) 3 0 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 2200 (500V RF) 8 0 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 3300 (750V RF) 3 0 CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 4000 (750V RF) 3 0 STRESS: HIGH TEMP DYNAMIC OPERATING LIFE-EARLY FAILURE RATE (125C, 2.07V, Vcc Max) CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA 96 1536 0 COMP 6 0 COMP 3 0 COMP 3 0 COMP 3 0 STRESS: STATIC LATCH-UP TESTING, 85C, 8.25V/2.92V, +/-140mA CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA STRESS: STATIC LATCH-UP TESTING, 85C, 9.1V/3.22V, +/-200mA CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA STRESS: STATIC LATCH-UP TESTING, 85C, 9.1V/3.22V, +/-300mA CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA STRESS: STATIC LATCH-UP TESTING, 125C, 8.25V/2.92V, +/-140mA CY8C4248LQI (8CP47600A) 4538121 611535844 CML-RA Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 19 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Reliability Test Data QTP #: 155203 Device Fab Lot # Assy Lot # Ass Loc Duration Samp Rej Failure Mechanism 4541394 611605178 CML-RA COMP EQUIVALENT CY8C4248LQI (8CP47600A) 4541394 611605178 CML-RA COMP EQUIVALENT CY8C4248LQI (8CP47600A) 4541394 611605179 CML-RA COMP EQUIVALENT CYBL11573 (7CP47500A) 4541394 611605182 CML-RA COMP EQUIVALENT CYBL11171 (7CP47500A) 4541394 611605181 CML-RA COMP EQUIVALENT CY8C4128LQI (8CP47600A) 4541394 611605177 CML-RA COMP EQUIVALENT CY8C4128LQI (8CP47600A) 4541394 611605180 CML-RA COMP EQUIVALENT CY8C4248FNI (8F47600A) 4541394 611604595 DT-PHILS COMP EQUIVALENT YIELD: SORT CY8C4248LQI (8CP47600A) YIELD: CLASS Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 20 of 21 Document No.002-11674 Rev. *A ECN # 5226089 Document History Page Document Title: Document Number: Rev. ECN No. ** 5175317 *A 5226089 QTP# 151204: PSOC4A-BLE 256K DEVICE FAMILY S8PIRS TECHNOLOGY, FAB 4 (CMI) 002-11674 Orig. of Change JYF JYF Description of Change Initial spec release. Added PSoC4A-BLE 256K Rev.*A/B/C Silicon qualification data (QTP# 152502/153606/155203). Company Confidential A printed copy of this document is considered uncontrolled. Refer to online copy for latest revision. Page 21 of 21