TB6562ANG/AFG TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic TB6562ANG/AFG Dual Full-Bridge Driver IC for Stepping Motors The TB6562ANG/AFG is a 2-phase bipolar stepping motor driver that contains DMOS transistors in the output stage. The driver achieves high efficiency through the use of low ON-resistance DMOS transistors and PWM current control circuitry. TB6562ANG Features 2-phase / 1–2-phase / W 1–2-phase excitation PWM current control Power supply voltage: 40 V (max) Output current: 1.5 A (max) TB6562AFG Low ON-resistance: 1.5 Ω (upper and lower transistors/typ.) Power-saving function Overcurrent protection: Ilim ＝ 2.5 A (typ.) Thermal shutdown Package: TB6562ANG; SDIP24-P-300-1.78 TB6562ANG; SSOP30-P-375-1.00 SSOP30-P-375-1.00 Weight: SDIP24-P-300-1.78: 1.62 g (typ.) SSOP30-P-375-1.00: 0.63 g (typ.) TB6562ANG/AFG is lead-free (Pb-free) product. The following conditions apply to solderability: *Solderability 1. Use of Sn-37Pb solder bath *solder bath temperature = 230˚C *dipping time = 5 seconds *number of times = once *use of R-type flux 2. Use of Sn-3.0Ag-0.5Cu solder bath *solder bath temperature = 245˚C *dipping time = 5 seconds *number of times = once *use of R-type flux This product has a MOS structure and is sensitive to electrostatic discharge. When handling the product, ensure that the environment is protected against electrostatic discharge by using an earth strap, a conductive mat and an ionizer. Ensure also that the ambient temperature and relative humidity are maintained at reasonable levels. Special care should be taken with the following pins, which are vulnerable to surge current. Pins with low surge withstand capability: TB6562ANG: pins 10, 15 TB6562AFG: pins 13, 18 1 2007-3-22 TB6562ANG/AFG Block Diagram Some functional blocks, circuits, or constants may be omitted or simplified in the block diagram for explanatory purposes. < TB6562ANG > GND Vreg SB OSC VCC OUT2A Vcc OUT1A OUT2B Vcc OUT1B 24 2 3 22 23 11 7 8 14 18 17 GND 13 OSC 5V Waveform squaring circuit Thermal shutdown Control logic Decoder 1 4 5 6 21 20 19 9 10 16 15 12 GND Phase A X1A X2A Phase B X1B X2B VrefA RSA VrefB RSB GND < TB6562AFG > GND Vreg SB OSC VCC OUT2A Vcc OUT1A OUT2B Vcc OUT1B 30 2 3 28 29 14 10 11 17 21 20 16, 22, 23, 24 GND OSC 5V Waveform squaring circuit Thermal shutdown Control logic Decoder 1 4 5 6 27 26 25 12 13 19 18 7, 8, 9, 15 GND Phase A X1A X2A Phase B X1B X2B VrefA RSA VrefB RSB GND 2 2007-3-22 TB6562ANG/AFG Pin Description < TB6562ANG > Pin No. Function Description Symbol Remarks 1 GND Ground pin 2 Vreg 5 V output pin Connect a capacitor between this pin and the GND pin. 3 SB Standby pin H: start, L: Standby, Built-in pull down resistance of 100kΩ(typ.) 4 Phase A Rotation direction control pin (Ch. A) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 5 X1A Input pin used to set output current level (Ch. A) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 6 X2A Input pin used to set output current level (Ch. A) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 7 Vcc Power supply voltage input pin Vcc (opr) = 10 V to 34 V 8 OUT1A Output pin 1 (Ch. A) Connect to a motor coil pin. 9 VrefA Input pin for external reference voltage (Ch. A) 10 RSA Output current detection resistor connection pin (Ch. A). 11 OUT2A Output pin 2 (Ch. A) 12 GND Ground pin 13 GND Ground pin 14 OUT2B Output pin 2 (Ch. B) 15 RSB Output current detection resistor connection pin (Ch. B) 16 VrefB Input pin for external reference voltage (Ch. B) 17 OUT1B Output pin 1 (Ch. B) Connect to a motor coil pin. 18 Vcc Power supply voltage input pin Vcc (opr) = 10 V to 34 V 19 X2B Input pin used to set output current level (Ch. B) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 20 X1B Input pin used to set output current level (Ch. B) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 21 Phase B Rotation direction control pin (Ch. B) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 22 OSC External capacitor pin for triangular-wave oscillation 23 VCC Power supply voltage input pin 24 GND Ground pin Connect to a motor coil pin. Connect to a motor coil pin. VCC (opr) = 10 V to 34 V <Top View> TB6562ANG TB6562AFG GND 1 30 GND Vreg 2 29 Vcc SB 3 28 OSC Phase A 4 27 Phase B Phase B X1A 5 26 X1B 20 X1B X2A 6 25 X2B 6 19 X2B GND 7 24 GND Vcc 7 18 Vcc GND 8 23 GND GND 17 22 GND 8 9 OUT1A OUT1B Vcc 10 21 Vcc VrefA 9 16 VrefB OUT1A 11 20 OUT1B RSA 10 15 RSB VrefA 12 19 VrefB OUT2A 11 14 OUT2B RSA 13 18 RSB GND 12 13 GND OUT2A 14 17 OUT2B GND 15 16 GND GND 1 24 GND Vreg 2 23 Vcc SB 3 22 OSC Phase A 4 21 X1A 5 X2A 3 2007-3-22 TB6562ANG/AFG < TB6562AFG > Pin No. Symbol Function Description Remarks 1 GND Ground pin 2 Vreg 5 V output pin Connect a capacitor between this pin and the GND pin. 3 SB Standby pin H: start, L: Standby, Built-in pull down resistance of 100kΩ(typ.) 4 Phase A Rotation direction control pin (Ch. A) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 5 X1A Input pin used to set output current level (Ch. A) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 6 X2A Input pin used to set output current level (Ch. A) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 7 GND Ground pin 8 GND Ground pin 9 GND Ground pin 10 Vcc Power supply voltage input pin Vcc (opr) = 10 V to 34 V 11 OUT1A Output pin 1 (Ch. A) Connect to a motor coil pin. 12 VrefA Reference voltage external set pin (Ch. A) 13 RSA Resistance connect pin for detecting output current (Ch. A) 14 OUT2A Output pin 2 (Ch. A) 15 GND Ground pin 16 GND Ground pin 17 OUT2B Output pin 2 (Ch. B) 18 RSB Output current detection resistor connection pin (Ch. B) 19 VrefB Input pin for external reference voltage (Ch. B) 20 OUT1B Output pin 1 (Ch. B) Connect to a motor coil pin. 21 Vcc Power supply voltage input pin Vcc (opr) = 10 V to 34 V 22 GND Ground pin 23 GND Ground pin 24 GND Ground pin 25 X2B Input pin used to set output current level (Ch. B) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 26 X1B Input pin used to set output current level (Ch. B) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 27 Phase B Rotation direction control pin (Ch. B) Apply a 0 V / 5 V signal, Built-in pull down resistance of 100kΩ(typ.) 28 OSC External capacitor pin for triangular-wave oscillation 29 VCC Power supply voltage input pin 30 GND Ground pin Connect to a motor coil pin. Connect to a motor coil pin. VCC (opr) = 10 V to 34 V 4 2007-3-22 TB6562ANG/AFG Absolute Maximum Ratings (Ta = 25°C) Characteristic Symbol Rating Unit VCC 40 V Output voltage Vo 40 V Output current IO (Peak) Power supply voltage 1.5 (Note 1) −0.2 to 5.5 A Input voltage Vin Power dissipation PD Operating temperature Topr −20 to 85 °C Storage temperature Tstg −55 to 150 °C Junction temperature Tjmax 150 °C 2.5 (Note 2) V W Note 1: Output current may be controlled by excitation mode, ambient temperature, or heatsink. When designing a circuit, ensure that the maximum junction temperature, TjMAX = 150°C, is not exceeded when the IC is used. Avoid using the IC in abnormal conditions that would cause the Tj to exceed 150°C, even though the heat protection circuit of the IC will continue to operate in such conditions. Note 2: When mounted on a board (50 mm × 50 mm × 1.6 mm, Cu area: 50%) The absolute maximum ratings of a semiconductor device are a set of specified parameter values that must not be exceeded during operation, even for an instant. If any of these ratings are exceeded during operation, the electrical characteristics of the device may be irreparably altered, in which case the reliability and lifetime of the device can no longer be guaranteed. Moreover, any exceeding of the ratings during operation may cause breakdown, damage and/or degradation in other equipment. Applications using the device should be designed so that no maximum rating will ever be exceeded under any operating condition. Before using, creating and/or producing designs, refer to and comply with the precautions and conditions set forth in this document. Operating Range (Ta = –20 to 85°C) Characteristic Symbol Rating Unit VCC 10 to 34 V Input voltage Vin 0 to 5 V Vref voltage Vref 0.5 to 7.0 V PWM frequency fpwm 15 to 80 kHz fosc 45 to 400 kHz Power supply voltage Triangular-wave oscillation frequency 5 2007-3-22 TB6562ANG/AFG Electrical Characteristics (VCC = 24 V, Ta = 25°C) Characteristic Symbol Test Circuit ICC2 Control circuit (Note 1) Input hysteresis voltage Input current Input voltage Standby circuit Input hysteresis voltage Input current Output ON-resistance Output leakage current Diode forward voltage VINH VINL VIN (HYS) IINH IINL VINSH VINSL VIN (HYS) IINSH IINSL Ron (U + L) IL (U) IL (L) VF (U) VF (L) Typ. Max ⎯ 6.5 10 ⎯ 7.0 12 ⎯ 2.0 4.0 ⎯ 2 ⎯ 5.5 ⎯ -0.2 ⎯ 0.8 (Target spec.) ⎯ 0.4 ⎯ VIN = 5 V 30 50 75 VIN = 0 V ⎯ ⎯ 5 ⎯ 2.3 ⎯ 5.5 ⎯ –0.2 ⎯ 0.8 (Target spec.) ⎯ 0.4 ⎯ VIN = 5 V 30 50 75 VIN = 0 V ⎯ ⎯ 5 IO = 0.2 A ⎯ 1.5 2.0 IO = 1.5 A ⎯ 1.5 2.0 VCC = 40 V ⎯ ⎯ 10 VCC = 40 V ⎯ ⎯ 10 Output = Open ⎯ XT1A = XT2A = L, XT1B = XT2B = L Output = Open ICC3 Input voltage Min XT1A = XT2A = H, XT1B = XT2B = H ICC1 Supply current Test Condition Standby mode ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ ⎯ V μA Ω μA ⎯ 1.3 2.0 1.3 2.0 4.75 5 5.25 V ⎯ 5 10 μA 0.45 0.5 0.55 0.28 0.33 0.38 0.12 0.17 0.22 88 110 132 kHz ⎯ 160 ⎯ °C Iref ⎯ Vref = 0.5 V Vref (1/10) ⎯ Vref (1/15) ⎯ Vref (1/30) ⎯ Triangular-wave oscillation frequency fosc ⎯ Thermal shutdown circuit operating temperature TSD ⎯ Current limit voltage μA ⎯ 1 mA Vref circuit V IO = 1.5 A ⎯ Input current mA IO = 1.5 A Vreg Internal reference voltage Unit X1 = X2 = L Vref = 5 V X1 = L, X2 = H Vref = 5 V X1 = H, X2 = L Vref ＝5 V C = 4700 pF (Target spec.) V V Note 1: Phase, X1 and X2 pins 6 2007-3-22 TB6562ANG/AFG Truth Tables < 2-phase excitation > (*) Io: OUT1 → OUT2; + current OUT2 → OUT1; − current Phase A Phase B Input Phase A Output X1A X2A H L L L L H Input Output IO(A) Phase B X1B X2B IO (B) L 100% H L L 100% L −100% H L L 100% L L −100% L L L −100% L L 100% L L L −100% < 1–2-phase excitation > Phase A Phase B Input Output Input Output Phase A X1A X2A IO (A) Phase B X1B X2B IO (B) H L L 100% H L L 100% X H H 0% H L L 100% L L L −100% H L L 100% L L L −100% X H H 0% L L L −100% L L L −100% X H H 0% L L L −100% H L L 100% L L L −100% H L L 100% X H H 0% < W 1–2-phase excitation > Phase A Phase B Input Output Input Output Phase A X1A X2A IO (A) Phase B X1B X2B IO (B) X H H 0% L L L −100% H H L 33.3% L L L −100% H L H 66.7% L L H −66.7% H L L 100% L H L −33.3% H L L 100% X H H 0% H L L 100% H H L 33.3% H H L 33.3% H L H 66.7% H L H 66.7% H L L 100% X H H 0% H L L 100% L H L −33.3% H L L 100% L L H −66.7% H L H 66.7% L L L −100% H H L 33.3% L L L −100% X H H 0% L L L −100% L H L −33.3% L L H −66.7% L L H −66.7% L H L −33.3% L L L −100% 7 2007-3-22 TB6562ANG/AFG Timing Charts Timing charts may be simplified for explanatory purposes. < 2-phase excitation > IO (A) IO (B) 100％ −100％ 100％ −100％ Phase A H L H X1A L H X2A L Phase B H L H X1B L H X2B L (*) Io: OUT1→OUT2; + current OUT2→OUT1; − current < 1–2-phase excitation > 100％ IO (A) 0% −100％ 100％ IO (B) 0% −100％ Phase A H L X1A X2A Phase B X1B X2B H L H L H L H L H L (*) Io: OUT1→OUT2; + current OUT2→OUT1; − current 8 2007-3-22 TB6562ANG/AFG < W 1–2-phase excitation > 100％ 66.7% 33.3% IO (A) 0% −33.3％ −66.7% −100% 100％ 66.7% 33.3% IO (B) 0% −33.3％ −66.7% −100% Phase A H L X1A X2A Phase B X1B X2B H L H L H L H L H L (*) Io: OUT1→OUT2; + current OUT2→OUT1; − current 9 2007-3-22 TB6562ANG/AFG PWM Current Control The IC enters CW (CCW) mode and short brake mode alternately during PWM current control. To prevent shoot-through current caused by simultaneous conduction of upper and lower transistors in the output stage, a dead time is internally generated for 300 ns (target spec) when the upper and lower transistors are being switched. Therefore synchronous rectification for high efficiency in PWM current control can be achieved without an off-time generated via an external input. Even for toggling between CW and CCW modes, and CW (CCW) and short brake modes, no off-time is required due to the internally generated dead time. VCC OUT1 VCC M OUT1 VCC M OUT1 RS RS RS PWM ON → OFF t2 = 300 ns (typ.) PWM ON t1 PWM OFF t3 VCC OUT1 M VCC OUT1 M M RS RS PWM OFF → ON t4 = 300 ns (typ.) PWM ON t5 10 2007-3-22 TB6562ANG/AFG Constant current regulation When VRS reaches the reference voltage (Vref), the IC enters discharge mode. After four clock signals are generated from the oscillator, the IC moves from discharge mode to charge mode. Vref VRS OSC Internal clock Vref VRS Charge Discharge Discharge GND 11 2007-3-22 TB6562ANG/AFG Transition from charge mode to discharge mode If VRS > Vref after four clock signals in charge mode, the IC again enters discharge mode. After a further four clock signals in discharge mode, VRS is compared with Vref. If VRS < Vref, the IC operates in charge mode until VRS reaches Vref. OSC Internal clock Vref VRS Discharge Discharge Charge Charge GND Transition from discharge mode to charge mode Even when the reference voltage has risen, discharge mode lasts for four clock signals and is then toggled to charge mode. OSC Internal clock Vref VRS Charge Discharge Discharge GND Timing charts may be simplified for explanatory purposes. Internal oscillation frequency (fosc) The internal oscillation frequency is approximated by the formula below: ｆosc = 1 / (0.523 × (Cosc × 3700 ＋ Cosc × 600)). 12 2007-3-22 TB6562ANG/AFG Reference Voltage Generator The current value at 100% is determined by applying voltage at the Vref pin. The value can be calculated as follows: IO (100％) = Vref × 1/10 × 1/RS[A] (X1 = X2 = L) VCC Control circuit OUT1 X1 X2 OUT2 M Decoder IO 1/10 1/15 1/30 RS Vref IO Thermal Shutdown Circuit (TSD) The IC incorporates a thermal shutdown circuit. When the junction temperature (Tj) reaches 160°C (typ.), the output transistors are turned off. After 50 μs (typ.), the output transistors are turned on automatically. The IC has 40°C temperature hysteresis. TSD = 160°C (target spec) ΔTSD = 40°C (target spec) Overcurrent Protection Circuit (ISD) The IC incorporates an overcurrent protection circuit to detect voltage flowing through the output transistors. The overcurrent threshold is 2.5 A (typ.). Currents flowing through the eight output transistors are monitored individually. If overcurrent is detected in at least one of the transistors, all transistors are turned off. The IC incorporates a timer to count the 50 μs (typ.) for which the transistors are off. After the 50 μs, the transistors are turned on automatically. If an overcurrent occurs again, the same operation is repeated. To prevent false detection due to glitches, the circuit turns off the transistors only when current exceeding the overcurrent threshold flows for 10 μs or longer. ILIM Output current 0 50 μs (typ.) 10 μs (typ.) 50 μs (typ.) 10 μs (typ.) Not detected The target specification for the overcurrent limiter value (overcurrent threshold) is 2.5 A (typ.), and varies in a range from approximately 1.5 A to 3.5 A. These protection functions are intended only as a temporary means of preventing output short circuits or other abnormal conditions and are not guaranteed to prevent damage to the IC. If the guaranteed operating ranges of this product are exceeded, these protection features may not operate and some output short circuits may result in the IC being damaged. The overcurrent protection feature is intended to protect the IC from temporary short circuits only. Short circuits persisting over long periods may cause excessive stress and damage the IC. Systems should be configured so that any overcurrent condition will be eliminated as soon as possible. 13 2007-3-22 TB6562ANG/AFG Application Circuit The application circuit below is for reference only and requires thorough evaluation at the mass production design stage. In furnishing this example of an application circuit, Toshiba does not grant the use of any industrial property rights. (Note 1) C1 C2 C3 2 Vreg VDD (Note 4) 28 OSC 10 VCC 21 Vcc 24 V (Note 2) 5V 29 Vcc PORT1 3 SB OUT1A 11 PORT2 4 Phase A OUT2A 14 PORT3 5 XA1 PORT4 6 XA2 PORT5 27 Phase B PORT6 26 XB1 PORT7 25 XB2 Stepping motor R1 RSA 13 TB6562ANG/AFG OUT1B 20 OUT2B 17 PORT8 PORT9 RSB 18 VrefA VrefB 12 19 GND R1 GND 1, 7, 8, 9, 15, 16, 22, 23 24, 30 C4 R2 DAC output signal Note 1: A power supply capacitor should be connected between VCC and RSA (RSB), and as close as possible to the IC. Note 2: C2 and C3 should be connected as close as possible to S-GND. Note 3: In powering on, set the IC as follows: SB = Low (standby mode) or XA1 = XA2 = XB1 = XB2 = High (current value = 0%) Note 4: When the Vref is being changed, a DAC output can be connected directly to the Vref pin. Note 5: The VCC pins (pin 10, pin 21, pin 29) should be shorted externally. Note 6: Connect the capacitor C4 to the Vref to reduce the switching noise. 14 2007-3-22 TB6562ANG/AFG Package Dimensions Weight: 1.62 g (typ.) 15 2007-3-22 TB6562ANG/AFG Weight: 0.63 g (typ.) 16 2007-3-22 TB6562ANG/AFG Notes on Contents 1. Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. 17 2007-3-22 TB6562ANG/AFG Points to remember on handling of ICs (1) Over current Protection Circuit Over current protection circuits (referred to as current limiter circuits) do not necessarily protect ICs under all circumstances. If the Over current protection circuits operate against the over current, clear the over current status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the over current protection circuit to not operate properly or IC breakdown before operation. In addition, depending on the method of use and usage conditions, if over current continues to flow for a long time after operation, the IC may generate heat resulting in breakdown. (2) Thermal Shutdown Circuit Thermal shutdown circuits do not necessarily protect ICs under all circumstances. If the thermal shutdown circuits operate against the over temperature, clear the heat generation status immediately. Depending on the method of use and usage conditions, such as exceeding absolute maximum ratings can cause the thermal shutdown circuit to not operate properly or IC breakdown before operation. (3) Heat Radiation Design In using an IC with large current flow such as power amp, regulator or driver, please design the device so that heat is appropriately radiated, not to exceed the specified junction temperature (TJ) at any time and condition. These ICs generate heat even during normal use. An inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In addition, please design the device taking into considerate the effect of IC heat radiation with peripheral components. (4) Back-EMF When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power supply is small, the device’s motor power supply and output pins might be exposed to conditions beyond maximum ratings. To avoid this problem, take the effect of back-EMF into consideration in system design. 18 2007-3-22 TB6562ANG/AFG RESTRICTIONS ON PRODUCT USE 070122EBA_R6 • The information contained herein is subject to change without notice. 021023_D • TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. 021023_A • The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer’s own risk. 021023_B • The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q • The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patents or other rights of TOSHIBA or the third parties. 070122_C • Please use this product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations. 060819_AF • The products described in this document are subject to foreign exchange and foreign trade control laws. 060925_E 19 2007-3-22