BAS385 Vishay Semiconductors Small Signal Schottky Diode Features • Integrated protection ring against static discharge • Very low forward voltage • AEC-Q101 qualified • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC • Halogen-free according to IEC 61249-2-21 definition 9612315 Applications Mechanical Data • Applications where a very low forward voltage is required Case: MicroMELF Weight: approx. 12 mg Cathode band color: black Packaging codes/options: TR3/10 k per 13" reel (8 mm tape), 10 k/box TR/2.5 k per 7" reel (8 mm tape), 12.5 k/box Parts Table Part Type differentiation Ordering code Remarks VR = 30 V BAS385-TR3 or BAS385-TR Tape and Reel BAS385 Absolute Maximum Ratings Tamb = 25 °C, unless otherwise specified Parameter Test condition Reverse voltage Symbol Value Unit VR 30 V tp = 10 ms IFSM 5 A tp ≤ 1 s IFRM 300 mA IF 200 mA IFAV 200 mA Test condition Symbol Value Unit on PC board 50 mm x 50 mm x 1.6 mm RthJA 320 K/W Peak forward surge current Repetitive peak forward current Forward continuous current VRWM = 25 V Average forward current Thermal Characteristics Tamb = 25 °C, unless otherwise specified Parameter Junction to ambient air Junction temperature Storage temperature range Document Number 85504 Rev. 2.0, 09-Jun-10 Tj 125 °C Tstg - 65 to + 150 °C For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] www.vishay.com 1 BAS385 Vishay Semiconductors Electrical Characteristics Tamb = 25 °C, unless otherwise specified Parameter Test condition Symbol Max. Unit IF = 0.1 mA VF 240 mV IF = 1 mA VF 320 mV IF = 10 mA VF 400 mV IF = 30 mA VF 500 mV Forward voltage Reverse current Diode capacitance Min. Typ. IF = 100 mA VF 800 mV VR = 25 V, tp = 300 µs IR 2.3 µA VR = 1 V, f = 1 MHz CD 10 pF Typical Characteristics 200 1000 VR = 30 V 180 160 140 RthJA = 540 kW 120 PR - Limit at 100 % VR 100 80 PR - Limit at 80 % VR 60 40 Tj = 125 °C IF - Forward Current (mA) PR - Reverse Power Dissipation (mW) Tamb = 25 °C, unless otherwise specified 100 Tj = 25 °C 10 1 20 0 0.1 25 50 75 100 125 150 Tj - Junction Temperature (°C) 15822 0 Figure 1. Max. Reverse Power Dissipation vs. Junction Temperature 1.0 1.5 Figure 3. Forward Current vs. Forward Voltage 1000 10 CD - Diode Capacitance (pF) IR - Reverse Current (µA) 0.5 VF - Forward Voltage (V) 15824 VR = VRRM 100 10 f = 1 MHz 9 8 7 6 5 4 3 2 1 0 1 25 15823 50 75 100 125 Tj - Junction Temperature (°C) Figure 2. Reverse Current vs. Junction Temperature www.vishay.com 2 0.1 150 15825 1 10 100 VR - Reverse Voltage (V) Figure 4. Diode Capacitance vs. Reverse Voltage For technical questions within your region, please contact one of the following: Document Number 85504 [email protected], [email protected], [email protected] Rev. 2.0, 09-Jun-10 BAS385 Vishay Semiconductors 0.71 1.3 1.27 9.9 0.152 10 25 0.355 2.5 24 95 10329 Figure 5. Board for RthJA definition (in mm) Package Dimensions in millimeters (inches): MicroMELF 0.6 (0.024) * 1.1 (0.043) 1.2 (0.047) < 1. surface plan gl 1 (0.039) 35 ( as 0.0 s 53 ) surface plan Cathode indification 0.25 (0.010) 0.15 (0.006) > R2.5 (0.098) glass 2 (0.079) 1.8 (0.071) * The gap between plug and glass can be either on cathode or anode side Foot print recommendation: Wave soldering 2.4 (0.094) 2.8 (0.110) 0.8 (0.031) 0.9 (0.035) 0.9 (0.035) 1.4 (0.055) 1.2 (0.047) 0.8 (0.031) Reflow soldering 0.8 (0.031) 1 (0.039) Created - Date: 26.July.1996 Rev. 13 - Date: 07.June.2006 Document no.:6.560-5007.01-4 96 12072 Document Number 85504 Rev. 2.0, 09-Jun-10 For technical questions within your region, please contact one of the following: [email protected], [email protected], [email protected] www.vishay.com 3 MiniMELF SOD80 Vishay Semiconductors PACKAGE DIMENSIONS in millimeters (inches) 1.6 (0.063) 1.4 (0.055) Cathode indification * 0.47 (0.019) max. 3.7 (0.146) 3.3 (0.130) * The gap between plug and glass can be either on cathode or anode side Foot print recommendation: 1.25 (0.49) min. 2 (0.079) min. 2.5 (0.098) max. 5 (0.197) ref. Document no.:6.560-5005.01-4 Rev. 8 - Date: 07.June.2006 96 12070 Document Number: 84024 Rev. 1.3, 12-Jan-07 For technical questions, contact: [email protected] www.vishay.com 21 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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